PL1594165T3 - Sposób wykonania izolacji elektrycznej podłoża dla modułu mocy - Google Patents

Sposób wykonania izolacji elektrycznej podłoża dla modułu mocy

Info

Publication number
PL1594165T3
PL1594165T3 PL05009075T PL05009075T PL1594165T3 PL 1594165 T3 PL1594165 T3 PL 1594165T3 PL 05009075 T PL05009075 T PL 05009075T PL 05009075 T PL05009075 T PL 05009075T PL 1594165 T3 PL1594165 T3 PL 1594165T3
Authority
PL
Poland
Prior art keywords
substrate
casing
power
electrically insulating
recess
Prior art date
Application number
PL05009075T
Other languages
English (en)
Inventor
Karlheinz Augustin
Christian Göbl
Original Assignee
Semikron Elektronik Gmbh & Co Kg Patentabteilung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh & Co Kg Patentabteilung filed Critical Semikron Elektronik Gmbh & Co Kg Patentabteilung
Publication of PL1594165T3 publication Critical patent/PL1594165T3/pl

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Processing Of Terminals (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL05009075T 2004-05-04 2005-04-26 Sposób wykonania izolacji elektrycznej podłoża dla modułu mocy PL1594165T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004021927A DE102004021927B4 (de) 2004-05-04 2004-05-04 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul
EP05009075A EP1594165B1 (de) 2004-05-04 2005-04-26 Verfahren zur elektrischen Isolation eines Substrats für ein Leistungsmodul

Publications (1)

Publication Number Publication Date
PL1594165T3 true PL1594165T3 (pl) 2008-11-28

Family

ID=34935721

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05009075T PL1594165T3 (pl) 2004-05-04 2005-04-26 Sposób wykonania izolacji elektrycznej podłoża dla modułu mocy

Country Status (8)

Country Link
US (1) US7723244B2 (pl)
EP (1) EP1594165B1 (pl)
JP (1) JP4783583B2 (pl)
AT (1) ATE398336T1 (pl)
DE (2) DE102004021927B4 (pl)
DK (1) DK1594165T3 (pl)
ES (1) ES2308330T3 (pl)
PL (1) PL1594165T3 (pl)

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DE102005059360B4 (de) * 2005-12-13 2011-09-22 Semikron Elektronik Gmbh & Co. Kg Vorrichtung und Verfahren zum Verguss von Schaltungsanordnungen
DE102006006424B4 (de) 2006-02-13 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren
DE102006006425B4 (de) * 2006-02-13 2009-06-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
FR2905379B1 (fr) * 2006-09-04 2008-11-07 Bertin Technologies Soc Par Ac Dispositif de collecte et de separation de particules et de microorganismes presents dans l'air ambiant
US8164176B2 (en) * 2006-10-20 2012-04-24 Infineon Technologies Ag Semiconductor module arrangement
DE102006058692A1 (de) * 2006-12-13 2008-06-26 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
DE102007024159B3 (de) * 2007-05-24 2008-11-06 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
DE102008017454B4 (de) 2008-04-05 2010-02-04 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit hermetisch dichter Schaltungsanordnung und Herstellungsverfahren hierzu
DE102009000885A1 (de) 2009-02-16 2010-08-26 Semikron Elektronik Gmbh & Co. Kg Halbleitermodul
DE102009000884B3 (de) 2009-02-16 2010-10-07 Semikron Elektronik Gmbh & Co. Kg Halbleitermodul mit Gehäuse aus präkeramischem Polymer
DE102009046858B3 (de) 2009-11-19 2011-05-05 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls
US8511851B2 (en) * 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
DE102011004544B4 (de) * 2011-02-22 2013-06-13 Semikron Elektronik Gmbh & Co. Kg Schaltungsanordnung
JP5762902B2 (ja) 2011-09-16 2015-08-12 日本発條株式会社 接触端子
JP6825306B2 (ja) * 2016-11-02 2021-02-03 富士電機株式会社 半導体装置
DE102018133456A1 (de) * 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102020131493B4 (de) 2020-11-27 2023-04-13 Semikron Elektronik Gmbh & Co. Kg Verkettete Anlage und Verfahren zur inneren elektrischen Isolation einer leistungselektronischen Schalteinrichtung

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DK1594165T3 (da) 2008-10-06
EP1594165A2 (de) 2005-11-09
DE502005004373D1 (de) 2008-07-24
ES2308330T3 (es) 2008-12-01
JP2005322902A (ja) 2005-11-17
JP4783583B2 (ja) 2011-09-28
EP1594165A3 (de) 2007-06-27
US20050250247A1 (en) 2005-11-10
ATE398336T1 (de) 2008-07-15
DE102004021927B4 (de) 2008-07-03
DE102004021927A1 (de) 2005-12-01
US7723244B2 (en) 2010-05-25
EP1594165B1 (de) 2008-06-11

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