EA201690947A1 - Композиции на основе термоотверждающихся смол со сверхнизкими диэлектрическими потерями и высококачественные слоистые материалы, производимые из них - Google Patents

Композиции на основе термоотверждающихся смол со сверхнизкими диэлектрическими потерями и высококачественные слоистые материалы, производимые из них

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EA201690947A1
EA201690947A1 EA201690947A EA201690947A EA201690947A1 EA 201690947 A1 EA201690947 A1 EA 201690947A1 EA 201690947 A EA201690947 A EA 201690947A EA 201690947 A EA201690947 A EA 201690947A EA 201690947 A1 EA201690947 A1 EA 201690947A1
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component
low dielectric
cyanate ester
layered materials
super
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EA201690947A
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English (en)
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Сахал Дас
Патрик Шипман
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НОВОСЕТ, ЭлЭлСи
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/40Polyesters derived from ester-forming derivatives of polycarboxylic acids or of polyhydroxy compounds, other than from esters thereof
    • C08G63/44Polyamides; Polynitriles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08F279/00Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
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    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/78Preparation processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2457/08PCBs, i.e. printed circuit boards
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    • C08J2351/00Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C08J2351/08Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
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    • C08L2666/66Substances characterised by their function in the composition
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    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
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    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0158Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0162Silicon containing polymer, e.g. silicone

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  • Chemical & Material Sciences (AREA)
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  • Medicinal Chemistry (AREA)
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  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

Композиция на основе термоотверждающейся смолы со сверхнизкими диэлектрическими потерями содержит по меньшей мере один цианатный сложноэфирный компонент (A) и по меньшей мере один реакционноспособный промежуточный компонент (B), который способен сополимеризоваться с указанным компонентом (A). Настоящее изобретение представляет собой цианатную сложноэфирную смолу вида: T-[W-(Z)/(H)W]-[W-(Z)/(H)-(OCN)/(R)], где T представляет собой 1,3,5-замещенный триазиновый фрагмент (CN); W представляет собой связующий атом между триазином и компонентом A или компонентом B; Z представляет собой компонент (A); H представляет собой компонент (B); OCN представляет собой концевую группу цианатного сложного эфира; R представляет собой реакционноспособную концевую группу компонента B; n представляет собой целое число, большее или равное 1; a f представляет собой массовую или мольную долю компонента A. Композиция характеризуется превосходными диэлектрическими свойствами и дает высококачественный слоистый материал для использования в многослойной печатной плате (МПП) с большим количеством слоев, препрегах, покрытой смолой меди (ПСМ), клеях для пленки, высокочастотных обтекателях антенн, радиочастотных (РЧ) слоистых материалах и различных композитах.
EA201690947A 2013-11-04 2014-10-21 Композиции на основе термоотверждающихся смол со сверхнизкими диэлектрическими потерями и высококачественные слоистые материалы, производимые из них EA201690947A1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/998,482 US9332637B2 (en) 2013-11-04 2013-11-04 Ultra low loss dielectric thermosetting resin compositions and high performance laminates manufactured therefrom
PCT/US2014/000199 WO2015065501A1 (en) 2013-11-04 2014-10-21 Ultra low loss dielectric thermosetting resin compositions and high preformance laminates manufactured therefrom

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US (3) US9332637B2 (ru)
EP (1) EP3066148B1 (ru)
JP (2) JP6886292B2 (ru)
KR (1) KR101819949B1 (ru)
CN (1) CN105873979B (ru)
AU (1) AU2014343034A1 (ru)
CA (1) CA2933155A1 (ru)
EA (1) EA201690947A1 (ru)
SG (1) SG10201803411UA (ru)
TW (1) TWI617594B (ru)
WO (1) WO2015065501A1 (ru)

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US20160249451A1 (en) 2016-08-25
SG10201803411UA (en) 2018-06-28
US9596753B2 (en) 2017-03-14
EP3066148A1 (en) 2016-09-14
JP7356782B2 (ja) 2023-10-05
AU2014343034A1 (en) 2016-06-09
US9439284B1 (en) 2016-09-06
US9332637B2 (en) 2016-05-03
WO2015065501A1 (en) 2015-05-07
US20150126684A1 (en) 2015-05-07
JP2021119231A (ja) 2021-08-12
JP2016537496A (ja) 2016-12-01
CN105873979B (zh) 2018-09-07
CN105873979A (zh) 2016-08-17
KR101819949B1 (ko) 2018-02-28
US20160360614A1 (en) 2016-12-08
EP3066148B1 (en) 2021-07-14
TW201522420A (zh) 2015-06-16
EP3066148A4 (en) 2017-08-02
JP6886292B2 (ja) 2021-06-16
KR20160084421A (ko) 2016-07-13
CA2933155A1 (en) 2015-05-07
TWI617594B (zh) 2018-03-11

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