EP0143919B1 - Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers - Google Patents
Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers Download PDFInfo
- Publication number
- EP0143919B1 EP0143919B1 EP84110792A EP84110792A EP0143919B1 EP 0143919 B1 EP0143919 B1 EP 0143919B1 EP 84110792 A EP84110792 A EP 84110792A EP 84110792 A EP84110792 A EP 84110792A EP 0143919 B1 EP0143919 B1 EP 0143919B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- general formula
- cyanide bath
- cyanide
- alkaline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 0 *c1ccc(cccc2)c2c1 Chemical compound *c1ccc(cccc2)c2c1 0.000 description 1
- JWAZRIHNYRIHIV-UHFFFAOYSA-N Oc1ccc(cccc2)c2c1 Chemical compound Oc1ccc(cccc2)c2c1 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Die Erfindung betrifft ein alkalisch-cyanidisches Bad zur galvanischen Abscheidung blanker bis glänzender Kupfer-Zinn-Legierungsüberzüge, insbesondere Kupfer-Zinn-Legierungsüberzüge mit 45 bis 60 % Kupfer, das 1 bis 60 g/I Kupfer in Form von Kupfercyanid, 7 bis 30 g/I Zinn in Form von Stannat, 0,1 bis 100 g/I eines oder mehrerer Komplexbildner aus der Gruppe Phosphat, Polyphosphat, Phosphonat und Polyoxycarbonsäuren, 1 bis 50 g/I freies Alkalicyanid, 1 bis 50 g/I freies Alkalihydroxid und 0 bis 50 g/I Alkalicarbonat enthält.The invention relates to an alkaline cyanide bath for the electrodeposition of bare to shiny copper-tin alloy coatings, in particular copper-tin alloy coatings with 45 to 60% copper, the 1 to 60 g / l copper in the form of copper cyanide, 7 to 30 g / I tin in the form of stannate, 0.1 to 100 g / I of one or more complexing agents from the group phosphate, polyphosphate, phosphonate and polyoxycarboxylic acids, 1 to 50 g / I free alkali metal cyanide, 1 to 50 g / I free alkali metal hydroxide and 0 contains up to 50 g / l alkali carbonate.
Es ist seit vielen Jahren bekannt, Kupfer-Zinn-Legierungsüberzüge aus galvanischen Bädern abzuscheiden. Insbesondere verwendet man überzüge, die 45 bis 60 % Kupfer enthalten, vorzugsweise 55 bis 60 % Kupfer, da diese einen hellen Silberglanz besitzen und nicht zum Anlaufen neigen. Sie finden daher Verwendung in der dekorativen Galvanotechnik als Ersatz für beispielsweise Silber, Chrom oder Aluminium. Wegen ihrer sehr guten Löteigenschaften, ihrer Abriebbeständigkeit und ihres niedrigen elektrischen Übergangswiderstandes finden Kupfer-Zinn-Legierungsüberzüge aber auch steigende technische Anwendung.It has been known for many years to deposit copper-tin alloy coatings from galvanic baths. In particular, coatings are used which contain 45 to 60% copper, preferably 55 to 60% copper, since these have a light silver luster and do not tend to tarnish. They are therefore used in decorative electroplating to replace silver, chrome or aluminum, for example. Because of their very good soldering properties, their abrasion resistance and their low electrical contact resistance, copper-tin alloy coatings are also used increasingly in technical applications.
Solche Kupfer-Zinn-Legierungen werden überwiegend aus alkalischen, cyanidhaltigen Elektrohyten abgeschieden, die das Zinn als Stannat enthalten. Andere Elektrohyte enthalten Phosphat und Pyrophosphate als Komplexbildner und außerdem Kolloide, wie z. B. Polypeptide als Glanzzusätze (DE-PS 860 300). Diese bekannten Bäder müssen bei hohen, konstanten Temperaturen (65 °C und höher) betrieben werden, um gleichmässige Schichten konstanter Zusammensetzung zu erhalten. Das gleiche gilt auch für die Einstellung der Cyanid- und Hydroxidkonzentration im Bad. Das Arbeiten mit diesen Bädern ist daher schwierig und umständlich.Such copper-tin alloys are mainly deposited from alkaline, cyanide-containing electrohytes, which contain the tin as stannate. Other electrohytes contain phosphate and pyrophosphates as complexing agents and also colloids, such as. B. polypeptides as gloss additives (DE-PS 860 300). These known baths have to be operated at high, constant temperatures (65 ° C. and higher) in order to obtain uniform layers of constant composition. The same applies to the setting of the cyanide and hydroxide concentration in the bath. Working with these baths is therefore difficult and cumbersome.
Es war Aufgabe der vorliegenden Erfindung, ein alkalisch-cyanidisches Bad zur galvanischen Abscheidung blanker bis glänzender Kupfer-Zinn-Legierungsüberzüge gemäß Oberbegriff von Anspruch 1 zu entwickeln, das bei niedrigeren Temperaturen betrieben werden kann und bei dem die Überzugzusammensetzung weniger stark von Schwankungen der Badbestandteile abhängig ist.It was an object of the present invention to develop an alkaline cyanide bath for the electrodeposition of bright to shiny copper-tin alloy coatings, which can be operated at lower temperatures and in which the coating composition is less dependent on fluctuations in the bath components is.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß das Bad noch eine oder mehrere organische Substanzen aus einer oder mehreren der folgenden Gruppen
- a) Fettsäure-amido-alkyl-dialkylaminoxide der allgemeinen Formel
- R1―CO―NH(CH2)n―N(R2)n→O, wobei
- R1 = Alkylgruppe mit 11-17 C-atomen
- R2 = Alkylgruppe mit 1-5 C-atomen
- n = 1-30 bedeuten,
- b) Fettsäure-amido-alkyl-dialkylamin-betaine der allgemeinen Formel
- R1―CO―NH(CH2)n―+N(R2)2―CH2―COO-, wobei
- R, = Alkylgruppe mit 11-17 C-atomen
- R2 = Alkylgruppe mit 1-5 C-atomen
- n = 1-30 bedeuten,
- c) Äthoxylierte Naphthole der allgemeinen Formel
- R2 = O-(CH2CH20)nH oder H
- n = 10, 12 oder 14 bedeuten
in Mengen von 0,05 bis 5 g/I enthält.This object is achieved in that the bath one or more organic substances from one or more of the following groups
- a) Fatty acid amido-alkyl-dialkylamine oxides of the general formula
- R 1 ―CO ― NH (CH 2 ) n ―N (R 2 ) n → O, where
- R 1 = alkyl group with 11-17 carbon atoms
- R 2 = alkyl group with 1-5 carbon atoms
- n = 1-30 mean
- b) fatty acid-amido-alkyl-dialkylamine-betaine of the general formula
- R 1 ―CO ― NH (CH 2 ) n - + N (R 2 ) 2 ―CH 2 ―COO - , where
- R, = alkyl group with 11-17 carbon atoms
- R 2 = alkyl group with 1-5 carbon atoms
- n = 1-30 mean
- c) Ethoxylated naphthols of the general formula
- R 2 = O- (CH 2 CH 2 0) n H or H
- n = 10, 12 or 14 mean
contains in amounts of 0.05 to 5 g / l.
Besonders bewährt haben sich die entsprechenden β-Naphthole.The corresponding β-naphthols have proven particularly useful.
Vorzugsweise enthalten die Bäder 1 bis 3 g/I dieser organischen Substanzen aus einer oder mehreren der Gruppen a) bis c).The baths preferably contain 1 to 3 g / l of these organic substances from one or more of groups a) to c).
Die aus solchen Bädern abgeschiedenen Überzüge sind blank, aber noch nicht glänzend. Zur Abscheidung glänzender Kupfer-Zinn-Legierungsüberzüge setzt man dem Bad noch zusätzlich 0,05 bis 2 g/l eines oder mehrerer Glanzmittel zu, ausgewählt aus einer oder mehreren der folgenden Gruppen :
- a) Polyäthylendiamine der allgemeinen Formel H2N-(CH2)n-NH2 mit n = 6-100 bzw. deren Umsetzungsprodukte mit Benzylchlorid oder Epichlorhydrin
- b) Benzaldehyde mit einer oder mehreren Hydroxy- und/oder Alkoxygruppen am Kern und Zimtaldehyd bzw. deren Umsetzungsprodukte mit Rhodaniden und Sulfiten.
- c) Äthinole, Äthindiole und deren Äthoxylate und Propoxylate der allgemeinen Formel
- R1C ≡ C―CH2―OR2
- mit R1 = H oder CH20R2 und R2 = H, C2H5 oder C3H7
- d) Benzylpyridincarboxylate der Formel
- a) Polyethylenediamines of the general formula H 2 N- (CH 2 ) n- NH 2 with n = 6-100 or their reaction products with benzyl chloride or epichlorohydrin
- b) Benzaldehydes with one or more hydroxyl and / or alkoxy groups on the core and cinnamaldehyde or their reaction products with rhodanides and sulfites.
- c) ethynols, ethylenediols and their ethoxylates and propoxylates of the general formula
- R 1 C ≡ C ― CH 2 ―OR 2
- with R 1 = H or CH 2 0R 2 and R 2 = H, C 2 H 5 or C 3 H 7
- d) benzylpyridinecarboxylates of the formula
Vorzugsweise enthalten die Bäder 0,8 bis 1,5 g/I dieser Glanzmittel. Da die Verbindungen der Gruppe a) und b) in Wasser sehr schwer löslich sind, werden sie vorteilhafterweise erst mit Benzylchlorid oder Epichlorhydrin bzw. Rhodanid oder Sulfit zu wasserlöslichen Verbindungen umgesetzt.The baths preferably contain 0.8 to 1.5 g / l of these brighteners. Since the compounds of group a) and b) are very sparingly soluble in water, they are advantageously first reacted with benzyl chloride or epichlorohydrin or rhodanide or sulfite to give water-soluble compounds.
Die erfindungsgemäßen Bäder können mit unlöslichen Anoden betrieben werden, wie z. B. mit Edelstahlanoden. Die Betriebstemperaturen liegen bei 38 bis 58 °C, die Stromdichten zwischen 0,4 und 3,0 A/dm2 und die pH-Werte zwischen 11,5 und 12,5.The baths of the invention can be operated with insoluble anodes, such as. B. with stainless steel anodes. The operating temperatures are between 38 and 58 ° C, the current densities between 0.4 and 3.0 A / dm 2 and the pH values between 11.5 and 12.5.
Bewährt haben sich Bäder, die 2 bis 10 g Kupfer in Form von Kupfercyanid, 10 bis 20 g/I Zinn in Form von Alkalistannat, 10 bis 50 g/I Komplexbildner, 5 bis 30 g/I freies Alkalicyanid, 5 bis 30 g/I freies Alkalihydroxid, 5 bis 20 g/l Alkalicarbonat, 1 bis 3 g/l der organischen Substanz und 0,8 bis 1,5 g/l Glanzzusatz enthalten.Baths containing 2 to 10 g copper in the form of copper cyanide, 10 to 20 g / l tin in the form of alkali tannate, 10 to 50 g / l complexing agent, 5 to 30 g / l free alkali metal cyanide, 5 to 30 g / I contain free alkali hydroxide, 5 to 20 g / l alkali carbonate, 1 to 3 g / l of the organic substance and 0.8 to 1.5 g / l gloss additive.
Als Glanzzusätze haben sich aus der Gruppe b) z. B. p-Methoxybenzaldehyd (Anisaldehyd), 4-Hydroxy-3-Methoxy-benzaldehyd (Vanillin) und Zimtaldehyd, aus der Gruppe c) z. B. Butin-2-diol-1,4, Butindiolmonopropoxylat, Propargylalkohol und Propargylalkoholmonoäthoxylat als brauchbar erwiesen. Vorteilhafterweise verwendet man jedoch Polyäthylendiamine und Benzylpyridincarboxylate.From group b) z. B. p-methoxybenzaldehyde (anisaldehyde), 4-hydroxy-3-methoxybenzaldehyde (vanillin) and cinnamaldehyde, from group c) z. B. butyne-2-diol-1,4, butynediol monopropoxylate, propargyl alcohol and propargyl alcohol monoethoxylate have been found to be useful. However, it is advantageous to use polyethylene diamines and benzyl pyridine carboxylates.
Folgende Beispiele sollen das erfindungsgemäße Bad näher erläutern.
- 1. Aus einem Bad mit 8,4 g/I Kupfer(I)cyanid, 58 g/I Natriumstannat, 25 g/I Kaliumnatriumtartrat, 25 g/l Tetranatriumdiphosphat, je 20 g/l freies Natriumcyanid und Natriumhydroxid, 15 g/I Natriumcarbonat und 0,3 g/I äthoxyliertes β-Naphthol mit n = 12 (Durchschnittswert) werden bei einer Temperatur von 58 °C und einer Stromdichte von 1 A/dm2 in 50 Minuten 5 µm starke, blanke, weiße Überzüge erhalten, die 53 % Kuper enthalten und nicht anlaufen.
- 2. Aus einem Bad mit 2,8 g/I Kupfer(I)cyanid, 46,4 g/I Natriumstannat, 25 g/I Kaliumnatriumtartrat, 25 g/I Tetranatriumdiphosphat, je 20 g/I Natriumcyanid und Natriumhydroxid, 15 g/I Natriumcarbonat, 0,3 g/l eines Fettsäure-amido-alkyl-dialkylamin-betains (mit R1 = C15, R2 = Methyl und n = 6) und 1,1 g/I Butin-2-diol-1,4 erhält man bei 42 %C und 1 A/dm2 in einer Stunde 5 µm starke weiße Überzüge, die 49 % Kupfer enthalten und hochglänzend sind.
- 3. Aus einem Bad mit 2,8 g/I Kupfer(I)cyanid, 46,4 g/l Natriumstannat, 25 g/l Tetranatriumdiphosphat, 25 g/I Dikaliumtartrat, 16 g/I freies Kaliumcyanid, 14 g/I freies Kaliumhydroxid, 1 g/l eines Fettsäure-amido-alkyl-dialkylaminoxides (R1 = C12, R2 = Propyl, n = 4) und 0,7 g/I Benzylpyridincarboxylat wird bei 42 °C mit 1 A/dm2 ein weißer, glänzender Überzug mit einem Kupfergehalt von 50 % abgeschieden.
- 4. Durch Erhöhung des Cu/Sn-Verhältnisses im Bad lassen sich auch goldgelbe und rosa Kupfer-Zinn-Legierungsüberzüge abscheiden. Aus einem Bad mit 8,4 g/I Kupfer(I)cyanid, 48 g/I Natriumstannat, 40 g/I Dikaliumphosphat, 25 g/I Tetranatriumdiphosphat, 16 g/l Natriumcyanid, 12 g/I Natriumhydroxid, 15 g/I Natriumcarbonat, 2 g/l äthoxyliertes β-Naphthol (mit n = 10) und 0,2 g/I Vanillin erhält man bei 45 °C und 1 A/dm2 goldgelbe, glänzende Überzüge mit 70 % Kupfer.
- 1. From a bath with 8.4 g / l copper (I) cyanide, 58 g / l sodium stannate, 25 g / l potassium sodium tartrate, 25 g / l tetrasodium diphosphate, each 20 g / l free sodium cyanide and sodium hydroxide, 15 g / l Sodium carbonate and 0.3 g / l of ethoxylated β-naphthol with n = 12 (average value) are obtained at a temperature of 58 ° C and a current density of 1 A / dm 2 in 50 minutes 5 µm thick, bright, white coatings, which Contains 53% copper and does not tarnish.
- 2. From a bath with 2.8 g / l copper (I) cyanide, 46.4 g / l sodium stannate, 25 g / l potassium sodium tartrate, 25 g / l tetrasodium diphosphate, each 20 g / l sodium cyanide and sodium hydroxide, 15 g / I sodium carbonate, 0.3 g / l of a fatty acid amido-alkyl-dialkylamine betaine (with R 1 = C 15 , R 2 = methyl and n = 6) and 1.1 g / I butyn-2-diol-1 , 4, at 42% C and 1 A / dm 2, 5 µm thick white coatings containing 49% copper and having a high gloss are obtained in one hour.
- 3. From a bath with 2.8 g / l copper (I) cyanide, 46.4 g / l sodium stannate, 25 g / l tetrasodium diphosphate, 25 g / l dipotassium tartrate, 16 g / l free potassium cyanide, 14 g / l free Potassium hydroxide, 1 g / l of a fatty acid-amido-alkyl-dialkylamine oxide (R 1 = C 12 , R 2 = propyl, n = 4) and 0.7 g / l of benzylpyridinecarboxylate is at 42 A with 1 A / dm 2 white, shiny coating with a copper content of 50% deposited.
- 4. By increasing the Cu / Sn ratio in the bath, gold-yellow and pink copper-tin alloy coatings can also be deposited. From a bath with 8.4 g / l copper (I) cyanide, 48 g / l sodium stannate, 40 g / l dipotassium phosphate, 25 g / l tetrasodium diphosphate, 16 g / l sodium cyanide, 12 g / l sodium hydroxide, 15 g / l Sodium carbonate, 2 g / l of ethoxylated β-naphthol (with n = 10) and 0.2 g / l of vanillin are obtained at 45 ° C. and 1 A / dm 2 shiny gold-yellow coatings with 70% copper.
Claims (5)
in quantities of from 0.05 to 5 g/I.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3339541A DE3339541C2 (en) | 1983-11-02 | 1983-11-02 | Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings |
DE3339541 | 1983-11-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0143919A1 EP0143919A1 (en) | 1985-06-12 |
EP0143919B1 true EP0143919B1 (en) | 1987-07-29 |
Family
ID=6213210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP84110792A Expired EP0143919B1 (en) | 1983-11-02 | 1984-09-11 | Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers |
Country Status (6)
Country | Link |
---|---|
US (2) | US4565608A (en) |
EP (1) | EP0143919B1 (en) |
JP (1) | JPH06104914B2 (en) |
BR (1) | BR8405398A (en) |
DE (2) | DE3339541C2 (en) |
HK (1) | HK57089A (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4336664A1 (en) * | 1993-10-27 | 1995-05-04 | Demetron Gmbh | Workpieces made of non-corrosion-resistant metals with coatings applied using the PVD process |
DE4324995C2 (en) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
DE4426914C1 (en) * | 1994-07-29 | 1995-08-17 | Heraeus Gmbh W C | Bath for galvanically depositing copper@-tin@ alloys |
EP1091023A3 (en) * | 1999-10-08 | 2003-05-14 | Shipley Company LLC | Alloy composition and plating method |
JP3455712B2 (en) * | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
US6652731B2 (en) | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
ES2531163T3 (en) * | 2002-10-11 | 2015-03-11 | Enthone | Procedure and electrolyte for galvanic deposition of bronzes |
US7296370B2 (en) * | 2004-09-24 | 2007-11-20 | Jarden Zinc Products, Inc. | Electroplated metals with silvery-white appearance and method of making |
KR100906008B1 (en) * | 2004-09-24 | 2009-07-06 | 자덴 징크 프로덕츠, 인코포레이티드 | Electroplated metals with silvery-white appearance and method of making |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
CN105297093A (en) * | 2015-12-01 | 2016-02-03 | 张颖 | Electroplating liquid for watch shell |
CN105297091A (en) * | 2015-12-01 | 2016-02-03 | 张颖 | Electroplating method for watch shell |
US20230203694A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline composition for copper electroplating comprising a grain refiner |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2435967A (en) * | 1945-02-27 | 1948-02-17 | Westinghouse Electric Corp | Bright alloy plating |
US2436316A (en) * | 1946-04-25 | 1948-02-17 | Westinghouse Electric Corp | Bright alloy plating |
BE496261A (en) * | 1949-06-11 | |||
US2854388A (en) * | 1955-03-14 | 1958-09-30 | City Auto Stamping Co | Electrodeposition of copper-tin alloys |
US3440151A (en) * | 1965-06-02 | 1969-04-22 | Robert Duva | Electrodeposition of copper-tin alloys |
AU473877B2 (en) * | 1971-12-20 | 1976-07-08 | M And T Chemicals Inc. | Tin-lead alloy plating |
JPS5760092A (en) * | 1980-09-29 | 1982-04-10 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
JPS5760435A (en) * | 1980-09-30 | 1982-04-12 | Toshiba Corp | Data transfer controlling system |
JPS5848689A (en) * | 1981-09-18 | 1983-03-22 | Seiko Instr & Electronics Ltd | White copper-tin alloy plating bath |
JPS5891181A (en) * | 1981-11-24 | 1983-05-31 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
-
1983
- 1983-11-02 DE DE3339541A patent/DE3339541C2/en not_active Expired
-
1984
- 1984-09-11 DE DE8484110792T patent/DE3465114D1/en not_active Expired
- 1984-09-11 EP EP84110792A patent/EP0143919B1/en not_active Expired
- 1984-10-24 BR BR8405398A patent/BR8405398A/en not_active IP Right Cessation
- 1984-10-30 US US06/666,318 patent/US4565608A/en not_active Expired - Fee Related
- 1984-11-01 JP JP59229053A patent/JPH06104914B2/en not_active Expired - Lifetime
-
1985
- 1985-08-26 US US06/769,343 patent/US4605474A/en not_active Expired - Fee Related
-
1989
- 1989-07-13 HK HK570/89A patent/HK57089A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE3465114D1 (en) | 1987-09-03 |
DE3339541C2 (en) | 1986-08-07 |
EP0143919A1 (en) | 1985-06-12 |
US4605474A (en) | 1986-08-12 |
US4565608A (en) | 1986-01-21 |
HK57089A (en) | 1989-07-21 |
JPH06104914B2 (en) | 1994-12-21 |
BR8405398A (en) | 1985-09-03 |
JPS60114589A (en) | 1985-06-21 |
DE3339541A1 (en) | 1985-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0143919B1 (en) | Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers | |
EP2116634B1 (en) | Modified copper-tin electrolyte and method of depositing bronze layers | |
DE2255728A1 (en) | ELECTROCHEMICAL PREPARATIONS AND PROCEDURES | |
EP0907767A1 (en) | Cyanide-free electroplating bath for deposition of gold and gold alloys | |
DE1496917A1 (en) | Electrolytic baths and processes for the production of galvanic coatings | |
EP0037535B1 (en) | Plating bath for depositing coatings of gold and gold alloys | |
EP0041208B1 (en) | Alkaline bath for the electrodeposition of pink to yellow coloured layers of gold alloys with low carat weight | |
DE4324995C2 (en) | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings | |
DE2930035C2 (en) | Galvanic bath and process for the deposition of a gold-cadmium-carbon alloy and electrical connection element with a contact material produced according to this process | |
DE2427408C2 (en) | Electroplating process for producing shiny or semi-shiny zinc layers as well as electrolyte for carrying out the process | |
EP0126921B1 (en) | Bath for the galvanic deposition of gold alloys | |
DE2445537A1 (en) | BATH FOR GALVANIC DEPOSITION OF GOLD | |
EP0194432B1 (en) | Bath for the galvanic deposition of gold-tin alloy coatings | |
DE2032867C3 (en) | Galvanic gold bath and process for the deposition of even, thick gold coatings | |
EP4146848B1 (en) | Silver electrolyte for separating silver dispersion layers | |
DE2439656C2 (en) | Aqueous acid bath for the electrodeposition of a tin-nickel alloy | |
GB2086940A (en) | Composition and Process for High Speed Electrodeposition of Silver | |
DE843785C (en) | Process for the production of hard galvanic silver coatings | |
DE102020133188A1 (en) | Silver bismuth electrolyte for the deposition of hard silver layers | |
EP0769081A1 (en) | Method of coating metal surfaces with copper or copper alloys | |
DE102020131371A1 (en) | Ruthenium alloy layer and their layer combinations | |
EP0239876A1 (en) | Bath for electroplating silver-palladium alloys | |
DE1496741A1 (en) | Cyanide bath for the electrolytic deposition of shiny hard silver coatings | |
DD226309A1 (en) | ELECTROLYTE FOR THE GALVANIC DEPOSITION OF A GOLD NICKEL ALLOY |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19840911 |
|
AK | Designated contracting states |
Designated state(s): CH DE FR GB LI |
|
17Q | First examination report despatched |
Effective date: 19860603 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): CH DE FR GB LI |
|
REF | Corresponds to: |
Ref document number: 3465114 Country of ref document: DE Date of ref document: 19870903 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19950904 Year of fee payment: 12 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Effective date: 19960911 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19960911 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20030919 Year of fee payment: 20 Ref country code: CH Payment date: 20030919 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20030925 Year of fee payment: 20 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20040910 Ref country code: CH Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20040910 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |