JP2002299154A - Method for manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component where thermally unstable state which is caused by internal strain involved in a chip element assembly is improved and permeation of plating solution is improved markedly. SOLUTION: In the method for manufacturing an electronic component, ceramic electrode paste, in which a metal powder and a ceramic powder are mixed, is spread thinly on both end surfaces of a chip element assembly before baking and dried (simultaneous baking of terminal electrode coating process). The chip element assembly, before baking and the ceramic electrode paste, are baked simultaneously (baking process). After the polymer electrode is spread on both of the end surfaces of the chip element assembly obtained by baking and cured, it is subjected to electroplating on the polymer electrode (terminal electrode forming process).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, specifically, an electronic component for forming a terminal electrode of a chip capacitor.

[0002]

2. Description of the Related Art Conventionally, chip capacitors have been used in various electronic devices, and the number of chip capacitors has been increasing year by year. This type of terminal electrode of a chip capacitor as shown in FIG. 3 is formed by applying silver or copper paste as a terminal electrode to both end surfaces of a fired chip body, drying and baking,
Electroplating was being performed. In particular, in recent years, there has been a strong demand for miniaturization and high capacitance of chips accompanying miniaturization of electronic devices, and miniaturization and high capacitance of chip capacitors have progressed, and high lamination of 300 or more layers is required. These chip capacitors are thermally unstable due to the internal distortion of the chip body, and cracks in the chip body due to heat during soldering have often been a problem. Further, in the electroplating process, a plating solution often invades from a terminal electrode or an interface between the terminal electrode and the element body, and these may adversely affect the electrical characteristics.

[0003]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to manufacture an electronic component capable of improving a thermally unstable state due to the internal distortion of a chip body and greatly improving penetration of a plating solution. The aim is to provide a method.

[0004]

For this purpose, a method for manufacturing an electronic component according to the present invention comprises the steps of:
A ceramic electrode base containing a mixture of metal powder and ceramic powder is thinly coated and dried, and the chip body before firing and the ceramic electrode paste are simultaneously fired, and polymer electrodes are applied to both end surfaces of the fired chip body. Then, after curing, electroplating is performed on the polymer electrode.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component of the present invention, that is, a chip capacitor will be described with reference to the drawings. As shown in FIGS. 1 and 2, the chip capacitor is a surface-mount type multilayer ceramic capacitor having an internal electrode 2. A terminal electrode 3 is formed on both end surfaces of a chip body 1 of a green chip obtained by laminating a ceramic dielectric 4 a plurality of times with a ceramic electrode paste 5 and a polymer electrode 6, and a Ni plating film is further formed on the polymer electrode 6. 7 and an Sn / Pb or Sn plating film 8 are formed.

Here, as the internal electrodes 2, Pd, Ag
A noble metal such as / Pd or Ag, or a base metal such as Ni or Cu is used. As the ceramic dielectric 4, a dielectric such as barium titanate, lead perovskite, or strontium titanate is used. The ceramic electrode paste 5 is made of a conductive paste in which a metal powder composed of a conductor such as Ag, Ag / Pd, Ni, and Cu, and a ceramic raw material powder are dispersed in an organic binder dissolved in a solvent. The ratio between the metal powder and the ceramic powder of the ceramic electrode paste 5 used here is 50 to 90% by weight of the metal powder in order to secure conductivity as an electrode layer.
It is preferably from 0 to 50% by weight. When the ratio of the metal powder is less than 50% by weight, the electrical connection between the ceramic electrode paste layer and the internal electrode 2 becomes insufficient, and
%, The shrinkage during firing of the ceramic electrode paste layer becomes large, and it becomes difficult to form a stable terminal electrode.

The polymer electrode 6 is a conductive resin paste obtained by forming a conductive metal powder and a thermosetting resin into a paste with an organic solvent. In addition, as a metal powder, a noble metal powder such as Ag or Pd, or a Ni or Cu powder can be used, and as a thermosetting resin, an epoxy resin, a phenol resin, or the like can be used.

On the polymer electrode 6 having such a structure, a Ni plating film 7 is formed by an electrolytic barrel plating method using a nickel sulfamate plating bath, and an Sn / Pb plating film is further formed using a sulfonic acid plating bath. 8 is formed.

The method for manufacturing an electronic component according to the present invention comprises the following manufacturing steps. Referring to FIG.
A green chip obtained by laminating the ceramic dielectrics 4 having the internal electrodes 2 a plurality of times is cut into chips to form a chip body 1. Next, a ceramic electrode paste 5 in which a metal powder and a ceramic powder are mixed is thinly applied to both end surfaces of the chip body 1 and dried. (Simultaneous firing terminal electrode application step) Then, the chip body 1 and the ceramic electrode paste 5 before firing are fired simultaneously. (Firing Step) Further, the polymer electrodes 6 are applied to the ceramic electrode pastes 5 on both end surfaces of the chip body 1 obtained by firing, and are cured. On the polymer electrode 6 thus formed, a Ni plating film 7 is formed by an electrolytic barrel plating method using a nickel sulfamate plating bath, and a Sn / Pb plating film 8 is further formed by using a sulfonic acid plating bath. Form. (Terminal Electrode Forming Step) As described above, the terminal electrode 3 of the chip capacitor shown in FIG. 1 is formed.

[0010]

As described in detail above, the method for manufacturing an electronic component according to the present invention is characterized in that a ceramic electrode base in which a metal powder and a ceramic powder are mixed is thinly applied to both end surfaces of a chip body before firing, dried and fired. Simultaneously firing the previous chip body and the ceramic electrode paste, applying a polymer electrode to both end surfaces of the fired chip body, curing, and then electroplating the chip body, It is possible to improve the thermally unstable state due to the internal strain and to greatly improve the penetration of the plating solution.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view of a chip capacitor used in the present invention.

FIG. 2 is an explanatory view showing a manufacturing process of the chip capacitor of the present invention.

FIG. 3 is a perspective view of a conventional chip capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip body 2 Internal electrode 3 Terminal electrode 4 Ceramic derivative 5 Ceramic electrode paste 6 Polymer electrode 7 Ni plating film 8 Sn / Pb plating film

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E001 AB03 AF06 AH01 AH07 AH09 5E082 AA01 AB03 BC19 BC33 FG26 FG54 GG10 GG26 GG28 JJ03 JJ23 JJ26 MM24

Claims (1)

[Claims] A ceramic electrode base containing a mixture of a metal powder and a ceramic powder is thinly applied to both end surfaces of a chip body before firing and dried, and the chip body and ceramic electrode paste before firing are simultaneously fired and fired. A method for producing an electronic component, comprising applying a polymer electrode to both end surfaces of a chip element obtained as described above, curing the polymer electrode, and then performing electroplating on the polymer electrode.