ATE396607T1 - Klebeverfahren und -vorrichtung - Google Patents

Klebeverfahren und -vorrichtung

Info

Publication number
ATE396607T1
ATE396607T1 AT04730548T AT04730548T ATE396607T1 AT E396607 T1 ATE396607 T1 AT E396607T1 AT 04730548 T AT04730548 T AT 04730548T AT 04730548 T AT04730548 T AT 04730548T AT E396607 T1 ATE396607 T1 AT E396607T1
Authority
AT
Austria
Prior art keywords
edge
line
circuit component
circuit board
adhesive
Prior art date
Application number
AT04730548T
Other languages
English (en)
Inventor
Willibald Konrath
Klaus Scholl
Haiko Schmelcher
Ralf Gortzen
Martin Nahring
Ulf Muller
Original Assignee
Ericsson Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10327195A external-priority patent/DE10327195A1/de
Application filed by Ericsson Ab filed Critical Ericsson Ab
Application granted granted Critical
Publication of ATE396607T1 publication Critical patent/ATE396607T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT04730548T 2003-05-02 2004-04-30 Klebeverfahren und -vorrichtung ATE396607T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10319958 2003-05-02
DE10327195A DE10327195A1 (de) 2003-05-02 2003-06-17 Klebeverfahren und -vorrichtung

Publications (1)

Publication Number Publication Date
ATE396607T1 true ATE396607T1 (de) 2008-06-15

Family

ID=33420006

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04730548T ATE396607T1 (de) 2003-05-02 2004-04-30 Klebeverfahren und -vorrichtung

Country Status (5)

Country Link
US (1) US20070023138A1 (de)
EP (1) EP1621058B1 (de)
AT (1) ATE396607T1 (de)
DE (1) DE602004013959D1 (de)
WO (1) WO2004098258A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1704761B1 (de) * 2004-01-16 2007-11-07 Ericsson AB Verfahren zum ankleben einer schaltungskomponente an eine leiterplatte
JP4714026B2 (ja) 2006-01-10 2011-06-29 株式会社東芝 電子部品実装装置、電子部品実装方法及び電子部品装置
US20100108256A1 (en) * 2008-11-05 2010-05-06 Western Digital Technologies, Inc. Closed loop control of adhesive dot characteristics
CN103928354B (zh) * 2014-05-09 2016-08-24 北京长峰微电科技有限公司 一种半导体芯片粘接方法
CN113438827B (zh) * 2021-07-28 2022-05-10 江苏传艺科技股份有限公司 带有双边间距调节机构的smt装贴设备及其方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207964A (ja) * 1982-05-31 1983-12-03 Nippon Furuuto Kk 接着剤塗布装置
DE8808619U1 (de) * 1988-07-05 1988-09-01 Siemens AG, 1000 Berlin und 8000 München Klebestation einer halbautomatischen Bestückungsmaschine für die Bestückung von Platinen mit oberflächenmontierbaren elektrischen Bauelementen
EP0378233B1 (de) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers
EP0417294A4 (en) * 1989-03-23 1991-12-27 Kirill Petrovich Zybin Method and device for making integrated circuits
US5186982A (en) * 1990-09-18 1993-02-16 Minnesota Mining And Manufacturing Company Pin transfer applicator and method
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5423889A (en) * 1994-06-24 1995-06-13 Harris Corporation Process for manufacturing a multi-port adhesive dispensing tool
US5686169A (en) * 1994-11-21 1997-11-11 Eastman Kodak Company Pattern to control spread of adhesive during lamination of sheets
EP0901155B1 (de) * 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
KR100246853B1 (ko) * 1997-11-25 2000-03-15 윤종용 다이 본딩 설비 및 이를 이용한 접착부재 잔량 검출 방법
US6510356B2 (en) * 2001-04-02 2003-01-21 Hewlett-Packard Company Method and apparatus for programming a paste dispensing machine
US6737002B1 (en) * 2002-02-04 2004-05-18 Lockheed Martin Corporation Fabrication of plastic module with exposed backside contact

Also Published As

Publication number Publication date
WO2004098258A1 (en) 2004-11-11
EP1621058A1 (de) 2006-02-01
US20070023138A1 (en) 2007-02-01
DE602004013959D1 (de) 2008-07-03
EP1621058B1 (de) 2008-05-21

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties