TW200724272A - Method for bonding between electrical devices using ultrasonic vibration - Google Patents

Method for bonding between electrical devices using ultrasonic vibration

Info

Publication number
TW200724272A
TW200724272A TW095143148A TW95143148A TW200724272A TW 200724272 A TW200724272 A TW 200724272A TW 095143148 A TW095143148 A TW 095143148A TW 95143148 A TW95143148 A TW 95143148A TW 200724272 A TW200724272 A TW 200724272A
Authority
TW
Taiwan
Prior art keywords
bonding
electrical devices
ultrasonic vibration
electrical device
adhesives
Prior art date
Application number
TW095143148A
Other languages
Chinese (zh)
Other versions
TWI306423B (en
Inventor
Kyung-Wook Paik
Myung-Jin Yim
Hyoung-Joon Kim
Ki-Won Lee
Original Assignee
Korea Advanced Inst Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Advanced Inst Sci & Tech filed Critical Korea Advanced Inst Sci & Tech
Publication of TW200724272A publication Critical patent/TW200724272A/en
Application granted granted Critical
Publication of TWI306423B publication Critical patent/TWI306423B/en

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    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention is to provide a method for bonding between electrical devices, including the steps of: aligning electrodes on a bonded area of an upper electrical device and a lower electrical device to be bonded; and curing of adhesives by applying ultrasonic energy to the adhesives between the upper electrical device and the lower electrical device.
TW095143148A 2005-11-24 2006-11-22 Method for bonding between electrical devices using ultrasonic vibration TWI306423B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050113105A KR100746330B1 (en) 2005-11-24 2005-11-24 Method for bonding between electrical devices using ultrasonication

Publications (2)

Publication Number Publication Date
TW200724272A true TW200724272A (en) 2007-07-01
TWI306423B TWI306423B (en) 2009-02-21

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JP (1) JP2009517861A (en)
KR (1) KR100746330B1 (en)
CN (1) CN101322233B (en)
DE (1) DE112006003181T5 (en)
TW (1) TWI306423B (en)
WO (1) WO2007061216A1 (en)

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JPWO2003012863A1 (en) * 2001-07-31 2004-12-09 株式会社ルネサステクノロジ Semiconductor device and manufacturing method thereof
JP4059497B2 (en) * 2003-06-24 2008-03-12 日東電工株式会社 Die bonding adhesive film, dicing die bonding adhesive film, and semiconductor device

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* Cited by examiner, † Cited by third party
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TWI492342B (en) * 2011-10-12 2015-07-11 Novatek Microelectronics Corp Ic chip package and chip-on-glass structure using the same
US9236360B2 (en) 2011-10-12 2016-01-12 Novatek Microelectronics Corp. IC chip package and chip-on-glass structure using the same

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KR20070025889A (en) 2007-03-08
WO2007061216A1 (en) 2007-05-31
CN101322233B (en) 2011-04-20
JP2009517861A (en) 2009-04-30
KR100746330B1 (en) 2007-08-03
DE112006003181T5 (en) 2008-11-06
TWI306423B (en) 2009-02-21
CN101322233A (en) 2008-12-10

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