TW200718748A - Application of electrical material in high frequency and manufacturing method of the same - Google Patents

Application of electrical material in high frequency and manufacturing method of the same

Info

Publication number
TW200718748A
TW200718748A TW094139272A TW94139272A TW200718748A TW 200718748 A TW200718748 A TW 200718748A TW 094139272 A TW094139272 A TW 094139272A TW 94139272 A TW94139272 A TW 94139272A TW 200718748 A TW200718748 A TW 200718748A
Authority
TW
Taiwan
Prior art keywords
electrical material
manufacturing
application
same
high frequency
Prior art date
Application number
TW094139272A
Other languages
Chinese (zh)
Other versions
TWI290945B (en
Inventor
Hsien-Te Chen
Gin-Juo Fan
Meng-Pang Lai
Chih-Ming Li
Yu-Ju Liu
Original Assignee
Taiwan Union Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Union Technology Corp filed Critical Taiwan Union Technology Corp
Priority to TW94139272A priority Critical patent/TWI290945B/en
Publication of TW200718748A publication Critical patent/TW200718748A/en
Application granted granted Critical
Publication of TWI290945B publication Critical patent/TWI290945B/en

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

The present invention relates to an electrical material having a low dielectric constant and a low dielectric loss and comprising (a) phenylethlylene maleic anhydride with the structure shown as the formula below: where m represents an integer of 1 to 6, and n represents an integer of 2 to 12; (b) benzoxazines with the structure shown as the formula below: (c) epoxy resin; (d)flexibilizing agent; (e) catalyst; and (f) thinner.
TW94139272A 2005-11-09 2005-11-09 Application of electrical material in high frequency and manufacturing method of the same TWI290945B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94139272A TWI290945B (en) 2005-11-09 2005-11-09 Application of electrical material in high frequency and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94139272A TWI290945B (en) 2005-11-09 2005-11-09 Application of electrical material in high frequency and manufacturing method of the same

Publications (2)

Publication Number Publication Date
TW200718748A true TW200718748A (en) 2007-05-16
TWI290945B TWI290945B (en) 2007-12-11

Family

ID=39460380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94139272A TWI290945B (en) 2005-11-09 2005-11-09 Application of electrical material in high frequency and manufacturing method of the same

Country Status (1)

Country Link
TW (1) TWI290945B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496834B (en) * 2009-11-06 2015-08-21 Dow Global Technologies Llc Storage stable epoxy resin compositions for electrical laminates
TWI548696B (en) * 2009-12-30 2016-09-11 Taiwan Union Technology Corp Electronic material composition
US10513605B2 (en) 2015-12-04 2019-12-24 Shengyi Technology Co., Ltd. Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102134377B (en) * 2010-01-26 2014-10-08 台燿科技股份有限公司 Electronic material composition
CN103232705B (en) * 2013-04-22 2015-04-22 苏州生益科技有限公司 High-frequency resin composition as well as semi-cured sheet and laminated board manufactured by high-frequency resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496834B (en) * 2009-11-06 2015-08-21 Dow Global Technologies Llc Storage stable epoxy resin compositions for electrical laminates
TWI548696B (en) * 2009-12-30 2016-09-11 Taiwan Union Technology Corp Electronic material composition
US10513605B2 (en) 2015-12-04 2019-12-24 Shengyi Technology Co., Ltd. Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

Also Published As

Publication number Publication date
TWI290945B (en) 2007-12-11

Similar Documents

Publication Publication Date Title
TW200720323A (en) Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same
TW200518380A (en) A chip antenna
TW200718748A (en) Application of electrical material in high frequency and manufacturing method of the same
DE60315701D1 (en) RUSSA COMPOSITIONS AND ITS APPLICATIONS
WO2007117372A9 (en) Process for preparing polyimide based compositions useful in high frequency circuitry applications
WO2007016115A3 (en) 6,13-bis(thienyl)pentacene compounds
DE60223258D1 (en) POLYSILAZO-MODIFIED POLYAMINE CURING AGENT FOR EPOXY RESINS
GB2432262A (en) Antenna device and mobile wireless apparatus using the same
WO2005002018A3 (en) Connector related structures including an energy
TW200513494A (en) Composition for resin of composite dielectric material, the material itself and electric circuit board using the same
EA200400782A1 (en) COMPOSITION OF ISOTRETINOININ WITH CRUSHING COMPONENTS UNDER THE DEGREE OF NANOPARTICLES
DE602004011675D1 (en) ABSORBER FOR ELECTROMAGNETIC WAVES
RS20060206A (en) Aminopyridine-derivatives as inducible no-synthase inhibitors
TW200504139A (en) Epoxy compound and cured epoxy resin product
WO2004068608A8 (en) Organic field effect transistor and integrated circuit
ATE284788T1 (en) HIGH FREQUENCY (HF) WELDABLE ELASTOMER COMPOSITION
IL156640A (en) Process for preparing arylethanoldiamines from imidazooxazoles, starting material and intermediate used in the process
TW200507110A (en) Coating composition and low dielectric constant porous silica material produced therewith
SE0102133L (en) Ways to manufacture microwave components
Kim et al. Properties of high permeability magnetic materials for signal transmission at the high frequency
Park et al. Dielectric Properties of Epoxy/Layered Nanocomposites
Lee et al. The characteristics of ozone and discharge by ceramic dielectric for dielectric barrier discharge
Kwon et al. Characteristics of PD Signatures due to GIS defects in UHF Band
Kim et al. Electrical properties of $ SiO_2 $ thin film by OTS treatment
WO2005034172A3 (en) Material and cell structure for memory applications