EP0270954B1 - Fusible du type chip - Google Patents

Fusible du type chip Download PDF

Info

Publication number
EP0270954B1
EP0270954B1 EP87117577A EP87117577A EP0270954B1 EP 0270954 B1 EP0270954 B1 EP 0270954B1 EP 87117577 A EP87117577 A EP 87117577A EP 87117577 A EP87117577 A EP 87117577A EP 0270954 B1 EP0270954 B1 EP 0270954B1
Authority
EP
European Patent Office
Prior art keywords
chip
fuse
conducting member
insulating member
protecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP87117577A
Other languages
German (de)
English (en)
Other versions
EP0270954A1 (fr
Inventor
Satoru Shimokawa
Hideaki Hattan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to AT87117577T priority Critical patent/ATE89435T1/de
Publication of EP0270954A1 publication Critical patent/EP0270954A1/fr
Application granted granted Critical
Publication of EP0270954B1 publication Critical patent/EP0270954B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits

Definitions

  • This invention relates to a chip-type fuse for interrupting overcurrents which damage electronic parts mounted on a printed circuit board (PCB), and more particularly, to an improved chip-type fuse which is inexpensive and can be easily automatically mounted on a PCB.
  • PCB printed circuit board
  • a fuse is used to interrupt overcurrents which damage electronic parts mounted on a PCB.
  • chip-type fuses which are mounted on a PCB have been developed in recent years.
  • One of the conventional chip-type fuses includes an insulating substrate and a conductor.
  • the insulating substrate has two electrodes disposed thereon, and the conductor electrically connects the two electrodes to each other.
  • the conductor is made of thin-film metal and disposed in a recess formed on the lower surface of the substrate.
  • Another conventional chip-type fuse includes an insulating substrate having a pair of electrodes, a gold (Au) wire wire-bonded to the electrodes, and a resin which is disposed on the substrate to seal the gold wire.
  • the conventional fuses are very expensive because the recess for housing the conductor must be formed or the wire must be wire-bonded to the electrodes. In addition, the conventional fuses have so complicated shapes that they can not easily be automatically mounted on a PCB.
  • a circuit fuse assembly comprising a plurality of fuse elements.
  • the plurality of fuse elements is simultaneously formed using printed circuit or through hole plating techniques and includes means for easily substituting a different one of the fuse elements when the in-circuit fuse element burns out due to an overload current condition.
  • a fuse circuit for high frequency applications comprising a metal conductor disposed on a support element which is constituted of ceramic.
  • DE-A-2845540 discloses a heat resistant coating material for electrical resistors.
  • the coating material is composed of a mixture of silicone resin and epoxy resin to provide an inflammable coating for electrical components.
  • Figs. 1 shows a chip-type fuse according to an embodiment of the invention.
  • a chip-type fuse 1 includes a ceramic substrate 2 as an insulating substrate which is rectangular like a rectangular chip-type resistor and whose size is 3.2mm x 1.6mm.
  • a conducting member 3 made of thin-film metal which is deposited or printed on upper surface 2a.
  • Conducting member 3 can be made of a silver-palladium (Pd) alloy, silver-platinum (Pt) alloy, silver, copper, or gold.
  • Electrodes 4a and 4b are formed on side ends 2b and 2c of substrate 2, respectively. Electrodes 4a and 4b are made of thin-film metal which is deposited on side ends 2b and 2c or disposed theron with other known methods.
  • Conducting member 3 is a rectangular parallelepiped and both ends of the conducting member 3 are connected to electrodes 4a and 4b, respectively.
  • Upper surface 2a of substrate 2 is coated with a silicone resin film (protecting film) 5 to completely cover conducting member 3.
  • chip-type fuse 1 Since chip-type fuse 1 has the same shape as micro-chip resistors, it can be easily automatically mounted on a PCB to reduce the mounting cost.
  • fuse 1 The operation of fuse 1 is described hereinafter.
  • conducting member 3 If an overcurrent flows through fuse 1, conducting member 3 is melted and broken somewhere between the ends to interrupt the overcurrent. Since conducting member 3 is covered with silicone resin film 5, metal vapor generated at the melted portion are prevented from scattering outside fuse 1. Moreover, arc discharge caused by the metal vapor is prevented from continuing because the silicone resin functions as an arc-extinguishing medium, completely protecting the electronic parts. In addition, since conducting member 3 is formed directly on upper surface 2a of substrate 2, it has a high heat-radiating effect to allow flows of high-level currents despite the small size of fuse 1.
  • conducting member 3 is not made of a golden wire unlike the conventional chip-type fuse, conducting member 3 is hardly broken, easy to handle, and highly heat-resistant.
  • Fig. 2 shows a plan view of the chip-type fuse according the invention.
  • Conducting member 3 has trimmed portions 3b which are trimmed with laser light to obtain appropriate resistance.
  • chip-type fuse 1 The operation of chip-type fuse 1 is described hereinafter.
  • fuse 1 If an overcurrent flows through fuse 1, one of trimmed portions 3b is melted and broken to interrupt the overcurrent. The reliability of fuse 1 increases because trimmed portions 3b are easily melted and broken by an overcurrent.
  • the conducting member 3 is rectangular it can have another shape.
  • the protecting film 5 can be made of a glass material.

Landscapes

  • Fuses (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)

Claims (4)

  1. Fusible du type puce (1) comprenant :
       un élément d'isolation (2);
       une paire d'éléments d'électrode (4a, 4b) qui sont réalisés en un métal en film mince et qui sont disposés sur les extrémités latérales (2b, 2c) dudit élément d'isolation (2);
       un élément de conduction (3) qui est formé sur la surface supérieure (2a) dudit élément d'isolation (2) et qui connecte électriquement ladite paire d'éléments d'électrode (4a, 4b) l'un à l'autre ;
       l'élément de conduction (3) inclut une pluralité de parties rognées (3b); et
       un élément de protection (5) disposé sur ledit élément d'isolation (2) pour protéger ledit élément de conduction (3),
       caractérisé en ce que
       la pluralité de parties rognées (3b) de l'élément de conduction (3) sont connectées en série.
  2. Fusible selon la revendication 1, dans lequel l'élément isolant (2) est un parallélépipède rectangle en céramique.
  3. Fusible selon la revendication 1, dans lequel l'élément de protection (5) est réalisé à partir d'un matériau de résine silicone.
  4. Fusible selon la revendication 1, dans lequel l'élément de protection (5) est réalisé à partir d'un matériau de verre.
EP87117577A 1986-12-01 1987-11-27 Fusible du type chip Expired - Lifetime EP0270954B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT87117577T ATE89435T1 (de) 1986-12-01 1987-11-27 Chip-sicherung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP287081/86 1986-12-01
JP61287081A JPH0831303B2 (ja) 1986-12-01 1986-12-01 チツプ型ヒユ−ズ

Publications (2)

Publication Number Publication Date
EP0270954A1 EP0270954A1 (fr) 1988-06-15
EP0270954B1 true EP0270954B1 (fr) 1993-05-12

Family

ID=17712806

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87117577A Expired - Lifetime EP0270954B1 (fr) 1986-12-01 1987-11-27 Fusible du type chip

Country Status (5)

Country Link
EP (1) EP0270954B1 (fr)
JP (1) JPH0831303B2 (fr)
AT (1) ATE89435T1 (fr)
DE (1) DE3785835T2 (fr)
ES (1) ES2046194T3 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
US8075872B2 (en) 2003-08-06 2011-12-13 Gruenenthal Gmbh Abuse-proofed dosage form
US8114384B2 (en) 2004-07-01 2012-02-14 Gruenenthal Gmbh Process for the production of an abuse-proofed solid dosage form
US8309060B2 (en) 2003-08-06 2012-11-13 Grunenthal Gmbh Abuse-proofed dosage form
US8383152B2 (en) 2008-01-25 2013-02-26 Gruenenthal Gmbh Pharmaceutical dosage form
US8722086B2 (en) 2007-03-07 2014-05-13 Gruenenthal Gmbh Dosage form with impeded abuse
US9161917B2 (en) 2008-05-09 2015-10-20 Grünenthal GmbH Process for the preparation of a solid dosage form, in particular a tablet, for pharmaceutical use and process for the preparation of a precursor for a solid dosage form, in particular a tablet
US9629807B2 (en) 2003-08-06 2017-04-25 Grünenthal GmbH Abuse-proofed dosage form
US9636303B2 (en) 2010-09-02 2017-05-02 Gruenenthal Gmbh Tamper resistant dosage form comprising an anionic polymer
US9655853B2 (en) 2012-02-28 2017-05-23 Grünenthal GmbH Tamper-resistant dosage form comprising pharmacologically active compound and anionic polymer
US9675610B2 (en) 2002-06-17 2017-06-13 Grünenthal GmbH Abuse-proofed dosage form
US9913814B2 (en) 2014-05-12 2018-03-13 Grünenthal GmbH Tamper resistant immediate release capsule formulation comprising tapentadol
US11844865B2 (en) 2004-07-01 2023-12-19 Grünenthal GmbH Abuse-proofed oral dosage form

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH675034A5 (fr) * 1987-11-03 1990-08-15 Schurter Ag
JPH0541486Y2 (fr) * 1990-05-10 1993-10-20
JPH0433230A (ja) * 1990-05-29 1992-02-04 Mitsubishi Materials Corp チップ型ヒューズ
GB2255455A (en) * 1991-04-22 1992-11-04 Electronic Components Ltd Fuse
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
JPH0620806A (ja) * 1992-03-21 1994-01-28 Rohm Co Ltd 固体フューズ
JPH0636672A (ja) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd カード型ヒューズおよびその製造方法
DE4223621C1 (de) * 1992-07-17 1993-10-21 Siemens Ag Hochfrequenz-Schmelzsicherung
SE505448C2 (sv) * 1993-05-28 1997-09-01 Ericsson Telefon Ab L M Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring
US5586014A (en) * 1994-04-28 1996-12-17 Rohm Co., Ltd. Fuse arrangement and capacitor containing a fuse
US6191928B1 (en) 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US5974661A (en) * 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
US5914648A (en) * 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
CN1191624A (zh) * 1995-06-07 1998-08-26 保险丝公司 表面安装熔片装置的改善方法和设备
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
DE29616063U1 (de) * 1996-09-14 1996-10-31 Wickmann-Werke GmbH, 58453 Witten Elektrische Sicherung
DE10005836B4 (de) * 2000-02-10 2006-10-12 Vossloh-Schwabe Elektronik Gmbh Leiterplattensicherung mit erhöhter Sicherheit
WO2002103735A1 (fr) * 2001-06-11 2002-12-27 Wickmann-Werke Gmbh Composant de fusible
EP1274110A1 (fr) * 2001-07-02 2003-01-08 Abb Research Ltd. Fusible
US6878004B2 (en) 2002-03-04 2005-04-12 Littelfuse, Inc. Multi-element fuse array
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
DE10361596A1 (de) 2003-12-24 2005-09-29 Grünenthal GmbH Verfahren zur Herstellung einer gegen Missbrauch gesicherten Darreichungsform
DE102005005446A1 (de) 2005-02-04 2006-08-10 Grünenthal GmbH Bruchfeste Darreichungsformen mit retardierter Freisetzung
WO2005039256A1 (fr) * 2003-10-17 2005-04-28 Koninklijke Philips Electronics N.V. Carte de circuits imprimes avec un fusible
DE102005005449A1 (de) 2005-02-04 2006-08-10 Grünenthal GmbH Verfahren zur Herstellung einer gegen Missbrauch gesicherten Darreichungsform
JP4880950B2 (ja) * 2005-09-05 2012-02-22 ルネサスエレクトロニクス株式会社 半導体装置
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
JP5270196B2 (ja) * 2008-03-07 2013-08-21 三菱電機株式会社 半導体装置及びその半導体装置を備えたインバータシステム
PL2456427T3 (pl) 2009-07-22 2015-07-31 Gruenenthal Gmbh Wytłaczana na gorąco postać dawki o kontrolowanym uwalnianiu
PL2456424T3 (pl) 2009-07-22 2013-12-31 Gruenenthal Gmbh Stabilizowana przed utlenianiem odporna na naruszenie postać dawkowania
AU2011297901B2 (en) 2010-09-02 2014-07-31 Grunenthal Gmbh Tamper resistant dosage form comprising inorganic salt
JP5880648B2 (ja) * 2010-09-06 2016-03-09 株式会社村田製作所 電子部品
JP5810706B2 (ja) * 2010-09-06 2015-11-11 株式会社村田製作所 電子部品
PE20141638A1 (es) 2011-07-29 2014-11-22 Gruenenthal Chemie Tableta a prueba de manipulacion que proporciona liberacion de farmaco inmediato
US20130028972A1 (en) 2011-07-29 2013-01-31 Grunenthal Gmbh Tamper-resistant tablet providing immediate drug release
EA201401139A1 (ru) 2012-04-18 2015-03-31 Грюненталь Гмбх Устойчивая к разрушению и к сбросу дозы фармацевтическая лекарственная форма
US10064945B2 (en) 2012-05-11 2018-09-04 Gruenenthal Gmbh Thermoformed, tamper-resistant pharmaceutical dosage form containing zinc
US9852868B2 (en) 2012-09-28 2017-12-26 Kamaya Electric Co., Ltd. Chip fuse and manufacturing method therefor
MX2015016254A (es) 2013-05-29 2016-04-20 Gruenenthal Gmbh Forma de dosificacion resistente al uso indebido con perfil de liberacion bimodal.
JP6445537B2 (ja) 2013-05-29 2018-12-26 グリュネンタール・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング １個または複数の粒子を含有する改変防止（ｔａｍｐｅｒ−ｒｅｓｉｓｔａｎｔ）剤形
JP6449871B2 (ja) 2013-07-12 2019-01-09 グリュネンタール・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング エチレン−酢酸ビニルポリマーを含有する改変防止剤形
JP6480936B2 (ja) 2013-11-26 2019-03-13 グリュネンタール・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング クライオミリングによる粉末状医薬組成物の調製
EP3148512A1 (fr) 2014-05-26 2017-04-05 Grünenthal GmbH Microparticules protégées contre une libération massive dans l'éthanol
WO2016170097A1 (fr) 2015-04-24 2016-10-27 Grünenthal GmbH Forme galénique inviolable avec libération immédiate et résistance à l'extraction par solvant.
JP2018526414A (ja) 2015-09-10 2018-09-13 グリュネンタール・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング 乱用抑止性の即放性製剤を用いた経口過剰摂取に対する保護

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR901549A (fr) * 1943-01-28 1945-07-30 Philips Nv Cartouche de coupe-circuit
SE341746B (fr) * 1970-03-10 1972-09-18 Ericsson Telefon Ab L M
US3887893A (en) * 1973-09-24 1975-06-03 Allen Bradley Co Fusible resistor
JPS51147238U (fr) * 1975-05-21 1976-11-26
US4139832A (en) * 1976-03-19 1979-02-13 Hitachi, Ltd. Glass-coated thick film resistor
DE2845540C2 (de) * 1978-10-19 1982-01-28 Draloric Electronic GmbH, 8500 Nürnberg Nichtentflammbares Überzugsmittel und seine Verwendung
US4296398A (en) * 1978-12-18 1981-10-20 Mcgalliard James D Printed circuit fuse assembly
JPS6011538Y2 (ja) * 1982-12-01 1985-04-17 三王株式会社 チツプ型ヒユ−ズ
JPS60143544A (ja) * 1983-12-29 1985-07-29 松下電器産業株式会社 チツプ形ヒユ−ズ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Glossary of Chemical Terms, Hangel & Harvley, Publ. van Nostrand Reinhold Co., 1976 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9675610B2 (en) 2002-06-17 2017-06-13 Grünenthal GmbH Abuse-proofed dosage form
US9629807B2 (en) 2003-08-06 2017-04-25 Grünenthal GmbH Abuse-proofed dosage form
US8075872B2 (en) 2003-08-06 2011-12-13 Gruenenthal Gmbh Abuse-proofed dosage form
US8309060B2 (en) 2003-08-06 2012-11-13 Grunenthal Gmbh Abuse-proofed dosage form
US8420056B2 (en) 2003-08-06 2013-04-16 Grunenthal Gmbh Abuse-proofed dosage form
US8114384B2 (en) 2004-07-01 2012-02-14 Gruenenthal Gmbh Process for the production of an abuse-proofed solid dosage form
US11844865B2 (en) 2004-07-01 2023-12-19 Grünenthal GmbH Abuse-proofed oral dosage form
US8722086B2 (en) 2007-03-07 2014-05-13 Gruenenthal Gmbh Dosage form with impeded abuse
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
US8383152B2 (en) 2008-01-25 2013-02-26 Gruenenthal Gmbh Pharmaceutical dosage form
US9161917B2 (en) 2008-05-09 2015-10-20 Grünenthal GmbH Process for the preparation of a solid dosage form, in particular a tablet, for pharmaceutical use and process for the preparation of a precursor for a solid dosage form, in particular a tablet
US9636303B2 (en) 2010-09-02 2017-05-02 Gruenenthal Gmbh Tamper resistant dosage form comprising an anionic polymer
US9655853B2 (en) 2012-02-28 2017-05-23 Grünenthal GmbH Tamper-resistant dosage form comprising pharmacologically active compound and anionic polymer
US9913814B2 (en) 2014-05-12 2018-03-13 Grünenthal GmbH Tamper resistant immediate release capsule formulation comprising tapentadol

Also Published As

Publication number Publication date
DE3785835T2 (de) 1993-08-19
EP0270954A1 (fr) 1988-06-15
ATE89435T1 (de) 1993-05-15
ES2046194T3 (es) 1994-02-01
JPS63141233A (ja) 1988-06-13
DE3785835D1 (de) 1993-06-17
JPH0831303B2 (ja) 1996-03-27

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