EP0143919A1 - Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers - Google Patents
Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers Download PDFInfo
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- EP0143919A1 EP0143919A1 EP84110792A EP84110792A EP0143919A1 EP 0143919 A1 EP0143919 A1 EP 0143919A1 EP 84110792 A EP84110792 A EP 84110792A EP 84110792 A EP84110792 A EP 84110792A EP 0143919 A1 EP0143919 A1 EP 0143919A1
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- copper
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- carbon atoms
- cyanide
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Definitions
- the invention relates to an alkaline cyanide bath for the galvanic deposition of bare to shiny copper-tin alloy coatings, in particular copper-tin alloy coatings with 45 to 60% copper, consisting of 1 to 60 g / 1 copper in the form of copper cyanide, 7 to 30 g / 1 tin in the form of stannate, 0.1 to 100 g / 1 of one or more complexing agents from the group phosphate, polyphosphate, phosphonate and polyoxycarboxylic acids, 1 to 50 g / 1 free alkali metal cyanide, 1 to 50 g / 1 free alkali metal hydroxide and 0 to 50 g / 1 alkali carbonate.
- Such copper-tin alloys are mainly deposited from alkaline, cyanide-containing electrohytes, which contain the tin as stannate.
- Other Electrohytes contain phosphate and pyrophosphates as complexing agents and also colloids, such as polypeptides as gloss additives (DE-PS 860 300).
- These known baths must be operated at high, constant temperatures (65 ° C. and higher) in order to obtain uniform layers of constant composition. The same applies to the setting of the cyanide and hydroxide concentration in the bath. Working with these baths is therefore difficult and cumbersome.
- the baths preferably contain 1 to 3 g / 1 of these organic substances from one or more of groups a) to c).
- the baths preferably contain 0.8 to 1.5 g / l of these brighteners. Since the compounds of group a) and b) are very sparingly soluble in water, they are advantageously first reacted with benzyl chloride or epichlorohydrin or rhodanide or sulfite to give water-soluble compounds.
- the baths according to the invention can be operated with insoluble anodes, such as with stainless steel anodes.
- the operating temperatures are between 38 and 58 ° C, the current densities between 0.4 and 3.0 A / dm 2 and the pH values between 11.5 and 12.5.
- group b) for example, p-methoxybenzaldehyde (anisaldehyde), 4-hydroxy-3-methoxybenzaldehyde (vanillin) and cinnamaldehyde, from group c), for example butyne-2-diol-1, 4, butynediol monopropoxylate, propargyl alcohol and propargyl alcohol monoethoxylate have been found to be useful.
- polyethylenediamines and benzyl are advantageously used pyridine carboxylates.
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- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Es wird eine Badzusammensetzung zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen angegeben, die neben den üblichen Bestandteilen (Kupfercyanid, Stannat, Komplexbildner, freies Cyanid und Hydroxid) noch organische Substanzen aus einer oder mehreren der folgenden Gruppen enthält: a) Fettsäure-amido-alkyl-dialkylaminoxide der allgemeinen Formel R1CO-NH(CH2)n - N(R2)2 → 0, wobei R1 = Alkylgruppe mit 11 bis 17 c-atomen R2= Alkylgruppe mit 1 bis 5 C-atomen n= 1 - 30 bedeuten, b) Fettsäure-amido-alkyl-dialkylamin-betaine der allgemeinen Formel R1CO-NH(CH2)n - <⊕>N(R2)2 - CH2COO <⊖>, wobei R1= Alkylgruppe mit 11 bis 17 C-atomen R2= Alkylgruppe mit 1 bis 5 C-atomen n= 1 - 30 bedeuten, c) Äthoxylierte Naphthole der allgemeinen Formel <IMAGE> wobei R1= H oder O(CH2-CH2O)nH, R2= O(CH2CH2O)nH oder H n= 12, 12 oder 14 bedeuten in Mengen von 0,05 bis 5 g/l.A bath composition for the galvanic deposition of copper-tin alloy coatings is specified which, in addition to the usual constituents (copper cyanide, stannate, complexing agent, free cyanide and hydroxide), also contains organic substances from one or more of the following groups: a) fatty acid amido alkyl-dialkylamine oxides of the general formula R1CO-NH (CH2) n - N (R2) 2 → 0, where R1 = alkyl group with 11 to 17 carbon atoms R2 = alkyl group with 1 to 5 carbon atoms n = 1-30, b) Fatty acid amido-alkyl-dialkylamine betaine of the general formula R1CO-NH (CH2) n - <⊕> N (R2) 2 - CH2COO <⊖>, where R1 = alkyl group with 11 to 17 carbon atoms R2 = alkyl group with 1 to 5 carbon atoms n = 1-30, c) ethoxylated naphthols of the general formula <IMAGE> where R1 = H or O (CH2-CH2O) nH, R2 = O (CH2CH2O) nH or H n = 12, 12 or 14 mean in amounts of 0.05 to 5 g / l.
Description
Die Erfindung betrifft ein alkalisch-cyanidisches Bad zur galvanischen Abscheidung blanker bis glänzender Kupfer-Zinn-Legierungsüberzüge, insbesondere Kupfer-Zinn-Legierungsüberzüge mit 45 bis 60 % Kupfer, bestehend aus 1 bis 60 g/1 Kupfer in Form von Kupfercyanid, 7 bis 30 g/1 Zinn in Form von Stannat, 0,1 bis 100 g/1 eines oder mehrerer Komplexbildner aus der Gruppe Phosphat, Polyphosphat, Phosphonat und Polyoxycarbonsäuren, 1 bis 50 g/1 freies Alkalicyanid, 1 bis 50 g/1 freies Alkalihydroxid und 0 bis 50 g/1 Alkalicarbonat.The invention relates to an alkaline cyanide bath for the galvanic deposition of bare to shiny copper-tin alloy coatings, in particular copper-tin alloy coatings with 45 to 60% copper, consisting of 1 to 60 g / 1 copper in the form of copper cyanide, 7 to 30 g / 1 tin in the form of stannate, 0.1 to 100 g / 1 of one or more complexing agents from the group phosphate, polyphosphate, phosphonate and polyoxycarboxylic acids, 1 to 50 g / 1 free alkali metal cyanide, 1 to 50 g / 1 free alkali metal hydroxide and 0 to 50 g / 1 alkali carbonate.
Es ist seit vielen Jahren bekannt, Kupfer-Zinn-Legierungsüberzüge aus galvanischen Bädern abzuscheiden. Insbesondere verwendet man überzüge, die 45 bis 60 % Kupfer enthalten, vorzugsweise 55 bis 60 % Kupfer, da diese einen hellen Silberglanz besitzen und nicht zum Anlaufen neigen. Sie finden daher Verwendung in der dekorativen Galvanotechnik als Ersatz für beispielsweise Silber, Chrom oder Aluminium. Wegen ihrer sehr guten Löteigenschaften, ihrer Abriebbeständigkeit und ihres niedrigen elektrischen Übergangswiderstandes finden Kupfer-Zinn-Legierungsüberzüge aber auch steigende technische Anwendung.It has been known for many years to deposit copper-tin alloy coatings from galvanic baths. In particular, coatings are used which contain 45 to 60% copper, preferably 55 to 60% copper, since these have a light silver luster and do not tend to tarnish. They are therefore used in decorative electroplating to replace silver, chrome or aluminum, for example. Because of their very good soldering properties, their abrasion resistance and their low electrical contact resistance, copper-tin alloy coatings are also used increasingly in technical applications.
Solche Kupfer-Zinn-Legierungen werden überwiegend aus alkalischen, cyanidhaltigen Elektrohyten abgeschieden, die das Zinn als Stannat enthalten. Andere Elektrohyte enthalten Phosphat und Pyrophosphate als Komplexbildner und außerdem Kolloide, wie z.B. Polypeptide als Glanzzusätze (DE-PS 860 300). Diese bekannten Bäder müssen bei hohen, konstanten Temperaturen (650C und höher) betrieben werden, um gleichmässige Schichten konstanter Zusammensetzung zu erhalten. Das gleiche gilt auch für die Einstellung der Cyanid- und Hydroxidkonzentration im Bad. Das Arbeiten mit diesen Bädern ist daher schwierig und umständlich.Such copper-tin alloys are mainly deposited from alkaline, cyanide-containing electrohytes, which contain the tin as stannate. Other Electrohytes contain phosphate and pyrophosphates as complexing agents and also colloids, such as polypeptides as gloss additives (DE-PS 860 300). These known baths must be operated at high, constant temperatures (65 ° C. and higher) in order to obtain uniform layers of constant composition. The same applies to the setting of the cyanide and hydroxide concentration in the bath. Working with these baths is therefore difficult and cumbersome.
Es war Aufgabe der vorliegenden Erfindung, ein alkalisch-cyanidisches Bad zur galvanischen Abscheidung blanker bis glänzender Kupfer-Zinn-Legierungsüberzüge gemäß Oberbegriff von Anspruch 1 zu entwickeln, das bei niedrigeren Temperaturen betrieben werden kann und bei dem die überzugzusammensetzung weniger stark von Schwankungen der Badbestandteile abhängig ist.It was an object of the present invention to develop an alkaline cyanide bath for the electrodeposition of bright to shiny copper-tin alloy coatings, which can be operated at lower temperatures and in which the coating composition is less dependent on fluctuations in the bath components is.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß das Bad eine oder mehrere organische Substanzen aus einer oder mehreren der folgenden Gruppen
- a) Fettsäure-amido-alkyl-dialkylaminoxide der allgemeinen Formel
- R1-CO-NH(CH2)n-N(R2)2-0, wobei
- R1=Alkylgruppe mit 11 - 17 C-atomen
- R2=Alkylgruppe mit 1 - 5 C-atomen
- n=l - 30 bedeuten,
- b) Fettsäure-amido-alkyl-dialkylamin-betaine der allgemeinen Formel
- R1-CO-NH(CH2)n-⊕N(R2)2-CHZ-COO⊖, wobei
- R1=Alkylgruppe mit 11 - 17 C-atomen
- R2=Alkylgruppe mit 1 - 5 C-atomen
- n=l - 30 bedeuten,
- c) Athoxyiierte Naphthole der allgemeinen Formel
- wobei R1= H oder 0-(CH2CH2O)nH
- R2= 0-(CN2CH2O)nH oder H
- n= 10, 12 oder 14 bedeuten
- a) Fatty acid amido-alkyl-dialkylamine oxides of the general formula
- R 1 -CO-NH (CH 2 ) n -N (R 2 ) 2 -0, where
- R 1 = alk y l group with 11-17 carbon atoms
- R 2 = alkyl group with 1 - 5 carbon atoms
- n = 1-30 mean
- b) fatty acid-amido-alkyl-dialkylamine-betaine of the general formula
- R 1 -CO-NH (CH 2 ) n -⊕N (R 2 ) 2 -CH Z -COO⊖, where
- R 1 = alkyl group with 11 - 17 carbon atoms
- R 2 = alk y l group with 1 - 5 carbon atoms
- n = 1-30 mean
- c) Athoxyated naphthols of the general formula
- where R 1 = H or 0- (CH 2 CH 2 O) n H
- R 2 = 0- (CN 2 CH 2 O) n H or H
- n = 10, 12 or 14 mean
Besonders bewährt haben sich die entsprechenden β-Naphthole.The corresponding β-naphthols have proven particularly useful.
Vorzugsweise enthalten die Bäder 1 bis 3 g/1 dieser organischen Substanzen aus einer oder mehreren der Gruppen a) bis c).The baths preferably contain 1 to 3 g / 1 of these organic substances from one or more of groups a) to c).
Die aus solchen Bädern abgeschiedenen Oberzüge sind blank, aber noch nicht glänzend. Zur Abscheidung glänzender Kupfer-Zinn-Legierungsüberzüge setzt man dem Bad noch zusätzlich 0,05 bis 2 g/1 eines oder mehrerer Glanzmittel zu, ausgewählt aus einer oder mehreren der folgenden Gruppen:
- a) Polyäthylendiamine der allgemeinen Formel H 2 N-(CH 2)n-NH2 mit n= 6 - 100 bzw. deren Umsetzungsprodukte mit Benzylchlorid oder Epichlorhydrin
- b) Benzaldehyde mit einer oder mehreren Hydroxy- und/ oder Alkoxygruppen am Kern und Zim taldehyd bzw. deren Umsetzungsprodukte mit Rhodaniden und Sulfiten.
- c) Athinole, Athindiole und deren Athoxylate und Propoxylate der allgemeinen Formel R1C=C-CH2-OR2 mit R1=H oder CH2OR2 und R2=H, C2H5 oder C3H7
- d) Benzylpyridincarboxylate der Formel (C6H5-CH2-C5H4N⊕-COONa)Ce⊖
- a) Polyethylenediamines of the general formula H 2 N- ( CH 2 ) n -NH 2 with n = 6-100 or their reaction products with benzyl chloride or epichlorohydrin
- b) Benzaldehydes with one or more hydroxyl and / or alkoxy groups on the core and cinnamaldehyde or their reaction products with rhodanides and sulfites.
- c) Athinols, Athindiole and their Athoxylate and Propoxylate of the general formula R 1 C = C-CH 2 -OR 2 with R 1 = H or CH 2 OR 2 and R 2 = H, C 2 H 5 or C 3 H 7
- d) benzylpyridinecarboxylates of the formula (C 6 H 5 -CH 2 -C 5 H 4 N⊕-COONa) Ce⊖
Vorzugsweise enthalten die Bäder 0,8 bis 1,5 g/1 dieser Glanzmittel. Da die Verbindungen der Gruppe a) und b) in Wasser sehr schwer löslich sind, werden sie vorteilhafterweise erst mit Benzylchlorid oder Epichlorhydrin bzw. Rhodanid oder Sulfit zu wasserlöslichen Verbindungen umgesetzt.The baths preferably contain 0.8 to 1.5 g / l of these brighteners. Since the compounds of group a) and b) are very sparingly soluble in water, they are advantageously first reacted with benzyl chloride or epichlorohydrin or rhodanide or sulfite to give water-soluble compounds.
Die erfindungsgemäßen Bäder können mit unlöslichen Anoden betrieben werden, wie z.B. mit Edelstahlanoden. Die Betriebstemperaturen liegen bei 38 bis 58°C, die Stromdichten zwischen 0,4 und 3,0 A/dm2 und die pH-Werte zwischen 11,5 und 12,5.The baths according to the invention can be operated with insoluble anodes, such as with stainless steel anodes. The operating temperatures are between 38 and 58 ° C, the current densities between 0.4 and 3.0 A / dm 2 and the pH values between 11.5 and 12.5.
Bewährt haben sich Bäder, die 2 bis 10 g Kupfer in Form von Kupfercyanid, 10 bis 20 g/l Zinn in Form von Alkalistannat, 10 bis 50 g/1 Komplexbildner, 5 bis 30 g/1 freies Alkalicyanid, 5 bis 30 g/1 freies Alkalihydroxid, 5 bis 20 g/1 Alkalicarbonat, 1 bis 3 g/1 der organischen Substanz und 0,8 bis 1,5 g/1 Glanzzusatz enthalten.Baths containing 2 to 10 g copper in the form of copper cyanide, 10 to 20 g / l tin in the form of alkali tannate, 10 to 50 g / 1 complexing agent, 5 to 30 g / 1 free alkali cyanide, 5 to 30 g / 1 free alkali hydroxide, 5 to 20 g / 1 alkali carbonate, 1 to 3 g / 1 of the organic substance and 0.8 to 1.5 g / 1 gloss additive.
Als Glanzzusätze haben sich aus der Gruppe b) z.B. p-Methoxybenzaldehyd (Anisaldehyd), 4-Hydroxy-3-Metho- xy-benzaldehyd (Vanillin) und Zi m taldehyd, aus der Gruppe c) z.B. Butin-2-diol-1,4, Butindiolmonopropoxylat, Propargylalkohol und Propargylalkoholmono- äthoxylat als brauchbar erwiesen. Vorteilhafterweise verwendet man jedoch Polyäthylendiamine und Benzylpyridincarboxylate.From group b), for example, p-methoxybenzaldehyde (anisaldehyde), 4-hydroxy-3-methoxybenzaldehyde (vanillin) and cinnamaldehyde, from group c), for example butyne-2-diol-1, 4, butynediol monopropoxylate, propargyl alcohol and propargyl alcohol monoethoxylate have been found to be useful. However, polyethylenediamines and benzyl are advantageously used pyridine carboxylates.
Folgende Beispiele sollen das erfindungsgemäße Bad näher erläutern.
- 1. Aus einem Bad mit 8,4 g/l Kupfer(I)cyanid, 58 g/l Natriumstannat, 25 g/1 Kaliumnatriumtartrat, 25 g/l Tetranatriumdiphosphat, je 20 g/l freies Natriumcyanid und Natriumhydroxid, 15 g/l Natriumcarbonat und 0,3 g/1 äthoxyliertes β-Naphthol mit n= 12 (Durchschnittswert) werden bei einer Temperatur von 58°C und einer Stromdichte von 1 A/dm2 in 50 Minuten 5 µm starke, blanke, weiße Oberzüge erhalten, die 53 % Kuper enthalten und nicht anlaufen.
- 2. Aus einem Bad mit 2,8 g/l Kupfer(I)cyanid, 46,4 g/1 Natriumstannat, 25 g/1 Kaliumnatriumtartrat, 25 g/1 Tetranatriumdiphosphat, je 20 g/1 Natriumcyanid und Natriumhydroxid, 15 g/l Natriumcarbonat, 0,3 g/1 eines Fettsäure-amido-alkyl-dialkylamin-betains (mit R1=C15, R 2 = Methyl und n= 6) und 1,1 g/1 Butin-2- diol-1,4 erhält man bei 42 % C und 1 A/dm2 in einer Stunde 5 µm starke weiße Überzüge, die 49 % Kupfer enthalten und hochglänzend sind.
- 3. Aus einem Bad mit 2,8 g/l Kupfer(I)cyanid, 46,4 g/1 Natriumstannat, 25 g/1 Tetranatriumdiphosphat, 25 g/1 Dikaliumtartrat, 16 g/1 freies Kaliumcyanid, 14 g/l freies Kaliumhydroxid, 1 g/1 eines Fettsäure-amido-alkyl-dialkylaminoxides (R1=C12, R2= Propyl, n= 4) und 0,7 g/l Benzylpyridincarboxylat wird bei 42°C mit 1 A/dm2 ein weißer, glänzender Oberzug mit einem Kupfergehalt von 50 % abgeschieden.
- 4. Aus einem Bad mit 1,4 g/l Kupfer(I)cyanid, 23,2 g/1 Natriumstannat, 25 g/l Natriumcitrat, 25 g/1 Natriumphosphat, je 13 g/l Kaliumcyanid und Kaliumhydroxid, 1 g/1 äthoxyliertes β-Naphthol (mit n= 10), 0,1 g/]l Polyathylendiamin (mit n= 50) und 0,02 g/1 Propargylalkohol erhält man bei 42° C und 0,8 A/dm2 glänzende weiße Überzüge (4 µm in 40 Minuten) mit 57 % Kupfer.
- 5. Durch Erhöhung des Cu/Sn-Verhältnisses im Bad lassen sich auch goldgelbe und rosa Kupfer-Zinn-legierungsüberzüge abscheiden. Aus einem Bad mit 8,4 g/1 Kupfer(I)cyanid, 48 g/1 Natriumstannat, 40 g/1 Dikaliumphosphat, 25 g/l Tetranatriumdiphosphat, 16 g/l Natriumcyanid, 12 g/l Natriumhydroxid, 15 g/1 Natriumcarbonat, 2 g/1 äthoxyliertes β-Naphthol (mit n= 10) und 0,2 g/1 Vanillin erhält man bei 45° C und 1 A/dm2 goldgelbe, glänzende Überzüge mit 70 % Kupfer.
- 1. From a bath with 8.4 g / l copper (I) cyanide, 58 g / l sodium stannate, 25 g / 1 potassium sodium tartrate, 25 g / l tetrasodium diphosphate, each 20 g / l free sodium cyanide and sodium hydroxide, 15 g / l Sodium carbonate and 0.3 g / 1 ethoxylated β-naphthol with n = 12 (average value) are obtained at a temperature of 58 ° C and a current density of 1 A / dm 2 in 50 minutes, 5 µm thick, bright, white coatings that Contains 53% copper and does not tarnish.
- 2. From a bath with 2.8 g / l copper (I) cyanide, 46.4 g / 1 sodium stannate, 25 g / 1 potassium sodium tartrate, 25 g / 1 tetrasodium diphosphate, each 20 g / 1 sodium cyanide and sodium hydroxide, 15 g / l sodium carbonate, 0.3 g / 1 of a fatty acid-amido-alkyl-dialkylamine betaine (with R 1 = C 15 , R 2 = methyl and n = 6) and 1.1 g / 1 of butyn-2-diol-1 , 4 is obtained at 42% C and 1 A / dm 2 in one hour 5 µm thick white coatings that contain 49% copper and are high gloss.
- 3. From a bath with 2.8 g / l copper (I) cyanide, 46.4 g / 1 sodium stannate, 25 g / 1 tetrasodium diphosphate, 25 g / 1 dipotassium tartrate, 16 g / 1 free potassium cyanide, 14 g / l free Potassium hydroxide, 1 g / 1 of a fatty acid-amido-alkyl-dialkylamine oxide (R 1 = C 12 , R 2 = propyl, n = 4) and 0.7 g / l benzylpyridinecarboxylate is at 42 ° C with 1 A / dm 2 white, shiny cover with a copper content of 50%.
- 4. From a bath with 1.4 g / l copper (I) cyanide, 23.2 g / 1 sodium stannate, 25 g / l sodium citrate, 25 g / 1 sodium phosphate, each 13 g / l potassium cyanide and potassium hydroxide, 1 g / 1 ethoxylated β-naphthol (with n = 10), 0.1 g /] l polyethylenediamine (with n = 50) and 0.02 g / 1 propargyl alcohol are obtained at 42 ° C and 0.8 A / dm 2 shiny white Plating (4 µm in 40 minutes) with 57% copper.
- 5. By increasing the Cu / Sn ratio in the bath, gold-yellow and pink copper-tin alloy coatings can also be deposited. From a bath with 8.4 g / 1 copper (I) cyanide, 48 g / 1 sodium stannate, 40 g / 1 dipotassium phosphate, 25 g / l tetrasodium diphosphate, 16 g / l sodium cyanide, 12 g / l sodium hydroxide, 15 g / 1 Sodium carbonate, 2 g / 1 ethoxylated β-naphthol (with n = 10) and 0.2 g / 1 vanillin are obtained at 45 ° C. and 1 A / dm 2 golden-yellow, shiny coatings with 70% copper.
Claims (5)
daß es eine oder mehrere organische Substanzen aus einer oder mehreren der folgenden Gruppen
that it is one or more organic substances from one or more of the following groups
daß es äthoxylierte β -Naphthole der allgemeinen Formel
that it is ethoxylated β-naphthols of the general formula
daß es 1 bis 3 g/1 der organischen-Substanzen enthält.3. Alkaline-cyanide bath according to claim 1 and 2, characterized in
that it contains 1 to 3 g / 1 of the organic substances.
dadurch gekennzeichnet,
daß es noch zusätzlich 0,05 - 2 g/1 eines oder mehrerer Glanzmittel enthält, ausgewählt aus einer oder mehreren der folgenden Gruppen
characterized,
that it additionally contains 0.05-2 g / 1 of one or more brighteners selected from one or more of the following groups
daß es 0,8 bis 1,5 g/1 Glanzzusatz enthält.5. alkaline cyanide bath according to claim 1 to 4, characterized in
that it contains 0.8 to 1.5 g / 1 gloss additive.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3339541 | 1983-11-02 | ||
DE3339541A DE3339541C2 (en) | 1983-11-02 | 1983-11-02 | Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0143919A1 true EP0143919A1 (en) | 1985-06-12 |
EP0143919B1 EP0143919B1 (en) | 1987-07-29 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP84110792A Expired EP0143919B1 (en) | 1983-11-02 | 1984-09-11 | Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers |
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Country | Link |
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US (2) | US4565608A (en) |
EP (1) | EP0143919B1 (en) |
JP (1) | JPH06104914B2 (en) |
BR (1) | BR8405398A (en) |
DE (2) | DE3339541C2 (en) |
HK (1) | HK57089A (en) |
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DE4336664A1 (en) * | 1993-10-27 | 1995-05-04 | Demetron Gmbh | Workpieces made of non-corrosion-resistant metals with coatings applied using the PVD process |
DE4324995C2 (en) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
DE4426914C1 (en) * | 1994-07-29 | 1995-08-17 | Heraeus Gmbh W C | Bath for galvanically depositing copper@-tin@ alloys |
EP1091023A3 (en) * | 1999-10-08 | 2003-05-14 | Shipley Company LLC | Alloy composition and plating method |
JP3455712B2 (en) * | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
US6652731B2 (en) | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
ES2531163T3 (en) * | 2002-10-11 | 2015-03-11 | Enthone | Procedure and electrolyte for galvanic deposition of bronzes |
KR100906008B1 (en) * | 2004-09-24 | 2009-07-06 | 자덴 징크 프로덕츠, 인코포레이티드 | Electroplated metals with silvery-white appearance and method of making |
US7296370B2 (en) * | 2004-09-24 | 2007-11-20 | Jarden Zinc Products, Inc. | Electroplated metals with silvery-white appearance and method of making |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
CN105297091A (en) * | 2015-12-01 | 2016-02-03 | 张颖 | Electroplating method for watch shell |
CN105297093A (en) * | 2015-12-01 | 2016-02-03 | 张颖 | Electroplating liquid for watch shell |
US20230203694A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline composition for copper electroplating comprising a grain refiner |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2256025C2 (en) * | 1971-12-20 | 1982-03-25 | M & T Chemicals Inc., New York, N.Y. | Aqueous acid bath for the galvanic deposition of tin / lead alloy deposits |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2435967A (en) * | 1945-02-27 | 1948-02-17 | Westinghouse Electric Corp | Bright alloy plating |
US2436316A (en) * | 1946-04-25 | 1948-02-17 | Westinghouse Electric Corp | Bright alloy plating |
NL75841C (en) * | 1949-06-11 | |||
US2854388A (en) * | 1955-03-14 | 1958-09-30 | City Auto Stamping Co | Electrodeposition of copper-tin alloys |
US3440151A (en) * | 1965-06-02 | 1969-04-22 | Robert Duva | Electrodeposition of copper-tin alloys |
JPS5760092A (en) * | 1980-09-29 | 1982-04-10 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
JPS5760435A (en) * | 1980-09-30 | 1982-04-12 | Toshiba Corp | Data transfer controlling system |
JPS5848689A (en) * | 1981-09-18 | 1983-03-22 | Seiko Instr & Electronics Ltd | White copper-tin alloy plating bath |
JPS5891181A (en) * | 1981-11-24 | 1983-05-31 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
-
1983
- 1983-11-02 DE DE3339541A patent/DE3339541C2/en not_active Expired
-
1984
- 1984-09-11 EP EP84110792A patent/EP0143919B1/en not_active Expired
- 1984-09-11 DE DE8484110792T patent/DE3465114D1/en not_active Expired
- 1984-10-24 BR BR8405398A patent/BR8405398A/en not_active IP Right Cessation
- 1984-10-30 US US06/666,318 patent/US4565608A/en not_active Expired - Fee Related
- 1984-11-01 JP JP59229053A patent/JPH06104914B2/en not_active Expired - Lifetime
-
1985
- 1985-08-26 US US06/769,343 patent/US4605474A/en not_active Expired - Fee Related
-
1989
- 1989-07-13 HK HK570/89A patent/HK57089A/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2256025C2 (en) * | 1971-12-20 | 1982-03-25 | M & T Chemicals Inc., New York, N.Y. | Aqueous acid bath for the galvanic deposition of tin / lead alloy deposits |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN, unexamined applications, C Field, Vol. 6, No. 135, 22. Juli 1982 THE PATENT OFFICE JAPANESE GOVERNMENT Seite 123 C 115 & JP-A-57 060092 (daini seikosha k.k.) * |
PATENT ABSTRACTS OF JAPAN, unexamined applications, C Field, Vol. 7, No. 191, 20. August 1983 THE PATENT OFFICE JAPANESE GOVERNMENT Seite 2 C 182 & JP-A-58 091181 (daini seikosha k.k.) * |
Also Published As
Publication number | Publication date |
---|---|
HK57089A (en) | 1989-07-21 |
DE3339541A1 (en) | 1985-05-15 |
JPS60114589A (en) | 1985-06-21 |
US4605474A (en) | 1986-08-12 |
DE3465114D1 (en) | 1987-09-03 |
JPH06104914B2 (en) | 1994-12-21 |
US4565608A (en) | 1986-01-21 |
BR8405398A (en) | 1985-09-03 |
EP0143919B1 (en) | 1987-07-29 |
DE3339541C2 (en) | 1986-08-07 |
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