TWI548696B - Electronic material composition - Google Patents

Description

Electronic material composition

The invention relates to an electronic material composition, in particular to a halogen-free electronic material composition having a low dielectric constant and a low dissipation factor, and the electronic material can be used for application. High frequency copper foil substrate.

The copper foil substrate material that the electronics industry has traditionally used is regarded as the supporting material for the mounting of electronic components and circuit interconnection. The requirements for the material of the copper foil substrate are mainly the conductive functions that do not affect the line, but the electronic products have been developed to this day. The requirements for the material of the copper foil substrate are no longer only the function of the "support material". In the signal transmission of the circuit, the system operator also continuously requests a faster signal transmission time and a clearer transmission signal, and the environmental awareness is gradually increasing. Looking up, the demand for halogen-free materials is also increasing day by day. Therefore, in order to meet the demand for accelerated signal transmission and clearer transmission signals and halogen-free existence, various research and development work has been carried out in response to this demand.

The copper foil substrate material generally used for high frequency needs to have two characteristics of low dielectric constant and small dissipation factor, and in order to achieve the level of the substrate material, the previous high frequency copper foil substrate material is matched with epoxy resin. With low dielectric constant and low dissipation factor to achieve this effect, such as the USPTO 5001010, 5,096,771, 5,141,791, 5,262,491, 5,308,565, 5,834,565 and 6,352,782 proposed by General Electric Co. The phenoxy material method achieves the requirement of low dielectric constant. For example, the US patent USPTO7538150 proposed by Hitachi Chemical Co., Ltd. is made of epoxy resin with polybenzoxazine and phenolic resin with nitrogen ring structure. Halogen-free and with a low dissipation factor. The patent I290945 previously proposed by Tai Yao Technology is a styrene-maleic anhydride copolymer (Styrene Maleic Anhydride Copolymer) combined with oxy-oxobenzoxene (Benzoxazine) and a phosphorus-containing epoxy resin to form a high frequency. Halogen-free electronic materials, but due to the limited selectivity of phosphorus-containing epoxy resins, their use will be limited. And when the epoxy resin is produced, there will be a residue of halogen "chlorine", which tends to cause high chlorine content in the material.

Therefore, a formulation has recently been specially developed which can be used to produce a halogen-free copper foil having a low dielectric constant, a small dissipation factor and no halogen residue in the epoxy resin, and a flame retardant to enable the material to pass the UL 94V-0 flame resistance test. Substrate.

Therefore, a formulation has recently been specially developed which can be used to produce a halogen-free copper foil having a low dielectric constant, a small dissipation factor and no halogen residue in the epoxy resin, and a flame retardant to enable the material to pass the UL 94V-0 flame resistance test. a substrate, the electronic material composition comprising:

(a) Styrene-Maleic anhydride Copolymer as a hardener, the structural formula of which is as follows:

Wherein m is an integer from 1 to 6, and n is an integer from 2 to 12;

(b) Polybenzoxazine, which is a thermosetting resin, and has the following structural formula:

Wherein R ₁ and R ₃ are each independently selected from the group consisting of methyl, phenyl, epoxy, Cyanate Ester group, Vinyl grpup, Maleimide group , Oxyalkenyl group, Alkynyl group, cycloallenyl group, Bicycloalkenyl, styryl, Itaconate group, benzo One of a group consisting of Benzocyclobutene, Aromatic Propargyl Ether, Aromatic Acetylene, and a diamine, wherein the R ₂ is selected from the group consisting of

And one of the groups of S;

(c) Flame retardant: a flame retardant having a phosphorus component or a phosphorus-nitrogen component selected from at least one compound selected from the group consisting of the following compounds (1) to (3):

(1) Poly(1,3-phenylene methylphosphonate) flame retardant,

(2) Polyester phosphazene flame retardant

(3) Inorganic phosphorus-nitrogen powder flame retardant, including ammonium phosphate (Ammonium Polyphosphate) or melamine pyrophosphate;

(d) an additive comprising one or more of a toughening agent, a filler, a dispersing agent, and a diluent.

The present invention provides an electronic material having a low dielectric constant and a small dissipation factor by adding an appropriate weight of a styrene-maleic anhydride copolymer and an oxonitrobenzocyclohexane resin, and using a flame retardant. This electronic material can pass the UL 94V-0 flame resistance test.

In another aspect, the present invention provides a method for producing a copper foil substrate comprising a halogen-free electronic material composition having a low dielectric constant and a small dissipation factor, comprising the steps of: (a) oxonitrobenzobenzene Cyclohexane is added to a stirrer; (b) a styrene-maleic anhydride copolymer and a flame retardant are added to the stirrer while stirring; (c) the mixture of the step (b) is uniformly mixed, Adding an additive to polymerize oxo-nitrobenzohexane; (d) adding a catalyst to the agitator, continuing to agitate to form a slurry; (e) using a diluent to adjust the slurry to a varnish is obtained in a state of appropriate viscosity; (f) the varnish is coated on a reinforcing material, and cured by heat polymerization to form a substrate; and (g) the substrate is pressed against the copper foil.

The above and other objects, features and advantages of the present invention will become more apparent from

The present invention provides an electronic material having both a low dielectric constant and a small dissipation factor by adding an appropriate weight of a styrene-maleic anhydride copolymer and an oxonitrobenzocyclohexane resin, and using a flame retardant. The copper foil substrate made of the electronic material can pass the UL 94V-0 flame resistance test, and the copper foil substrate has better dimensional stability and expansion coefficient than the general FR-4 copper foil substrate material.

The electronic material composition of the present invention comprises:

(a) Styrene-Maleic anhydride Copolymer as a hardener, the structural formula of which is as follows:

Wherein m is an integer from 1 to 6, and n is an integer from 2 to 12;

(b) Polybenzoxazine, which is a thermosetting resin, which is the main structure in the composition of electronic materials, and has the following structural formula:

Wherein R ₁ and R ₃ are each independently selected from the group consisting of methyl, phenyl, epoxy, cyanate, olefinyl, maleimine, oxyalkenyl, alkyne, cyclopropadiene One of a group consisting of a bis group, a bicycloalkenyl group, a styryl group, an itaconate group, a benzocyclobutenyl group, an aromatic propargyl ether, an aromatic acetylene, and a diamine, wherein the R ₂ system is selected from

And one of the groups of S, wherein the polyoxynitazobenzocyclohexane is similar to the epoxy resin, and has excellent molding processability, and is suitable for use as a high performance composite matrix resin, and polyoxygen The monomer for the azo-benzocyclohexane is oxo-nitrobenzoxan, which can be cyclized by condensation of a primary amine compound, a phenolic compound and formaldehyde, and then subjected to ring opening under heating or a catalyst. Poly-reacted to form polyoxo-nitrobenzocyclohexane.

(c) Flame retardant: a flame retardant having a phosphorus component or a phosphorus-nitrogen component, which is at least one compound selected from the group consisting of the following compounds (1) to (3): (1) polymethylphosphonic acid a 1,3-phenylene methylphosphonate flame retardant, wherein the polymethylphosphonic acid has a phosphorus content in the 1,3-phenylene ester of the polymethylphosphonic acid. 12 to 18% of the total weight of 1,3-phenylene ester, (2) a polyacetate (Poly ester phosphazene) type flame retardant, wherein the phosphorus content accounts for 12-18% by weight of the phosphazene, and (3) inorganic Phosphorus-nitrogen powder flame retardant, including ammonium phosphate (Ammonium Polyphosphate) or melamine pyrophosphate, which accounts for 5 to 20% by weight of the inorganic phosphorus-nitrogen powder flame retardant, and

(d) Additives, comprising: 1. A toughening agent comprising: (1) Epoxy modified Carboxyl Terminated Butadiene Acrylontrile having an epoxy equivalent (Epoxy Equivalent Weight, EEW) is 200 to 1000 g/eq, the hydrolyzed chlorine content is 500 ppm or less, the viscosity is 150,000 to 300,000 cps, the acrylonitrile (Acrylonitrile) content is 15 to 80% of the total weight of the rubber; and (2) the amine-terminated butadiene- Amine Terminated Butadiene Acrylontrile, the amine-terminated butadiene-acrylonitrile rubber has an Amine Equivalent Weight (AEW) of 300 to 1500 g/eq, and the acrylonitrile content accounts for 15 to 15% of the total weight of the rubber. 80%, viscosity is 100000 to 500000 cps; and (3) Carboxyl Terminated Butadiene Acrylontrile, wherein the acrylonitrile content is 15 to 80% of the total weight of the rubber; 2. Filler It includes: crystalline silica, fuse silica, aluminum hydroxide (Al(OH) ₃ ), aluminum oxide (Al ₂ O ₃ ), magnesium hydroxide ( Mg(OH) ₂ ), magnesium oxide (MgO) and clay, and the filler The particle size is from 0.5 to 100 μm; 3. a dispersant comprising: a decane coupling agent (Silane), comprising an amino-silane and an epoxy-silane coupling agent; and 4. A diluent comprising: acetone (Acetone), methyl ethyl ketone (MEK), cyclohexanol, methyl isobutyl ketone (MIBK), 1-methoxy-2-propanol (PM), 1-methoxy Methyl 2-propanol (PMA), dimethylformamide (DMF), and combinations thereof.

In the electronic material composition of the present invention, the content of the styrene-maleic anhydride copolymer is between 10 and 40% by weight based on the total weight of the electronic material composition; the polyoxygen nitrogen The content of the benzocyclohexane is between 5 and 60% by weight based on the total weight of the electronic material composition; the content of the flame retardant is based on the total weight of the electronic material composition Between 5 and 30% by weight: the content of the toughening agent is between 0 and 5% by weight based on the total weight of the electronic material composition; the content of the filler is based on the total composition of the electronic material The basis weight is between 5 and 30% by weight; and the content of the dispersant is between 0.5 and 3% by weight based on the total weight of the electronic material composition.

The styrene-maleic anhydride copolymer is used as a hardener. When the amount is more than 40% by weight, the material is too hard to be processed, and if the amount is less than 10% by weight, the dielectric constant property is not obvious. .

The purpose of using the polyoxygenated benzobenzocyclohexane is to reduce the dissipation factor of the electronic material. When the amount is more than 60% by weight, the reaction is too slow to completely harden, resulting in high water absorption and poor processability. If the amount used is less than 5% by weight, there is no effect of reducing the dissipation factor of the material. Use of more than 5% by weight will lower the glass transition temperature

The purpose of using the toughening agent is to increase the impact resistance of the electronic material and increase the toughness and reduce the flow of the glue. The use amount of more than 5% by weight lowers the glass transition temperature.

The purpose of using the phosphorus-containing flame retardant is to enable the electronic material to pass the UL 94V-0 flame resistance test, and the use amount of more than 30% by weight increases the water absorption of the electronic material, and the amount used is less than 5% by weight, if the amount added is too small No effect.

The filler has a particle diameter of 0.5 to 100 μm, and when the amount is more than 30% by weight, the raw rubber is too thick to affect the wetting of the glass cloth, and if the amount used is too small, the effect is not effective.

The purpose of using the dispersing agent is to uniformly disperse the inorganic additive in the formulation. The dispersing agent used in the present invention is a decane coupling agent for improving the bonding stability between the inorganic material and the woven glass cloth to achieve uniform dispersion. And such coupling agents are free of heavy metals and do not adversely affect the human body, and the amount used is 0.5 to 3% by weight. If the amount used is too high, the reaction is accelerated and the storage time is affected, and if the amount used is too small, no effect.

The diluent is selected so as not to remain in the material after being impregnated onto the glass cloth and dried at 60 to 190 ° C.

The catalyst is a tertiary amine such as 2-methylimidazole (2MI), 2-ethyl 4-methylimidazole (2E4MI), 2-benzimidazole (2PI), N-benzyldimethylamine ( BDMA), etc., the characteristics of the tertiary amine are to lower the reaction temperature. If the tertiary amine is not used, the hardening reaction starts at about 170 ° C. However, if a tertiary amine is used, the hardening reaction occurs at about 120 ° C. It is 0.01 to 3.0 parts by weight. If the amount used is too high, the reactivity is too fast, affecting the storage time, and if the amount is too small, it has no effect.

The invention relates to a method for manufacturing a copper foil substrate comprising a halogen-free electronic material composition having a low dielectric constant and a small dissipation factor, comprising the steps of: (a) oxo-nitrobenzocyclohexane at room temperature; The alkane is added to a stirrer; (b) the styrene-maleic anhydride copolymer and the flame retardant are added to the stirrer while stirring at room temperature; (c) the mixture of the step (b) is uniformly mixed. And adding a catalyst to carry out polymerization of oxo-nitrobenzoxane, wherein the catalyst is, for example, a tertiary amine, and the tertiary amine is, for example, 2-methylimidazole, 2-ethyl 4-methylimidazole, 2 -benzimidazole or N-benzyldimethylamine; (d) adding an additive to the stirrer and stirring at room temperature for 120 minutes to form a slurry, wherein the additive comprises a toughening agent, a filler, and a dispersion One or more of the agent and the diluent; (e) using a diluent to adjust the slurry to a state of appropriate viscosity to obtain a varnish such as acetone, methyl ethyl ketone, cyclohexanone, methyl isobutyl Ketone, 1-methoxy-2-propanol, 1-methoxy-2-propanol methyl ester, dimethylformamide or its group (f) coating the varnish onto the reinforcing material and forming a substrate by heat polymerization hardening, wherein the step of coating the varnish on the reinforcing material is, for example, impregnating the reinforcing material on the drum type impregnating machine In the varnish, the reinforcing material comprises a glass cloth, a glass mat and an aramide fiber; and (g) the substrate is pressed with a copper foil, wherein the impregnated substrate and the copper foil are The step of pressing is performed, for example, by pressing the impregnated glass cloth to a thickness of 7628*5 (0.039 mil) on both sides of the outermost layer and pressing each sheet of 1 oz of copper foil.

Embodiment 1:

100 parts by weight of oxoazobenzocyclohexane, 50 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 40 parts by weight of cerium oxide, and 25 parts by weight of polymethylphosphonic acid 1,3-phenylene ester, 0.33 parts by weight of 2-methylimidazole, and 70 parts by weight of methyl ethyl ketone were placed in a stirrer.

Embodiment 2:

100 parts by weight of oxoazobenzocyclohexane, 10 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 40 parts by weight of cerium oxide, 25 parts by weight of melamine pyrophosphate, 0.69 parts by weight of 2-methylimidazole and 70 parts by weight of methyl ethyl ketone were placed in a stirrer.

Embodiment 3:

100 parts by weight of oxoazobenzocyclohexane, 45 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 40 parts by weight of aluminum hydroxide, 25 parts by weight of phosphazene flame retardant, 0.96 parts by weight of 2-methylimidazole and 70 parts by weight of methyl ethyl ketone were placed in a stirrer.

Embodiment 4:

100 parts by weight of oxoazobenzocyclohexane, 50 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 45 parts by weight of aluminum hydroxide, 30 parts by weight of ammonium polyphosphate (inorganic Phosphorus-nitrogen powder flame retardant), 0.15 parts by weight of 2-methylimidazole and 70 parts by weight of methyl ethyl ketone are added to a stirrer

Embodiment 5:

100 parts by weight of oxoazobenzocyclohexane, 50 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 40 parts by weight of cerium oxide, 20 parts by weight of polymethylphosphonic acid 1,3-phenylene ester, 5 parts by weight of carboxyl-terminated butadiene-acrylonitrile rubber (1300*8) as a toughening agent, 0.11 part by weight of 2-methylimidazole, and 70 parts by weight of methyl ethyl ketone Inside a blender.

After the mixture prepared in the foregoing Examples 1, 2, 3, 4 and 5 was stirred at room temperature for 120 minutes, a varnish was obtained, and a 7628 type glass cloth was impregnated into the varnish to be adjusted on a drum type impregnator.

The impregnated glass cloth was pressed at a thickness of 7628*5 (39 mil) on both sides of the outermost layer and each piece of loz copper foil, and the pressed copper foil substrate was subjected to characteristic detection.

There are two kinds of test instruments for glass transfer temperature, one is Dynamic Mechanical Analyzer (DMA), the other is Thermal Mechanical Analyzer (TMA), thermomechanical analyzer and can be simultaneously measured. Measure the Z-axis expansion coefficient. The test specification for the glass transfer temperature is the IPC-TM-650.2.4.25C and 24C test methods of The Institute for Interconnecting and Packaging Electronic Circuits (IPC). The test specification for the Z-axis expansion coefficient is the detection method of IPC-TM-650.2.4.41. The test specification for heat resistance is the detection method of IPC-TM-650.2.4.24.1. In the thermal shock test, the test piece was placed in a high-humidity environment of 2 atm and 121 ° C for 1 hour, and then placed in a tin furnace at 288 ° C for 20 seconds, and then pulled up, and the immersion pulling operation was repeated at least 5 times. . The UL 94V-0 flame resistance test is carried out according to the UL test method. The total flame retardant seconds are less than 50 seconds. The test can be tested. The dielectric constant and the dissipation factor are tested by HP-4191B dielectric analyzer. The chlorine content is BS EN 14582. :2007 Analytical detection by ion chromatography.

Comparison of Examples 1 to 5 with a control group (a halogen-free material made from a commercially available phosphorus-containing epoxy resin)

It can be seen from Examples 1 to 5 that the addition of the styrene-maleic anhydride copolymer can reduce the dielectric constant (Delectric Constant; Dk) of the copper foil substrate, and the addition of the polyoxynitazobenzocyclohexane can reduce the copper foil substrate. The effect of the Dissipation Factor (Df), while adding a flame retardant, the copper foil substrate can pass the UL 94V-0 flame resistance test.

It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, the present invention includes such modifications and variations, and is included in the scope of the appended claims and their equivalents.

Claims (13)

An electronic material composition comprising the following composition but no epoxy resin: (a) Styrene-Maleic anhydride Copolymer as a hardener, the structural formula of which is as follows: Wherein m is an integer from 1 to 6, and n is an integer from 2 to 12; (b) Polybenzoxazine, which is a thermosetting resin, and has the structural formula shown below: Wherein R ₁ and R ₃ are each independently selected from the group consisting of methyl, phenyl, epoxy, cyanate, olefinyl, maleimine, oxyalkenyl, alkyne, cyclopropadiene One of a group consisting of a bis group, a bicycloalkenyl group, a styryl group, an itaconate group, a benzocyclobutenyl group, an aromatic propargyl ether, an aromatic acetylene, and a diamine, wherein the R ₂ system is selected from And one of the groups of S; (c) flame retardant: a flame retardant having a phosphorus component or a phosphorus-nitrogen component selected from the group consisting of the following compounds (1) to (3) At least one compound: (1) a poly(1,3-phenylene methylphosphonate) flame retardant, wherein the polymethylphosphonic acid 1,3-phenylene The phosphorus content in the ester accounts for 12 to 18% of the total weight of the poly(triphenylphosphonic acid) 1,3-phenylene ester, and (2) a polyacetate (Poly ester phosphazene) type flame retardant, wherein the phosphorus content accounts for the phosphorus 12 to 18% by weight of nitrile, and (3) inorganic phosphorus-nitrogen powder flame retardant, including ammonium phosphate (Ammonium Polyphosphate) or melamine pyrophosphate, which accounts for the inorganic phosphorus-nitrogen powder 5 to 20% by weight of the flame retardant; and (d) an additive comprising one or more of a toughening agent, a filler, a dispersing agent and a diluent, wherein the styrene-matrix The content of the anhydride copolymer is between 10 and 40% by weight based on the total weight of the electronic material composition; the content of the polyoxygenated benzocyclohexane is the total of the composition of the electronic material The recalculation system is between 5 and 6 Between 0% by weight; the content of the flame retardant is between 5 and 30% by weight based on the total weight of the electronic material composition: the content of the toughening agent, based on the total weight of the electronic material composition The system is between 0 and 5% by weight; the content of the filler is between 5 and 30% by weight based on the total weight of the electronic material composition; and the content of the dispersant to the electronic material The total weight of the composition is between 0.5 and 3% by weight. An electronic material composition as described in claim 1, wherein the toughening The agent is selected from the group consisting of epoxidized carboxyl terminated butadiene-acrylonitrile rubber, amine terminated butadiene-acrylonitrile rubber, and carboxyl terminated butadiene-acrylonitrile rubber. The electronic material composition according to claim 2, wherein the epoxidized carboxyl-terminated butadiene-acrylonitrile rubber has an epoxy equivalent of 200 to 1000 g/eq, a hydrolyzed chlorine content of 500 ppm or less, and propylene. The nitrile content is from 15 to 80% of the total weight of the rubber. The electronic material composition according to claim 3, wherein the amine-terminated butadiene-acrylonitrile rubber has an amine equivalent of 300 to 1500 g/eq, and the acrylonitrile content accounts for 15% of the total weight of the rubber. 80%. The electronic material composition of claim 3, wherein the carboxy-terminated butadiene-acrylonitrile rubber has an acrylonitrile content of 15 to 80% by weight based on the total weight of the rubber. The electronic material composition according to claim 1, wherein the filler is crystalline crystal silica, fuse silica, aluminum hydroxide (Al(OH) ₃ ), aluminum oxide (Al ₂ O ₃ ), magnesium hydroxide (Mg(OH) ₂ ), magnesium oxide (MgO), or clay. The electronic material composition according to claim 1, wherein the dispersing agent is an amino-silane or an epoxy-silane. The electronic material composition according to claim 1, wherein the diluent is selected from the group consisting of acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 1-methoxy-2-propanol, 1- Methoxy-2-propanol methyl ester and dimethylformamidine are grouped together. A method for producing a copper foil substrate comprising an electronic material composition, comprising the steps of: (a) adding oxonitrobenzocyclohexane to a stirrer; (b) adding styrene-horse while stirring The anhydride copolymer and a flame retardant are added to the agitator; (c) after the mixture of the step (b) is uniformly mixed, the catalyst is added to polymerize the oxo-nitrobenzohexane; (d) Adding an additive to the agitator and continuing to agitate to form a slurry, wherein the additive comprises one or more of a toughening agent, a filler and a dispersing agent; (e) adjusting with a diluent The slurry is brought to an appropriate viscosity state to obtain an electronic material composition; (f) the electronic material composition is coated on a reinforcing material, and cured by heat polymerization to form a substrate; and (g) the substrate is The copper foil is pressed, wherein the electronic material composition does not contain an epoxy resin; the structural formula of oxonitrobenzocyclohexane is as follows: Wherein R ₁ and R ₃ are each independently selected from the group consisting of methyl, phenyl, epoxy, cyanate, olefinyl, maleimine, oxyalkenyl, alkyne, cyclopropadiene One of a group consisting of a group, a bicycloalkenyl group, a styryl group, an itaconate group, a benzocyclobutenyl group, an aromatic propargyl ether, an aromatic acetylene, and a diamine, and the R ₂ is selected from the group consisting of And one of the groups of S; the structural formula of the styrene-maleic anhydride copolymer is as follows: Wherein m is an integer of 1 to 6, and n is an integer of 2 to 12; the flame retardant is a flame retardant having a phosphorus component or a phosphorus-nitrogen component, and is selected from the following compounds (1) to (3) At least one compound in the group: (1) a poly(1,3-phenylene methylphosphonate) flame retardant, wherein the polymethylphosphonic acid 1, The phosphorus content of the 3-phenylene ester is 12 to 18% of the total weight of the poly(triphenylphosphonic acid) 1,3-phenylene ester. (2) Polyester phosphazene flame retardant, wherein phosphorus The content is 12-18% by weight of the phosphazene, and (3) inorganic phosphorus-nitrogen powder flame retardant, including ammonium phosphate (Ammonium Polyphosphate) or melamine pyrophosphate, which accounts for the inorganic phosphorus - 5 to 20% by weight of the nitrogen powder flame retardant; and the content of the styrene-maleic anhydride copolymer, which is between 10 and 40% by weight based on the total weight of the electronic material composition; The content of oxoazobenzocyclohexane is between 5 and 60% by weight based on the total weight of the electronic material composition; the content of the flame retardant is based on the total weight of the electronic material composition Between 5 and 30% by weight The content of the toughening agent is between 0 and 5% by weight based on the total weight of the electronic material composition; the content of the filler is between 5 and the total weight of the electronic material composition. Between 30% by weight; and the content of the dispersant is between 0.5 and 3% by weight based on the total weight of the electronic material composition. The method for producing a copper foil substrate comprising an electronic material composition according to claim 9, wherein the catalyst is a tertiary amine. The method for producing a copper foil substrate comprising an electronic material composition according to claim 9, wherein the reinforcing material is a glass cloth, a glass mat, or an aramide fiber. The method for producing a copper foil substrate comprising the electronic material composition according to claim 9, wherein the coating method of the step (f) is an impregnation method. A method for producing a copper foil substrate comprising an electronic material composition according to claim 9, wherein the step (d) is carried out by stirring at room temperature for 120 minutes.