EP0143919A1 - Bain alcalin de cyanure pour le dépôt électrolytique de couches à base d'alliage cuivre-étain - Google Patents

Bain alcalin de cyanure pour le dépôt électrolytique de couches à base d'alliage cuivre-étain Download PDF

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Publication number
EP0143919A1
EP0143919A1 EP84110792A EP84110792A EP0143919A1 EP 0143919 A1 EP0143919 A1 EP 0143919A1 EP 84110792 A EP84110792 A EP 84110792A EP 84110792 A EP84110792 A EP 84110792A EP 0143919 A1 EP0143919 A1 EP 0143919A1
Authority
EP
European Patent Office
Prior art keywords
copper
general formula
carbon atoms
cyanide
alkyl group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84110792A
Other languages
German (de)
English (en)
Other versions
EP0143919B1 (fr
Inventor
Gerd Hoffacher
Willi Müller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Publication of EP0143919A1 publication Critical patent/EP0143919A1/fr
Application granted granted Critical
Publication of EP0143919B1 publication Critical patent/EP0143919B1/fr
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Definitions

  • the invention relates to an alkaline cyanide bath for the galvanic deposition of bare to shiny copper-tin alloy coatings, in particular copper-tin alloy coatings with 45 to 60% copper, consisting of 1 to 60 g / 1 copper in the form of copper cyanide, 7 to 30 g / 1 tin in the form of stannate, 0.1 to 100 g / 1 of one or more complexing agents from the group phosphate, polyphosphate, phosphonate and polyoxycarboxylic acids, 1 to 50 g / 1 free alkali metal cyanide, 1 to 50 g / 1 free alkali metal hydroxide and 0 to 50 g / 1 alkali carbonate.
  • Such copper-tin alloys are mainly deposited from alkaline, cyanide-containing electrohytes, which contain the tin as stannate.
  • Other Electrohytes contain phosphate and pyrophosphates as complexing agents and also colloids, such as polypeptides as gloss additives (DE-PS 860 300).
  • These known baths must be operated at high, constant temperatures (65 ° C. and higher) in order to obtain uniform layers of constant composition. The same applies to the setting of the cyanide and hydroxide concentration in the bath. Working with these baths is therefore difficult and cumbersome.
  • the baths preferably contain 1 to 3 g / 1 of these organic substances from one or more of groups a) to c).
  • the baths preferably contain 0.8 to 1.5 g / l of these brighteners. Since the compounds of group a) and b) are very sparingly soluble in water, they are advantageously first reacted with benzyl chloride or epichlorohydrin or rhodanide or sulfite to give water-soluble compounds.
  • the baths according to the invention can be operated with insoluble anodes, such as with stainless steel anodes.
  • the operating temperatures are between 38 and 58 ° C, the current densities between 0.4 and 3.0 A / dm 2 and the pH values between 11.5 and 12.5.
  • group b) for example, p-methoxybenzaldehyde (anisaldehyde), 4-hydroxy-3-methoxybenzaldehyde (vanillin) and cinnamaldehyde, from group c), for example butyne-2-diol-1, 4, butynediol monopropoxylate, propargyl alcohol and propargyl alcohol monoethoxylate have been found to be useful.
  • polyethylenediamines and benzyl are advantageously used pyridine carboxylates.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP84110792A 1983-11-02 1984-09-11 Bain alcalin de cyanure pour le dépôt électrolytique de couches à base d'alliage cuivre-étain Expired EP0143919B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3339541 1983-11-02
DE3339541A DE3339541C2 (de) 1983-11-02 1983-11-02 Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen

Publications (2)

Publication Number Publication Date
EP0143919A1 true EP0143919A1 (fr) 1985-06-12
EP0143919B1 EP0143919B1 (fr) 1987-07-29

Family

ID=6213210

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84110792A Expired EP0143919B1 (fr) 1983-11-02 1984-09-11 Bain alcalin de cyanure pour le dépôt électrolytique de couches à base d'alliage cuivre-étain

Country Status (6)

Country Link
US (2) US4565608A (fr)
EP (1) EP0143919B1 (fr)
JP (1) JPH06104914B2 (fr)
BR (1) BR8405398A (fr)
DE (2) DE3339541C2 (fr)
HK (1) HK57089A (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4336664A1 (de) * 1993-10-27 1995-05-04 Demetron Gmbh Werkstücke aus nichtkorrosionsbeständigen Metallen mit nach dem PVD-Verfahren aufgebrachten Überzügen
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
DE4426914C1 (de) * 1994-07-29 1995-08-17 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Kupfer-Zinn-Legierungen
EP1091023A3 (fr) * 1999-10-08 2003-05-14 Shipley Company LLC Composition d'alliage et procédé de plaquage
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
US6652731B2 (en) 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
CA2580791C (fr) * 2004-09-24 2010-04-27 Jarden Zinc Products, Inc. Metaux deposes par electrodeposition presentant un aspect blanc argente et procede de production
US7296370B2 (en) * 2004-09-24 2007-11-20 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
CN105297091A (zh) * 2015-12-01 2016-02-03 张颖 一种用于手表壳体的电镀方法
CN105297093A (zh) * 2015-12-01 2016-02-03 张颖 一种用于手表壳体的电镀镀液
US20230203694A1 (en) * 2021-12-29 2023-06-29 Basf Se Alkaline composition for copper electroplating comprising a grain refiner

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2256025C2 (de) * 1971-12-20 1982-03-25 M & T Chemicals Inc., New York, N.Y. Wäßriges saures Bad zur galvanischen Abscheidung von Zinn/Blei-Legierungsniederschlägen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2435967A (en) * 1945-02-27 1948-02-17 Westinghouse Electric Corp Bright alloy plating
US2436316A (en) * 1946-04-25 1948-02-17 Westinghouse Electric Corp Bright alloy plating
NL75841C (fr) * 1949-06-11
US2854388A (en) * 1955-03-14 1958-09-30 City Auto Stamping Co Electrodeposition of copper-tin alloys
US3440151A (en) * 1965-06-02 1969-04-22 Robert Duva Electrodeposition of copper-tin alloys
JPS5760092A (en) * 1980-09-29 1982-04-10 Seiko Instr & Electronics Ltd Copper-tin alloy plating bath
JPS5760435A (en) * 1980-09-30 1982-04-12 Toshiba Corp Data transfer controlling system
JPS5848689A (ja) * 1981-09-18 1983-03-22 Seiko Instr & Electronics Ltd 白色銅−スズ合金めつき浴
JPS5891181A (ja) * 1981-11-24 1983-05-31 Seiko Instr & Electronics Ltd 銅−スズ合金めつき浴

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2256025C2 (de) * 1971-12-20 1982-03-25 M & T Chemicals Inc., New York, N.Y. Wäßriges saures Bad zur galvanischen Abscheidung von Zinn/Blei-Legierungsniederschlägen

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, unexamined applications, C Field, Vol. 6, No. 135, 22. Juli 1982 THE PATENT OFFICE JAPANESE GOVERNMENT Seite 123 C 115 & JP-A-57 060092 (daini seikosha k.k.) *
PATENT ABSTRACTS OF JAPAN, unexamined applications, C Field, Vol. 7, No. 191, 20. August 1983 THE PATENT OFFICE JAPANESE GOVERNMENT Seite 2 C 182 & JP-A-58 091181 (daini seikosha k.k.) *

Also Published As

Publication number Publication date
DE3465114D1 (en) 1987-09-03
US4605474A (en) 1986-08-12
BR8405398A (pt) 1985-09-03
DE3339541C2 (de) 1986-08-07
US4565608A (en) 1986-01-21
DE3339541A1 (de) 1985-05-15
JPH06104914B2 (ja) 1994-12-21
JPS60114589A (ja) 1985-06-21
EP0143919B1 (fr) 1987-07-29
HK57089A (en) 1989-07-21

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