508597 五、發明說明（1 ) 發明之領域 本發明係關於一種雜訊濾波器，用來限制電磁噪音，並 且特別是關於一種基板安裝式共模抗流線圈及其製造方法 〇 先前技術說明 因爲電氣設備尺寸逐漸變小及增加的處理頻率，抗電磁 干擾（EMI )之各種措施的重要性日漸增加。阻抗元件一般 遮蔽頻率雜訊做爲阻抗特徵用來抵抗電磁干擾之措施。 繞線式及層式共模抗流線圈被用來做爲電磁噪音濾波器 〇 繞線式以較薄的線等而達成小型化，因而會增加了缺陷 。此外，節距等之變化造成共振頻率及電感之錯誤，並且 調整很困難。故製造亦很困難。 再者，在層式之情況，圖案已預先決定，由於厚度等的 變動而造成電感的誤差。而且，由於爲層狀構造，製造亦 很困難。 發明之扼要說明 本發明之一個目的在容易且經濟地提供在基體上具有兩 個互相電氣絕緣螺旋導體之共模抗流線圈，共模抗流線圈 有高Q-値，並且其共振頻率及電感的變化很小。 本發明之另一個目的在容易且經濟地提供在基體上具有 兩個互相電氣絕緣螺旋導電體之共模抗流線圈’共模抗流 線圈在共模時有高阻抗，並且其共振頻率及電感的變化很 小。 508597 五、發明說明（2) 本發明之另一個目的在提供製造上述共模抗流線圈的方 法。 依照本發明之一個觀點，提供一共模抗流線圏’其具有 在基體上彼此互相電氣絕緣之第一及第二螺旋導電層元件 。此基體由磁性或介電材料製成。第一及第二螺旋導電層 元件中之至少一者與基體表面緊密地接觸而形成。 依照本發明之另一觀點，提供有製造上述共模抗流線圏 的方法。此方法之特徵爲，在至少一個導電層元件被形成 在基體表面上之後，兩個螺旋導電層元件在導電層被移除 以形成溝槽時，由包括雷射修整，噴砂及水噴射製程中至 少一個製程形成。 再者，依照本發明之又另一觀點，提供有製造上述共模 抗流線圈的方法。此方法之特徵爲，在以網印法形成兩個 螺旋導電層及一個絕緣層之後，黏著劑被移除，並且進行 烤乾，因而形成線圈。 再者，依照本發明之又再另一個觀點，提供有製造上述 任何種共模抗流線圏的方法。此方法之特徵爲，在與基體 作緊密接觸而形成之螺旋導電層部份之輸入及輸出端子， 是以具有光阻之蝕刻法形成，直到構成螺旋導電層部份之 導電層曝露出來爲止。 圖示之簡單說明 第1圖是用來解釋本發明第一實施例共模抗流線圈之前 視圖； -4 - 508597 五、發明說明（3) 第2圖是用來解釋第1圖共模抗流線圈之終端產品之視 圖； 第3A圖是本發明第二實施例之共模抗流線圈之基體的 前視圖； 第3B圖是第3A圖中基體的側視圖； 第4A圖是本發明第三實施例之共模抗流線圈之基體的 前視圖； 第4B圖是第4A圖中基體的側視圖； 第5圖是用來解釋本發明第六實施例之雙層螺旋共模抗 流線圈之前視圖； 第6圖是沿第5圖箭號AA所作之橫剖面圖用來解釋第5 圖中之雙層螺旋導電部； 第7圖是用來解釋第5圖之共模抗流線圈之終端產品之 圖； 第8圖是用來解釋本發明第九實施例之共模抗流線圈之 透視圖； 第9圖是用來解釋第8圖之共模抗流線圏之螺旋導電部 之橫剖面圖； 第1 0圖是用來解釋第8圖之共模抗流線圈之終端產品 之視圖。 本發明較住眚施例之詳紐說明 例1 參照第1圖及第2圖，本發明第一實施例共模抗流線圈 508597 五、發明說明（4) 將根據製程解釋之。 導電材料塗覆在由介電或磁性材料製成的稜柱形基體1 0 之表面。使用的導電材料可由將銅，鋁，銀等以電鍍，濺 鍍或沉積而得知。 使用的導電材料亦可由，在塗上由導電粉末及結合劑製 成的導電糊狀膏，除去結合劑及然後將糊狀膏烤乾而被形 成。 關於基體10之形狀，端子部11及12可爲稜柱狀，及 一螺旋導電部17可爲多邊形柱，圓柱形等，其如隨後於 第3A，3B，4A及4B圖之第二實施例及第三實施例解釋者。 在稜柱狀，邊緣可有R。如第1圖中粗黑線所顯示者， 在這些基體10上的螺旋溝14a，14b可分兩個階段由雷射 整修，噴砂或水噴射而形成，因而在基體1 0之表面交錯 地形成兩個螺旋導電層元件15及16。一個螺旋導電層元 件被稱爲第一螺旋導電層元件15,並且被顯示在第1圖爲 劃剖面線的部份。另一個螺旋導電層元件被稱爲第二螺旋 導電層元件1 6，其在第1圖中爲未劃剖面線部份。 在兩端的端子部11及12以設有溝13而被區分成四個 端子 20,21，22 及 23。 參照第2圖，絕緣樹脂24被塗覆在端子部1 1及12之 間的螺旋導電部1 7之整個表面上。隨後，對四個端子 20，21，22及23執行焊料電鍍，並且端子部之兩端18及19 從第1圖之兩端上之線上被切離。結果，提供了共模抗流 508597 五、發明說明（5 ) 線圈1 ’其具有彼此絕緣之第一及第二螺旋導電層元件1 5 及16之兩個交錯的螺旋導電層。 隨後’本發明例1之共模抗流線圈的製造將進一步作詳 細解釋。 導電層以銅電鍍在由μ’ = 30 之磁性材料製成 1·6χ1·0><1·0毫米之柱體基體10上15微米而形成。在此 已電鍍基體10上，溝14a，14b是以雷射整修而形成螺旋 狀。首先，基體10以垂直雷射之方向移動，因而在基體 端子部1 1以縱向及朝向基體之角部形成溝1 3。隨後，當 基體10被移位時，它亦垂直於移位方向而轉動。因而第 一螺旋導電層元件1 5被形成在基體1 0上。然後，轉動在 相對的端子部1 2處被停止，以切割導電層。在切割後， 基體10被轉動90°成 180° ，因而如上述由雷射整 修而形成第二螺旋導電層元件1 6。在端子部1 1及1 2之間 的螺旋導電部1 7之整個表面上，絕緣樹脂24如第2圖所 示被塗上。四個端子20,21，22及23被電鍍上焊料’並且 端子處之兩端1 8及1 9從兩端之線被切斷。因而’形成共 模抗流線圈1，它具有彼此絕緣之交錯的第一及第二螺旋 導電層元件1 5及1 6。 一*個阻抗分析器在共模處測量共模抗流線圈之阻抗。此 阻抗在500百萬赫茲時爲300歐姆。 例2 參照第3 A及3 B圖，例2之共模抗流線圈與例1之共模 抗流線圈有相同的構造’但基體有不同的形狀。即使基體 508597 五、 發明說明（6) 30 之螺旋導電部17’爲如例 2所示之多邊形柱，線圈 可 被 形成如例1及2中所示者。 一個阻抗分析器在共模情 況 測 量 例2之共模抗流線圈之阻 抗。此阻抗在500百萬赫 茲 時 爲 2 9 0歐姆。 趾 3 如第4A及4B圖所示之例 3的共模抗流線圈與例1 之共 模 抗流線圏有相同的構造， 但基體有不同的形狀。即 使 基 體 30’之螺旋導電部17”爲如例3所示之圓柱形，線 圈 可 被 形成如例1中所示者。一 個阻抗分析器在共模情況 測 量 例 3之共模抗流線圈之阻抗 。此阻抗在500百萬赫茲 時 爲 250歐姆。 例 4 螺旋導電部在例1由雷射 整修而形成，但是在例4 中 則 以 噴砂形成。可獲得與例1 中相同的共模抗流線圈。 例 5 螺旋導電部在例1由雷射 •整修共模抗流線圈而形成 但 是 在例5則以水噴射形成 。可獲得與例1中相同的 共 模 抗 流線圈。 例 6 本發明例6之共模抗流線 圏有與第1及2圖所顯示的例 1 之共模抗流線圈相同的構 造，但以不同絕緣體予以 被 覆 0 因而，此例之共模抗流線 圈將參照第1及2圖而解〗 〇 參照第1及2圖，在由介 電或磁性材料製成的基體： -8- 10 上 508597 五、發明說明（7) ，彼此絕緣之螺旋電極與基體1 0緊密接觸之方式而被形 成。所使用之導電材料可由將銅，鋁，銀或等以電鍍，濺 鍍或沉積而被塗加在表面上。所使用的導電材料亦可由， 在塗上導電粉及結合劑製成的導電糊狀膏之後，將結合劑 除去然後將糊狀膏烤乾而被塗上。 爲了此螺旋導電部1 7，如第1圖所示，由介電或磁性材 料製成的絕緣層被形成在兩個互爲交錯形成之雙螺旋電極 15及16上。 此螺旋導電部1 7可由雷射整修，噴砂或噴水等方式形 成。 參照第2圖樹脂24以塗裝被形成在基體之螺旋導電部 1 7表面上，然後乾燥一種混合樹脂。此種混合樹脂加入一 種軟磁性材料，然後與以溶劑等溶解而成具有較低黏度之 絕緣樹脂混合。軟磁性材料與有機結合劑混合，並且形成 的糊狀膏以刮刀之方法，網印法，滾輪法等而被形成薄板 狀。在薄板之製造強度上若沒有發現問題時，塗層絕緣樹 脂亦可被用來做爲薄板。 一絕緣樹脂被塗在此薄板上，並以薄板被纏繞在螺旋導 電部17之表面上。因而形成樹脂24。由這些方法，在絕 緣樹脂中含有軟磁性材料之共模抗流線圈被形成。 隨後，將詳細地說明本發明例6之共模抗流線圈的製造 〇 導電層以銅電鍍在且具有μ’ = ι〇之鎳-鋅肥粒體製成的磁 508597 五、發明說明（8) 性材料製成1.6xl.〇xl.O毫米之柱體基體10上15微米而 被形成。在此電鍍後之基體10上，六個20微米寬之溝 14a由雷射整修形成螺旋狀。同樣地，第二螺旋導電層元 件1 6亦由雷射整修而被形成。 環氧樹脂是以溶劑將它溶解而製備。藉由將環氧樹脂混 合而製成，以便相對於整體粘合液含有50%，μ’ = 10鎳-鋅 肥粒體粉末。此粘合液被塗在在螺旋導電部17之表面上 ，並且在開放空氣中被烘乾而形成第2圖中之絕緣樹脂24 。焊料電鍍在四個端子20,21，22及23上執行，並且端子 部之兩端1 8及1 9從兩端上之線上被切離。一個阻抗分析 器在共模處測量共模抗流線圈之阻抗。此阻抗在500百萬 赫茲時爲580歐姆。 供參考起見，如上述相同方法，第一例中之相同線圈沒 有混合磁性材料到絕緣樹脂中而形成。一個阻抗分析器在 共模處測量共模抗流線圏之阻抗。此阻抗在500百萬赫茲 時爲300歐姆。 例7 本發明例7之多層螺旋共模抗流線圈將參照第5及6圖 而解釋。 在以介電或磁性材料製成的基體1 0，相互絕緣之螺旋電 極與基體10做緊密接觸而形成。使用之導電材料可由將 銅，鋁，銀或等電鍍，濺鍍或沉積而形成在表面上。使用的 導電材料亦可由在塗上由導電末粉及結合劑製成的導電糊 -10- 五、發明說明（9) 狀膏之後’將結合劑除去然後將糊狀膏烘乾而製成。 此螺旋導電部28，具有如第6圖所示之螺旋導電部28’ 的構造’其中第二螺旋導電層元件27通過介於第一導體 25及第二導電層元件27間的介電材料或磁性體26被固定 在第一導體25上。 此螺旋導電部28’可由雷射整修，噴砂或噴水等形成之 並伴隨形成一螺旋溝印。 參照第7圖，將樹脂35塗覆然後烘乾一種混合樹脂而 形成在基體之螺旋導電部28’表面上，其中軟磁性材料被 加入，然後以溶劑等溶解而成具有較低黏度之絕緣樹脂混 合。軟磁性材料與有機結合劑混合，並且形成的糊狀膏以 刮刀之方法，網印法，滾輪法等而被形成薄板狀。若在薄 板之強度上沒有發現問題，塗層絕緣樹脂亦可被用來做爲 薄板。 絕緣樹脂被塗覆此薄板上，並且薄板被纏繞在螺旋導電 部28’之表面上，因而形成樹脂35。由這些方法，形成在 絕緣樹脂中含有軟磁性材料之共模抗流線圈。 如例6中之相同抗流線圈其有四個端子31、32、33及 34亦被形成在例7中，但是螺旋導電部有雙層構造不同。 一個阻抗分析器在共模處測量共模抗流線圈之阻抗。此 阻抗在5 00百萬赫茲時爲5 00歐姆。 以相同方法，共模抗流線圈2不須混合磁性材料到絕緣 樹脂中即可形成。一個阻抗分析器在共模處測量共模抗流 -11- 五、發明說明（10) 線圈之阻抗。此阻抗在500百萬赫茲時爲320歐姆。 例8 依照本發明例8之共模抗流線圈與例1之共模抗流線圈 有相同的構造，但是絕緣層等之材料不同。因而，此例之 線圈將參照第1圖而解釋。 PVB以5wt%之相對比例被加入鎳鋅肥粒體粉末，並且 一種乙基-溶纖劑與丁基甲醇混合溶劑亦被加入，它隨後 被行星式混合器所捏製。此糊狀膏以刮刀之方法被形成1 0 微米之薄板狀。此薄板被切成適當尺寸，並且環氧樹脂塗 覆在表面後，被纒繞在螺旋導電部1 7。 一個阻抗分析器在共模處測量共模抗流線圈之阻抗。此 阻抗在500百萬赫茲時爲580歐姆。 以相同方法，共模抗流線圈設有混合磁性材料到絕緣樹 脂中而形成。一個阻抗分析器在共模處測量共模抗流線圈 之阻抗。此阻抗在500百萬赫茲時爲300歐姆。 雖然基體在上述例6到例8中其兩端及中心處爲圓柱形 ，第3圖中之多邊形柱狀基體及第4圖顯示之圓柱形基體 亦可使用。在基體之螺旋導電部爲多邊形柱狀或圓柱形之 情況，亦可明顯地產生相同效果。再者，即使使用不同的 軟磁性材料或絕緣樹脂時，亦可獲得相同的效果。 例9 參照第8及9圖，第一導電層元件41被覆在由介電或磁 性材料製成的稜柱形基體上。使用之導電體可由將銅’鋁 -12- 508597 五、發明說明（11) ’銀或其他材料電鍍，濺鍍或沉積而予以提供。使用的導 電體亦可由在被覆上由導電粉末及結合劑製成的導電糊狀 膏之後，將結合劑除去然後將糊狀膏烘乾而提供之。 第二導電層元件43經絕緣層42而被塗覆在第一導電層 元件41上。絕緣層42及第二導電層元件43可如第一導 電層元件41被形成。在此基體中，螺旋溝44被形成如第 8圖中粗黑線所顯示者。可以雷射整修，噴砂或噴水來形 成此溝44。隨後，電極45及46之一部份被腐蝕到第一 導電層元件4 1，因而形成如圖中劃剖面線部份所顯示之端 子48及49。就基體40之形狀而論，端子部48及49可爲 稜柱狀，及一螺旋導電部47可爲多邊形柱體，圓柱形等 。在稜柱體狀時，邊緣可設有R。如第1 0圖中所示，絕緣 樹脂55被塗在端子部之間的導體層之整個表面上，並且 四個電極51，52,53及54被作焊料電鍍。故，共模抗流線 圈3被形成’而具有互相絕緣之第一及第二螺旋導電層元 件41及43。關於基體40之形狀，電極45及46可爲稜柱 狀，而螺旋導電部47可爲多邊形柱，圓柱形等。 再者，做爲另一個方法，上述導電粉末及結合劑製成的 糊狀膏以網印法被印在基體，以形成兩個導電層元件41 及43及絕緣層42。將結合劑除去然後將糊狀膏烘乾，形 成共模抗流線圈。 隨後，將說明本發明例6共模抗流線圈的製造。 銅被電鍍在由具有μ’ = 10之磁體所製成之1.6x1.0x1.0508597 V. Description of the invention (1) Field of the invention The present invention relates to a noise filter for limiting electromagnetic noise, and in particular, to a board-mounted common-mode current-resistant coil and a method for manufacturing the same. As the size of equipment becomes smaller and the processing frequency increases, the importance of various measures against electromagnetic interference (EMI) is increasing. Impedance components generally shield frequency noise as a measure of impedance characteristics to resist electromagnetic interference. Wound-type and layer-type common-mode current-resistant coils are used as electromagnetic noise filters. ○ Wound-type uses miniaturized wires to achieve miniaturization, which increases defects. In addition, changes in pitch, etc. cause errors in resonance frequency and inductance, and adjustment is difficult. It is also difficult to manufacture. Furthermore, in the case of a layer type, the pattern is determined in advance, and an error in inductance is caused by a change in thickness or the like. Moreover, since it has a layered structure, it is difficult to manufacture. SUMMARY OF THE INVENTION An object of the present invention is to easily and economically provide a common-mode current-resistant coil having two mutually electrically insulated spiral conductors on a substrate. The common-mode current-resistant coil has a high Q- 値, and its resonance frequency and inductance The change is small. Another object of the present invention is to easily and economically provide a common mode choke coil having two mutually electrically insulated spiral conductors on a substrate. The common mode choke coil has a high impedance in a common mode, and its resonance frequency and inductance The change is small. 508597 V. Description of the invention (2) Another object of the present invention is to provide a method for manufacturing the above-mentioned common mode choke coil. According to an aspect of the present invention, there is provided a common mode anti-current line 圏 'having first and second spiral conductive layer elements electrically insulated from each other on a substrate. This substrate is made of a magnetic or dielectric material. At least one of the first and second spiral conductive layer elements is formed in close contact with the surface of the substrate. According to another aspect of the present invention, there is provided a method for manufacturing the above-mentioned common-mode anti-line choke. This method is characterized in that after at least one conductive layer element is formed on the surface of the substrate, the two spiral conductive layer elements are removed from the conductive layer by laser trimming, sandblasting, and water jetting processes when the conductive layer is removed to form a groove. At least one process is formed. Furthermore, according to still another aspect of the present invention, there is provided a method for manufacturing the above-mentioned common mode choke coil. This method is characterized in that after forming two spiral conductive layers and an insulating layer by screen printing, the adhesive is removed and baked to form a coil. Furthermore, according to still another aspect of the present invention, there is provided a method for manufacturing any of the above-mentioned common-mode anti-line chokes. This method is characterized in that the input and output terminals of the spiral conductive layer portion formed in close contact with the substrate are formed by a photoresist-etching method until the conductive layer constituting the spiral conductive layer portion is exposed. Brief description of the diagram The first diagram is used to explain the front view of the common mode choke coil of the first embodiment of the present invention; -4-508597 V. Description of the invention (3) The second diagram is used to explain the common mode reactance of the first diagram View of the end product of the current coil; Figure 3A is a front view of the base of the common mode choke coil of the second embodiment of the present invention; Figure 3B is a side view of the base in Figure 3A; Figure 4A is the first Front view of the base of the common mode choke coil of the third embodiment; Figure 4B is a side view of the base of Figure 4A; Figure 5 is a double-layer spiral common mode choke coil used to explain the sixth embodiment of the present invention Front view; Figure 6 is a cross-sectional view taken along the arrow AA in Figure 5 to explain the double-layered spiral conductive part in Figure 5; Figure 7 is used to explain the common mode choke coil in Figure 5 Figure of the end product; Figure 8 is a perspective view for explaining a common mode choke coil of the ninth embodiment of the present invention; Figure 9 is a diagram for explaining the spiral conductive part of the common mode choke coil of Figure 8 Cross-section view; Fig. 10 is a view for explaining the end product of the common mode choke coil of Fig. 8. Detailed description of the embodiment of the present invention compared to the first embodiment Example 1 Referring to Figure 1 and Figure 2, the first embodiment of the present invention is a common mode choke coil 508597 V. Description of the invention (4) It will be explained according to the manufacturing process. A conductive material is coated on the surface of the prism-shaped substrate 10 made of a dielectric or magnetic material. The conductive material used can be known by plating, sputtering or depositing copper, aluminum, silver and the like. The conductive material used can also be formed by applying a conductive paste made of conductive powder and a binder, removing the binder, and baking the paste to dryness. With regard to the shape of the base body 10, the terminal portions 11 and 12 may be prismatic, and a spiral conductive portion 17 may be a polygonal column, a cylindrical shape, etc., as shown in the second embodiment of FIGS. 3A, 3B, 4A and 4B and Third Embodiment Explainer. In prisms, R may be present at the edges. As shown by the thick black lines in Figure 1, the spiral grooves 14a, 14b on these substrates 10 can be formed by laser trimming, sand blasting or water spraying in two stages, so they are staggered on the surface of the substrate 10 Two spiral conductive layer elements 15 and 16. A spiral conductive layer element is referred to as a first spiral conductive layer element 15, and is shown as a hatched portion in FIG. The other spiral conductive layer element is referred to as a second spiral conductive layer element 16 which is an unhatched portion in the first figure. The terminal portions 11 and 12 at both ends are divided into four terminals 20, 21, 22, and 23 by providing a groove 13. Referring to Fig. 2, an insulating resin 24 is coated on the entire surface of the spiral conductive portion 17 between the terminal portions 11 and 12. Subsequently, solder plating is performed on the four terminals 20, 21, 22, and 23, and both ends 18 and 19 of the terminal portion are cut off from the lines on both ends of the first figure. As a result, a common-mode current resistance is provided 508597 V. Description of the invention (5) The coil 1 'has two interlaced spiral conductive layers of the first and second spiral conductive layer elements 15 and 16 insulated from each other. Subsequently, the manufacturing of the common-mode current-resistant coil of Example 1 of the present invention will be further explained in detail. The conductive layer was formed by electroplating copper on a pillar base 10 made of 1 · 6χ1 > < 1.0 mm with a thickness of 15 '. In the plated substrate 10, the grooves 14a, 14b are spirally shaped by laser trimming. First, the base body 10 moves in the direction of the vertical laser, so that grooves 13 are formed in the base terminal portion 11 in the longitudinal direction and at the corner portions facing the base body. Subsequently, when the base body 10 is displaced, it also rotates perpendicular to the displacement direction. Thus, the first spiral conductive layer member 15 is formed on the base body 10. Then, the rotation is stopped at the opposite terminal portions 12 to cut the conductive layer. After cutting, the substrate 10 is rotated by 90 ° to 180 °, and thus the second spiral conductive layer element 16 is formed by laser trimming as described above. On the entire surface of the spiral conductive portion 17 between the terminal portions 11 and 12, an insulating resin 24 is applied as shown in Fig. 2. The four terminals 20, 21, 22, and 23 are plated with solder 'and the two ends 18 and 19 at the terminals are cut from the wires at both ends. Thus, 'common-mode current-resistant coil 1 is formed, which has first and second spiral conductive layer elements 15 and 16 insulated from each other and interlaced. An * impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 300 ohms at 500 megahertz. Example 2 Referring to Figures 3A and 3B, the common mode choke coil of Example 2 has the same structure as the common mode choke coil of Example 1 'but the base has a different shape. Even if the base 508597 V. Description of the invention (6) 30 The spiral conductive portion 17 'is a polygonal column as shown in Example 2, the coil can be formed as shown in Examples 1 and 2. An impedance analyzer measures the impedance of the common-mode choke coil of Example 2 in common mode. This impedance is 290 ohms at 500 megahertz. Toe 3 As shown in Figures 4A and 4B, the common mode choke coil of Example 3 has the same structure as the common mode choke coil of Example 1, but the base has a different shape. Even if the spiral conductive part 17 "of the base body 30 'is cylindrical as shown in Example 3, the coil can be formed as shown in Example 1. An impedance analyzer measures the common mode current-resistant coil of Example 3 in the common mode case. Impedance. This impedance is 250 ohms at 500 megahertz. Example 4 The spiral conductive part was formed by laser trimming in Example 1, but was formed by sandblasting in Example 4. The same common mode impedance as in Example 1 was obtained. Example 5 The spiral conductive part was formed by a laser-remodeled common mode choke coil in Example 1 but formed by water jet in Example 5. The same common mode choke coil as in Example 1 was obtained. Example 6 This The common mode choke coil of Invention Example 6 has the same structure as the common mode choke coil of Example 1 shown in Figures 1 and 2, but is covered with different insulators. Therefore, the common mode choke coil of this example will be Solution with reference to Figures 1 and 2 〇 Refer to Figures 1 and 2 on the substrate made of dielectric or magnetic material: -8-10 on 508597 V. Description of the invention (7) Spiral electrode and substrate insulated from each other 1 0 of close contact The conductive material used can be coated on the surface by electroplating, sputtering or deposition of copper, aluminum, silver, or the like. The conductive material used can also be coated with conductive powder and a binding agent. After the finished conductive paste is pasted, the binder is removed, and the paste is baked and applied. For this spiral conductive part 17, as shown in Fig. 1, an insulation made of a dielectric or magnetic material is used. The layer is formed on two staggered double spiral electrodes 15 and 16. The spiral conductive portion 17 can be formed by laser trimming, sand blasting or water spraying, etc. Refer to FIG. 2 and the resin 24 is formed by coating on the substrate. On the surface of the spiral conductive portion 17, a mixed resin is dried. This mixed resin is added with a soft magnetic material and then mixed with an insulating resin with a lower viscosity dissolved by a solvent or the like. The soft magnetic material is mixed with an organic binder And the formed paste is formed into a thin plate by a doctor blade method, screen printing method, roller method, etc. If no problem is found in the manufacturing strength of the thin plate, the coated insulating resin can also be used as An insulating resin is coated on the thin plate, and the thin plate is wound on the surface of the spiral conductive portion 17. Thus, a resin 24 is formed. By these methods, a common-mode current-proof coil containing a soft magnetic material in the insulating resin is coated. Subsequently, the manufacturing of the common mode anti-current coil of Example 6 of the present invention will be explained in detail. The magnetic layer is made of nickel-zinc fertilizer particles with μ ′ = ι〇, which is electroplated with copper. (8) The material is made of 15 micrometers on the column base 10 of 1.6 x 1.0 x 1.0 mm. On this base 10 after electroplating, six 20 micron wide grooves 14a are spirally formed by laser repair. shape. Similarly, the second spiral conductive layer element 16 is also formed by laser trimming. An epoxy resin is prepared by dissolving it in a solvent. It is made by mixing epoxy resin so that it contains 50% of nickel-zinc fertilizer granule powder with respect to 50% of the total bonding liquid. This adhesive liquid is coated on the surface of the spiral conductive portion 17 and dried in open air to form the insulating resin 24 in the second figure. Solder plating is performed on the four terminals 20, 21, 22, and 23, and both ends 18 and 19 of the terminal portion are cut off from the lines on both ends. An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 580 ohms at 500 megahertz. For reference, the same coils as in the first example are formed without mixing a magnetic material into an insulating resin, as described above. An impedance analyzer measures the impedance of the common mode choke at the common mode. This impedance is 300 ohms at 500 megahertz. Example 7 The multilayer helical common mode choke coil of Example 7 of the present invention will be explained with reference to Figs. 5 and 6. In the base body 10 made of a dielectric or magnetic material, spiral electrodes which are insulated from each other are formed in close contact with the base body 10. The conductive material used can be formed by plating, sputtering or depositing copper, aluminum, silver or the like on the surface. The conductive material used can also be made by coating a conductive paste made of conductive powder and a binder -10- V. Description of the invention (9) After the paste is removed, the binder is removed and the paste is dried. The spiral conductive portion 28 has the structure of the spiral conductive portion 28 ′ shown in FIG. 6, in which the second spiral conductive layer element 27 passes through a dielectric material interposed between the first conductor 25 and the second conductive layer element 27 or The magnetic body 26 is fixed to the first conductor 25. The spiral conductive portion 28 'can be formed by laser trimming, sand blasting or water spraying, and a spiral groove mark can be formed along with it. Referring to FIG. 7, a resin 35 is coated and then a mixed resin is dried and formed on the surface of the spiral conductive portion 28 ′ of the substrate. A soft magnetic material is added and then dissolved with a solvent or the like to form an insulating resin with a lower viscosity mixing. The soft magnetic material is mixed with an organic binder, and the formed paste is formed into a thin plate shape by a doctor blade method, a screen printing method, a roller method, or the like. If no problem is found in the strength of the sheet, the coated insulating resin can also be used as the sheet. An insulating resin is coated on the thin plate, and the thin plate is wound on the surface of the spiral conductive portion 28 ', thereby forming a resin 35. By these methods, a common-mode current-proof coil containing a soft magnetic material in an insulating resin is formed. The same anti-current coil as in Example 6 has four terminals 31, 32, 33, and 34 also formed in Example 7, but the spiral conductive portion has a double-layer structure. An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 500 ohms at 500 megahertz. In the same way, the common-mode current-proof coil 2 can be formed without mixing a magnetic material into an insulating resin. An impedance analyzer measures the common mode reactance at the common mode -11- V. Description of the invention (10) The impedance of the coil. This impedance is 320 ohms at 500 megahertz. Example 8 The common mode choke coil according to Example 8 of the present invention has the same structure as the common mode choke coil of Example 1, but the materials of the insulating layer and the like are different. Therefore, the coil of this example will be explained with reference to FIG. PVB was added to the nickel-zinc fertilizer granular powder in a relative proportion of 5 wt%, and a mixed solvent of ethyl-cellosolve and butyl methanol was also added, which was then kneaded by a planetary mixer. This paste is formed into a thin plate shape of 10 microns by a doctor blade method. This sheet is cut to an appropriate size, and after the epoxy resin is coated on the surface, it is wound around the spiral conductive portion 17. An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 580 ohms at 500 megahertz. In the same way, the common mode anti-current coil is formed by mixing a magnetic material into an insulating resin. An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 300 ohms at 500 megahertz. Although the base is cylindrical at both ends and centers in the above Examples 6 to 8, the polygonal columnar base in Figure 3 and the cylindrical base shown in Figure 4 can also be used. In the case where the spiral conductive part of the substrate is a polygonal column or a cylinder, the same effect can be obviously produced. Furthermore, the same effect can be obtained even when different soft magnetic materials or insulating resins are used. Example 9 Referring to Figs. 8 and 9, the first conductive layer element 41 is coated on a prism-shaped substrate made of a dielectric or magnetic material. The conductor used can be provided by electroplating, sputtering or depositing copper'aluminum -12-508597 V. Description of Invention (11) 'silver or other materials. The conductive material used may be provided by coating a conductive paste made of a conductive powder and a binder, removing the binder, and drying the paste. The second conductive layer element 43 is coated on the first conductive layer element 41 via the insulating layer 42. The insulating layer 42 and the second conductive layer element 43 may be formed like the first conductive layer element 41. In this substrate, the spiral groove 44 is formed as shown by the thick black line in FIG. The trench 44 can be formed by laser repair, sandblasting or water spraying. Subsequently, a part of the electrodes 45 and 46 is etched to the first conductive layer element 41, thereby forming the terminals 48 and 49 as shown by hatched portions in the figure. With regard to the shape of the base body 40, the terminal portions 48 and 49 may be prismatic, and a spiral conductive portion 47 may be a polygonal cylinder, cylindrical, or the like. In the case of a prism, R may be provided on the edge. As shown in Fig. 10, an insulating resin 55 is coated on the entire surface of the conductor layer between the terminal portions, and the four electrodes 51, 52, 53 and 54 are plated as solder. Therefore, the common mode anti-current coil 3 is formed to have first and second spiral conductive layer elements 41 and 43 insulated from each other. Regarding the shape of the base 40, the electrodes 45 and 46 may be prismatic, and the spiral conductive portion 47 may be a polygonal column, a cylinder, or the like. Furthermore, as another method, a paste made of the above-mentioned conductive powder and a binder is printed on a substrate by a screen printing method to form two conductive layer elements 41 and 43 and an insulating layer 42. The binding agent is removed and the paste is dried to form a common mode anti-current coil. Subsequently, the manufacturing of the common-mode current-resistant coil of Example 6 of the present invention will be explained. Copper is plated on 1.6x1.0x1.0 made of a magnet with μ ’= 10
-13- 508597 五、發明說明（12) 毫米柱體基體40上15微米，如第8圖所示。在此電鍍後 之基體40上，更進一步地，電鍍氧化鋁15微米，然後電 鍍銅1 5微米，如第9圖所示。溝44由雷射整修而被形成 在基體40上。溝44是當轉動基體40時，沿著垂直於基 體40轉動方向而移動基體40，以形成螺旋狀。隨後，電 極45及46之一部份被腐蝕到第一導電層元件41中，因 而形成端子48及49。在電極45及46之間的導電層之整 個表面被塗上絕緣樹脂55，如第10圖中所示。四個電極 51，52,53及54被作焊料電鍍。電極53及54以剖面線顯 示於第10圖中。故，共模抗流線圈3被形成，而具有互 相絕緣之第一及第二導電層元件41及43。一個阻抗分析 器在共模處測量共模抗流線圈之阻抗。此阻抗在500百萬 赫茲時爲300歐姆。 例10 參考第3a及3b圖，例10之共模抗流線圏與例9之共 模抗流線圈有相同的構造，但是基體之螺旋導電部爲多邊 形柱體不同之外。一個阻抗分析器在共模處測量共模抗流 線圈之阻抗。此阻抗在500百萬赫茲時爲300歐姆。 故，與例9之相同結果會在例1 0中獲得。 例11 如第4 a及4 b圖所顯示之例1 1共模抗流線圈與例9之 共模抗流線圈有相同的構造，但是基體30之螺旋導電部 爲圓柱形不同。-13- 508597 V. Description of the invention (12) 15 micrometers on the base 40 of the millimeter cylinder, as shown in FIG. 8. On this substrate 40 after electroplating, further, alumina was electroplated at 15 microns, and then copper was electroplated at 15 microns, as shown in FIG. The groove 44 is formed in the base body 40 by laser trimming. The groove 44 moves the base body 40 along a direction perpendicular to the rotation direction of the base body 40 to form a spiral shape when the base body 40 is rotated. Subsequently, a part of the electrodes 45 and 46 is etched into the first conductive layer element 41, thereby forming the terminals 48 and 49. The entire surface of the conductive layer between the electrodes 45 and 46 is coated with an insulating resin 55, as shown in FIG. The four electrodes 51, 52, 53 and 54 are subjected to solder plating. The electrodes 53 and 54 are shown in cross section in Fig. 10. Therefore, the common-mode current-resistant coil 3 is formed to have first and second conductive layer elements 41 and 43 insulated from each other. An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 300 ohms at 500 megahertz. Example 10 Referring to Figures 3a and 3b, the common-mode anti-current line of Example 10 has the same structure as that of the common-mode anti-current coil of Example 9, except that the spiral conductive part of the base is a polygonal cylinder. An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 300 ohms at 500 megahertz. Therefore, the same results as in Example 9 will be obtained in Example 10. Example 11 As shown in Figs. 4a and 4b, the common mode choke coil of Example 1 1 has the same structure as that of the common mode choke coil of Example 9, but the spiral conductive part of the base 30 has a cylindrical shape.
-14- 508597 五、發明說明（13) 一個阻抗分析器在共模處測量共模抗流線圈之阻抗。此 阻抗在5 00百萬赫茲時爲290歐姆。 故，與例9之相同結果會在例11中獲得。 例12 在示於例9之共模抗流線圈中，形成溝44以便螺旋導 電部4 7 ’由雷射整修而形成。但是，在例1 2中，共模抗流 線圈是以噴砂法形成。與例9之相同結果會在例1 2中獲 得。 例13 在示於例9之共模抗流線圈中，螺旋導電部是由雷射整 修而形成。但是，在例1 3中，共模抗流線圈是以噴水法 形成。與例9之相同結果會在例1 3中獲得。 再者，作爲例13之另一替代方案，當基體之螺旋導電 部爲多邊形柱體或圓柱形時，螺旋溝可以由噴砂或噴水形 成。明顯地，相同結果可被獲得。 例14 一種導電糊狀膏以使用一種乙基-溶纖劑與丁基甲醇之 混合溶劑，銅粉及PVB而被製備。在此情況下，銅粉及 PVB之比率爲95 : 5。此糊狀膏藉由使用不銹鋼篩網而被 印在由具有μ’ = 1〇之磁體所製成之1·6χ1·〇χ1·0毫米稜柱形 基體上，如第1圖所示，因而印上15微米之第一螺旋導體。 接著，使用分開製備之氧化鋁，一個氧化鋁層被印在第一螺 旋導體上並且被烘乾，因而印製並且烘乾第二導體。氧化 鋁膏與銅膏有相同的組成分。在第二導體被烘乾之後’結 -15- 508597 五、發明說明（14) 合劑被除去然後將糊狀膏烘烤。如第1 〇圖所示，共模抗 流線圈藉由塗上絕緣樹脂5 5並且焊料電鍍端子部而形成。 一個阻抗分析器在共模處測量共模抗流線圈之阻抗。此 阻抗在500百萬赫茲時爲300歐姆。 即使當基體之螺旋導電部爲以多邊形柱體或圓柱形做爲 例1 4之另一種選擇時，相同結果可被獲得。 如上所述’在本發明之例中’由介電材料或磁性體所製 成之基體具有互相絕緣之螺旋導體，並且導電層是由雷射 整修等方法而形成。故，共模抗流線圈可以容易地且經濟 地形成，並且有高-Q値，並且共振頻率及電感之變動很小 〇 再者’依照本發明之例子’將磁性材料混合到絕緣樹脂 時結合力增加，使共模抗流線圈可以容易地且經濟地形成 ，並且在高頻率範圍內有高阻抗。 再者’依照本發明之例子，由介電材料或磁性體所製成 之基體具有兩個互相絕緣之層狀螺旋導體。導.電層是以雷 射等整修’或網印法等形成，使共模抗流線圈可以容易地 且經濟地形成，並且有高-Q値，並且共振頻率及電感之變 動很小。 -16- 508597 五、發明說明（15) 符號之說明 I, 2,3 10,30,30，，40 II, 12,48,49 13 14a, 14b,29,44 15 16 17，17，，17”，47,47， 18,19 20,21 ,22,23,3 1 ,32, 24,35,55 25 26 27,43 28，28， 41 42 45,46,51,52,53,54 共模抗流線圈 基體 端子部 溝 螺旋溝 第一螺旋導電層元件 第二螺旋導電層元件 螺旋導電部 端子部之端 ,34 端子 樹脂 第一導體 磁性體 第二導電層元件 螺旋導體部 第一導體層元件 絕緣層 電極 17--14-508597 V. Description of the invention (13) An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 290 ohms at 500 megahertz. Therefore, the same results as in Example 9 will be obtained in Example 11. Example 12 In the common mode choke coil shown in Example 9, a groove 44 is formed so that the spiral conductive portion 47 'is formed by laser trimming. However, in Example 12, the common mode choke coil was formed by a sandblasting method. The same results as in Example 9 were obtained in Example 12. Example 13 In the common mode choke coil shown in Example 9, the spiral conductive portion is formed by laser trimming. However, in Example 13 the common mode choke coil was formed by a water jet method. The same results as in Example 9 will be obtained in Example 13. Furthermore, as another alternative of Example 13, when the spiral conductive portion of the substrate is a polygonal cylinder or a cylinder, the spiral groove may be formed by sandblasting or waterblasting. Obviously, the same results can be obtained. Example 14 A conductive paste was prepared using a mixed solvent of ethyl-cellosolve and butyl methanol, copper powder and PVB. In this case, the ratio of copper powder to PVB is 95: 5. This paste was printed on a 1.6 × 1 × 〇 × 1.0 mm prismatic substrate made of a magnet with μ ′ = 10 by using a stainless steel screen, as shown in FIG. 15 micron first spiral conductor. Next, using separately prepared alumina, a layer of alumina was printed on the first spiral conductor and dried, thereby printing and drying the second conductor. Aluminum oxide paste has the same composition as copper paste. After the second conductor is dried, the junction is -15-508597. 5. Description of the invention (14) The mixture is removed and the paste is baked. As shown in FIG. 10, the common mode current-resistant coil is formed by coating an insulating resin 55 and plating the terminal portions with solder. An impedance analyzer measures the impedance of the common mode choke coil at the common mode. This impedance is 300 ohms at 500 megahertz. The same result can be obtained even when the spiral conductive portion of the substrate is a polygonal cylinder or a cylindrical cylinder as another alternative of Example 14. As described above, 'in the example of the present invention', a substrate made of a dielectric material or a magnetic body has spiral conductors insulated from each other, and the conductive layer is formed by a method such as laser trimming. Therefore, the common-mode current-resistant coil can be easily and economically formed, and has a high -Q 値, and the change in the resonance frequency and inductance is small. Furthermore, when the magnetic material is mixed with the insulating resin according to the example of the present invention, The increased force enables common-mode current-resistant coils to be easily and economically formed and has high impedance in the high frequency range. Furthermore, according to an example of the present invention, a substrate made of a dielectric material or a magnetic body has two layered spiral conductors insulated from each other. The conductive layer is formed by laser trimming or screen printing, so that the common mode choke coil can be easily and economically formed, and has a high -Q 値, and the changes in resonance frequency and inductance are small. -16- 508597 V. Description of the invention (15) Explanation of symbols I, 2, 3 10, 30, 30, 40 II, 12, 48, 49 13 14a, 14b, 29, 44 15 16 17, 17, 17, ", 47,47, 18,19 20,21, 22,23,3 1, 32, 24,35,55 25 26 27,43 28,28, 41 42 45,46,51,52,53,54 total Moulded current-resistant coil base terminal groove groove spiral groove first spiral conductive layer element second spiral conductive layer element end of the spiral conductive portion terminal portion, 34 terminal resin first conductor magnetic body second conductive layer element spiral conductor portion first conductor layer Element insulation layer electrode