DK1594165T3 - Fremgangsmåde til elektrisk isolering af et underlag til et effektmodul - Google Patents
Fremgangsmåde til elektrisk isolering af et underlag til et effektmodulInfo
- Publication number
- DK1594165T3 DK1594165T3 DK05009075T DK05009075T DK1594165T3 DK 1594165 T3 DK1594165 T3 DK 1594165T3 DK 05009075 T DK05009075 T DK 05009075T DK 05009075 T DK05009075 T DK 05009075T DK 1594165 T3 DK1594165 T3 DK 1594165T3
- Authority
- DK
- Denmark
- Prior art keywords
- substrate
- power module
- electrically insulating
- casing
- recess
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Processing Of Terminals (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004021927A DE102004021927B4 (de) | 2004-05-04 | 2004-05-04 | Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1594165T3 true DK1594165T3 (da) | 2008-10-06 |
Family
ID=34935721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK05009075T DK1594165T3 (da) | 2004-05-04 | 2005-04-26 | Fremgangsmåde til elektrisk isolering af et underlag til et effektmodul |
Country Status (8)
Country | Link |
---|---|
US (1) | US7723244B2 (ja) |
EP (1) | EP1594165B1 (ja) |
JP (1) | JP4783583B2 (ja) |
AT (1) | ATE398336T1 (ja) |
DE (2) | DE102004021927B4 (ja) |
DK (1) | DK1594165T3 (ja) |
ES (1) | ES2308330T3 (ja) |
PL (1) | PL1594165T3 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005059360B4 (de) * | 2005-12-13 | 2011-09-22 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung und Verfahren zum Verguss von Schaltungsanordnungen |
DE102006006424B4 (de) | 2006-02-13 | 2011-11-17 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren |
DE102006006425B4 (de) * | 2006-02-13 | 2009-06-10 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul in Druckkontaktausführung |
FR2905379B1 (fr) * | 2006-09-04 | 2008-11-07 | Bertin Technologies Soc Par Ac | Dispositif de collecte et de separation de particules et de microorganismes presents dans l'air ambiant |
US8164176B2 (en) * | 2006-10-20 | 2012-04-24 | Infineon Technologies Ag | Semiconductor module arrangement |
DE102006058692A1 (de) * | 2006-12-13 | 2008-06-26 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Kontaktfedern |
DE102007024159B3 (de) * | 2007-05-24 | 2008-11-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
DE102008017454B4 (de) | 2008-04-05 | 2010-02-04 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit hermetisch dichter Schaltungsanordnung und Herstellungsverfahren hierzu |
DE102009000884B3 (de) | 2009-02-16 | 2010-10-07 | Semikron Elektronik Gmbh & Co. Kg | Halbleitermodul mit Gehäuse aus präkeramischem Polymer |
DE102009000885A1 (de) | 2009-02-16 | 2010-08-26 | Semikron Elektronik Gmbh & Co. Kg | Halbleitermodul |
DE102009046858B3 (de) * | 2009-11-19 | 2011-05-05 | Infineon Technologies Ag | Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls |
US8511851B2 (en) * | 2009-12-21 | 2013-08-20 | Cree, Inc. | High CRI adjustable color temperature lighting devices |
DE102011004544B4 (de) | 2011-02-22 | 2013-06-13 | Semikron Elektronik Gmbh & Co. Kg | Schaltungsanordnung |
JP5762902B2 (ja) | 2011-09-16 | 2015-08-12 | 日本発條株式会社 | 接触端子 |
JP6825306B2 (ja) * | 2016-11-02 | 2021-02-03 | 富士電機株式会社 | 半導体装置 |
DE102018133456A1 (de) * | 2018-12-21 | 2020-06-25 | Rogers Germany Gmbh | Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats |
DE102020131493B4 (de) | 2020-11-27 | 2023-04-13 | Semikron Elektronik Gmbh & Co. Kg | Verkettete Anlage und Verfahren zur inneren elektrischen Isolation einer leistungselektronischen Schalteinrichtung |
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JPS61258436A (ja) * | 1985-05-13 | 1986-11-15 | Nec Corp | 半導体装置の製造方法 |
US4709301A (en) * | 1985-09-05 | 1987-11-24 | Nec Corporation | Package |
JPH03177376A (ja) * | 1989-12-04 | 1991-08-01 | Japan Gore Tex Inc | セラミック基板 |
DE4040822A1 (de) * | 1990-12-20 | 1992-07-02 | Bosch Gmbh Robert | Duennschichtueberzug ueber chips |
JPH04252041A (ja) * | 1991-01-28 | 1992-09-08 | Nec Corp | 混成集積回路の製造方法 |
JPH06302020A (ja) * | 1993-04-15 | 1994-10-28 | Dainippon Ink & Chem Inc | 回転塗布方法および回転塗布装置 |
JP2994219B2 (ja) * | 1994-05-24 | 1999-12-27 | シャープ株式会社 | 半導体デバイスの製造方法 |
US5646071A (en) * | 1995-01-19 | 1997-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Equipment and method for applying a liquid layer |
JP3168901B2 (ja) * | 1996-02-22 | 2001-05-21 | 株式会社日立製作所 | パワー半導体モジュール |
JPH1041337A (ja) * | 1996-07-26 | 1998-02-13 | Oki Electric Ind Co Ltd | 実装基板の製造方法およびその実装構造 |
JP3488345B2 (ja) * | 1996-08-20 | 2004-01-19 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、その硬化物及びそれにより封止された樹脂封止型半導体装置 |
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-
2004
- 2004-05-04 DE DE102004021927A patent/DE102004021927B4/de not_active Expired - Lifetime
-
2005
- 2005-04-25 JP JP2005126525A patent/JP4783583B2/ja active Active
- 2005-04-26 ES ES05009075T patent/ES2308330T3/es active Active
- 2005-04-26 AT AT05009075T patent/ATE398336T1/de active
- 2005-04-26 DK DK05009075T patent/DK1594165T3/da active
- 2005-04-26 PL PL05009075T patent/PL1594165T3/pl unknown
- 2005-04-26 DE DE502005004373T patent/DE502005004373D1/de active Active
- 2005-04-26 EP EP05009075A patent/EP1594165B1/de active Active
- 2005-05-04 US US11/122,175 patent/US7723244B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1594165A3 (de) | 2007-06-27 |
JP4783583B2 (ja) | 2011-09-28 |
PL1594165T3 (pl) | 2008-11-28 |
JP2005322902A (ja) | 2005-11-17 |
ES2308330T3 (es) | 2008-12-01 |
DE102004021927B4 (de) | 2008-07-03 |
DE502005004373D1 (de) | 2008-07-24 |
ATE398336T1 (de) | 2008-07-15 |
DE102004021927A1 (de) | 2005-12-01 |
EP1594165B1 (de) | 2008-06-11 |
US20050250247A1 (en) | 2005-11-10 |
EP1594165A2 (de) | 2005-11-09 |
US7723244B2 (en) | 2010-05-25 |
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