EP0143919B1 - Bain alcalin de cyanure pour le dépôt électrolytique de couches à base d'alliage cuivre-étain - Google Patents
Bain alcalin de cyanure pour le dépôt électrolytique de couches à base d'alliage cuivre-étain Download PDFInfo
- Publication number
- EP0143919B1 EP0143919B1 EP84110792A EP84110792A EP0143919B1 EP 0143919 B1 EP0143919 B1 EP 0143919B1 EP 84110792 A EP84110792 A EP 84110792A EP 84110792 A EP84110792 A EP 84110792A EP 0143919 B1 EP0143919 B1 EP 0143919B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- general formula
- cyanide bath
- cyanide
- alkaline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 0 *c1ccc(cccc2)c2c1 Chemical compound *c1ccc(cccc2)c2c1 0.000 description 1
- JWAZRIHNYRIHIV-UHFFFAOYSA-N Oc1ccc(cccc2)c2c1 Chemical compound Oc1ccc(cccc2)c2c1 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Definitions
- the invention relates to an alkaline cyanide bath for the electrodeposition of bare to shiny copper-tin alloy coatings, in particular copper-tin alloy coatings with 45 to 60% copper, the 1 to 60 g / l copper in the form of copper cyanide, 7 to 30 g / I tin in the form of stannate, 0.1 to 100 g / I of one or more complexing agents from the group phosphate, polyphosphate, phosphonate and polyoxycarboxylic acids, 1 to 50 g / I free alkali metal cyanide, 1 to 50 g / I free alkali metal hydroxide and 0 contains up to 50 g / l alkali carbonate.
- Such copper-tin alloys are mainly deposited from alkaline, cyanide-containing electrohytes, which contain the tin as stannate.
- Other electrohytes contain phosphate and pyrophosphates as complexing agents and also colloids, such as.
- These known baths have to be operated at high, constant temperatures (65 ° C. and higher) in order to obtain uniform layers of constant composition. The same applies to the setting of the cyanide and hydroxide concentration in the bath. Working with these baths is therefore difficult and cumbersome.
- the baths preferably contain 1 to 3 g / l of these organic substances from one or more of groups a) to c).
- the baths preferably contain 0.8 to 1.5 g / l of these brighteners. Since the compounds of group a) and b) are very sparingly soluble in water, they are advantageously first reacted with benzyl chloride or epichlorohydrin or rhodanide or sulfite to give water-soluble compounds.
- the baths of the invention can be operated with insoluble anodes, such as. B. with stainless steel anodes.
- the operating temperatures are between 38 and 58 ° C, the current densities between 0.4 and 3.0 A / dm 2 and the pH values between 11.5 and 12.5.
- Baths containing 2 to 10 g copper in the form of copper cyanide, 10 to 20 g / l tin in the form of alkali tannate, 10 to 50 g / l complexing agent, 5 to 30 g / l free alkali metal cyanide, 5 to 30 g / I contain free alkali hydroxide, 5 to 20 g / l alkali carbonate, 1 to 3 g / l of the organic substance and 0.8 to 1.5 g / l gloss additive.
- B. butyne-2-diol-1,4, butynediol monopropoxylate, propargyl alcohol and propargyl alcohol monoethoxylate have been found to be useful.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Claims (5)
dans des proportions de 0,05 à 5 g/I.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3339541 | 1983-11-02 | ||
DE3339541A DE3339541C2 (de) | 1983-11-02 | 1983-11-02 | Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0143919A1 EP0143919A1 (fr) | 1985-06-12 |
EP0143919B1 true EP0143919B1 (fr) | 1987-07-29 |
Family
ID=6213210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP84110792A Expired EP0143919B1 (fr) | 1983-11-02 | 1984-09-11 | Bain alcalin de cyanure pour le dépôt électrolytique de couches à base d'alliage cuivre-étain |
Country Status (6)
Country | Link |
---|---|
US (2) | US4565608A (fr) |
EP (1) | EP0143919B1 (fr) |
JP (1) | JPH06104914B2 (fr) |
BR (1) | BR8405398A (fr) |
DE (2) | DE3339541C2 (fr) |
HK (1) | HK57089A (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4336664A1 (de) * | 1993-10-27 | 1995-05-04 | Demetron Gmbh | Werkstücke aus nichtkorrosionsbeständigen Metallen mit nach dem PVD-Verfahren aufgebrachten Überzügen |
DE4324995C2 (de) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen |
DE4426914C1 (de) * | 1994-07-29 | 1995-08-17 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Kupfer-Zinn-Legierungen |
EP1091023A3 (fr) * | 1999-10-08 | 2003-05-14 | Shipley Company LLC | Composition d'alliage et procédé de plaquage |
JP3455712B2 (ja) * | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | 銅−スズ合金めっき用ピロリン酸浴 |
US6652731B2 (en) | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
ES2531163T3 (es) * | 2002-10-11 | 2015-03-11 | Enthone | Procedimiento y electrolito para la deposición galvánica de bronces |
CA2580791C (fr) * | 2004-09-24 | 2010-04-27 | Jarden Zinc Products, Inc. | Metaux deposes par electrodeposition presentant un aspect blanc argente et procede de production |
US7296370B2 (en) * | 2004-09-24 | 2007-11-20 | Jarden Zinc Products, Inc. | Electroplated metals with silvery-white appearance and method of making |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
CN105297091A (zh) * | 2015-12-01 | 2016-02-03 | 张颖 | 一种用于手表壳体的电镀方法 |
CN105297093A (zh) * | 2015-12-01 | 2016-02-03 | 张颖 | 一种用于手表壳体的电镀镀液 |
US20230203694A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline composition for copper electroplating comprising a grain refiner |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2435967A (en) * | 1945-02-27 | 1948-02-17 | Westinghouse Electric Corp | Bright alloy plating |
US2436316A (en) * | 1946-04-25 | 1948-02-17 | Westinghouse Electric Corp | Bright alloy plating |
NL75841C (fr) * | 1949-06-11 | |||
US2854388A (en) * | 1955-03-14 | 1958-09-30 | City Auto Stamping Co | Electrodeposition of copper-tin alloys |
US3440151A (en) * | 1965-06-02 | 1969-04-22 | Robert Duva | Electrodeposition of copper-tin alloys |
AU473877B2 (en) * | 1971-12-20 | 1976-07-08 | M And T Chemicals Inc. | Tin-lead alloy plating |
JPS5760092A (en) * | 1980-09-29 | 1982-04-10 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
JPS5760435A (en) * | 1980-09-30 | 1982-04-12 | Toshiba Corp | Data transfer controlling system |
JPS5848689A (ja) * | 1981-09-18 | 1983-03-22 | Seiko Instr & Electronics Ltd | 白色銅−スズ合金めつき浴 |
JPS5891181A (ja) * | 1981-11-24 | 1983-05-31 | Seiko Instr & Electronics Ltd | 銅−スズ合金めつき浴 |
-
1983
- 1983-11-02 DE DE3339541A patent/DE3339541C2/de not_active Expired
-
1984
- 1984-09-11 DE DE8484110792T patent/DE3465114D1/de not_active Expired
- 1984-09-11 EP EP84110792A patent/EP0143919B1/fr not_active Expired
- 1984-10-24 BR BR8405398A patent/BR8405398A/pt not_active IP Right Cessation
- 1984-10-30 US US06/666,318 patent/US4565608A/en not_active Expired - Fee Related
- 1984-11-01 JP JP59229053A patent/JPH06104914B2/ja not_active Expired - Lifetime
-
1985
- 1985-08-26 US US06/769,343 patent/US4605474A/en not_active Expired - Fee Related
-
1989
- 1989-07-13 HK HK570/89A patent/HK57089A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE3465114D1 (en) | 1987-09-03 |
US4605474A (en) | 1986-08-12 |
BR8405398A (pt) | 1985-09-03 |
EP0143919A1 (fr) | 1985-06-12 |
DE3339541C2 (de) | 1986-08-07 |
US4565608A (en) | 1986-01-21 |
DE3339541A1 (de) | 1985-05-15 |
JPH06104914B2 (ja) | 1994-12-21 |
JPS60114589A (ja) | 1985-06-21 |
HK57089A (en) | 1989-07-21 |
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