A7 A7 B7 經濟部中央標準局員工消費合作社印聚 中 此 及 五、發明説明（1 ) 、本發财關-種用以於導電性元件之間㈣導電性連接 :新禎連接材料’及-種製造該導電性連接之方法。此 外、，本發明有關-種具有環境安全性之材料及方法，其可 用以取代含鉛（Pb)焊料連接技術。 背景 用於電子錢之大部料體㈣由金屬製造，諸如銅、 叙、金、銀、錯/錫（焊料）、銷等。使用錯/鎖合金之焊科 連接技術於各種層面之電子封裝中扮演了關鍵性之角色， 諸却倒裝片接合（或C4)、球柵陣列（BGa)中之焊球接 ^印刷電路板（PCBk IC封裝物組裝。電子封裝中之 坪料接點同時爲決定性之電聯點及機械/物理性接點。當 任何-個功能故障時，則該焊料接點被視爲損壞，而通; 會有整體電子系統停機之後果。 將微好封裝馳裝於㈣電路料，大部分廣泛使用 在Pb-Sn合金中具有最低熔點（183。〇之鉛錫共熔焊料_ ㈣Sn-37%pb。於此等應用中，有兩種焊料連接技術 用於大量生產：電鍍通孔（PTH)及表面裝置技術（SMT)焊 接。·該兩技術之基本差異在於PCB設計及其連接流程之 差異。 於SMT焊接中，微電子封裝物直接黏著於之表 面。SMT之主要優點係爲高封裝密度，因爲消除pcB 之大部分PTH，且利用PCB之兩個表面以調節组件。 外，SMT封裝物具有較習用PTH封裝物細之,線間距 -4" 本紙張尺度適昂中國國家標準（CNS ) A4规格（2丨OX297公釐） (請先閱讀背面之注意事項再填寫本頁)A7 A7 B7 Printed in the Consumers 'Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs and V. Invention Descriptions (1), this financial pass-a kind of conductive connection between conductive elements: new connection materials' and- A method of manufacturing the conductive connection. In addition, the present invention relates to an environmentally safe material and method that can be used to replace lead (Pb) solder connection technology. Background Most materials used in electronic money are made of metal, such as copper, silver, gold, silver, tin / tin (solder), pins, and so on. The solder connection technology using the wrong / lock alloy plays a key role in various levels of electronic packaging. Flip-chip bonding (or C4), ball-grid array (BGa), and ball-bond printed circuit boards (PCBk IC package assembly. The solder contact in the electronic package is both the decisive electrical connection and the mechanical / physical contact. When any one of the functions fails, the solder contact is considered damaged, and the There will be after-effects of the overall electronic system shutdown. The micro-package is mounted on the ㈣circuit material, most of which are widely used in Pb-Sn alloys with the lowest melting point (183.〇 lead-tin eutectic solder _ nSn-37% pb In these applications, there are two types of solder connection technology used for mass production: PTH and SMT soldering. The basic difference between the two technologies is the difference in PCB design and connection process. In SMT soldering, the microelectronic package is directly adhered to the surface. The main advantage of SMT is the high packaging density, because most of the PTH of pcB is eliminated, and the two surfaces of the PCB are used to adjust the component. In addition, the SMT package has More familiar with PTH seals Was fine, the line spacing -4 " This paper suitable scale Aung Chinese National Standard (CNS) A4 size (2 Shu OX297 mm) (Please read the back of the precautions to fill out this page)
經濟部中央橾準局員工消費合作社印製 A7 ——_________B7___ 五、發明説明（2 ) 較小之封裝物大小。因此，SMT使電子封裝物之大小巨 幅降低，而縮小整體系統之體積。 於SMT焊接中，焊糊係藉網版印刷法施加spcb上。 焊糊係由焊料細粉、助熔劑及有機媒質所叙成。於回流過 程中’焊料粒子熔化，使助熔劑活化，蒸發溶劑材料，同 時溶化之焊料疑聚，最後熟化。相對地，於波狀焊接過程 中’ PCB先以助熔劑處理，於彼上層裝置組件。之棱隨 溶化焊料之波動移動。 該焊接方法通常係使該焊料接點進行清洗步驟以去除殘 留助熔劑材料而完成。因爲環境之考量’不使用CFC及 其他有害之清潔劑，而以水溶性或非清洗性助溶劑材料 取代。 目前高階微電子裝置之電子封裝物及印刷電路板之間需 要極細之間距連接（數百毫米間距之大小）。目前Smt所 使用之焊漿技術因爲諸如橋接或焊料結球之焊接缺陷而無 法處理此種極細間距。使用p b - S η共熔焊料之另—個技 術限制爲其流溫度高’約2 1 5 °C。此溫度已.高於大部分 聚合物印刷電路板材料所使用之環氧樹脂之玻璃化溫度。 熱曝於該回流溫度下，使焊接後之印刷電路板中產生極高 之熱應變，尤其是與PCB表面垂直之方向，此岁向内: 具結構強化。疋故，組裝P C B中之殘留熱應變將對電子 系統之可信度造成影響。 使用含鉛（Pb)焊料更嚴重之問題在於環境之問題，如 同於其他工業中自汽油及塗料去除鉛所遭遇之趨勢及衝擊。 本紙浪尺度適用中國國家標準（CNS ) A4規格（210χ297公釐） (請先閱讀背面之注意事項再填寫本頁) > 訂 n . B7 發明説明（ 科之可能性^ 檢視兩類材料取代含pb焊料材 係討論該·導♦ w,科"金，及導電性糊（Ecp)。本發明 .劑）係由於聚/物科材之發展及應用。導電性糊（或黏著 成。充填銀梦之/备科基質中之金濃度填料粒子所組 如圖、所示脂係爲導電性糊6之最常見實例， 性，而環氧樹脂=2之該銀粒1 2 3 4 5 6藉渗出機構提供導電 性。此種充… 件7與基板1〇之間提供黏著 粒黏合樹脂材料長期於電子應用中充作晶 料無法應用於需導而非電導性質。然而，此種材 氧樹脂材料具核種限制，諸 2 0銀^ ^接觸性電阻增高、連接強度低、銀滲移、= 性，故八續^ 氧樹脂材料於所有方向皆具導電 :二=Γ向同性，，…外-種導電性黏著 ‘(或厚膜）僅於單-方向提供導電性。此類材料Ρ 各向異性”導電性黏著劑12或薄膜，如圖;所亍舟馬 各向異性導電性黏著劑12或薄膜僅於壓縮於二； 1 力1及=間時變成導電性。此種方法-般需要= 2 力。孩各向異性薄膜之主要應用係將液晶顯示面板於 3 其電子印刷電路板。該導電性粒子14通常可變步、 4 焊料球或塗有鎳及金之塑料球。黏合 荽σ 5 大多係爲熱固性樹脂、 黏者劑材科16 6 於吾人新近之發明⑽8 93 _0292)t ’揭示—種導電 7 性糊（ECP)材料，其係由塗有低熔點無鉛金屬諸如s 經濟部中央標準局貝Η消費合作社印褽 Μ Β7 -五、發明説明（4Printed by the Employees' Cooperatives of the Central Procurement Bureau of the Ministry of Economic Affairs A7 ——_________ B7___ V. Description of the invention (2) Smaller package size. Therefore, SMT significantly reduces the size of electronic packages and reduces the overall system size. In SMT welding, the solder paste is applied to the spcb by screen printing. Solder paste is composed of fine solder powder, flux and organic medium. During the reflow process, the solder particles are melted to activate the flux, evaporate the solvent material, and at the same time dissolve the molten solder, and finally mature. In contrast, during the corrugated soldering process, the PCB is first treated with a flux and placed on top of the device assembly. The edges move with the waves of the molten solder. The soldering method is usually performed by subjecting the solder joint to a cleaning step to remove residual flux material. Because of environmental considerations, 'CFC and other harmful cleaning agents are not used, but are replaced by water-soluble or non-cleaning co-solvent materials. At present, the electronic packages and printed circuit boards of high-end microelectronic devices require extremely fine pitch connections (height of several hundred millimeters). The solder paste technology currently used by Smt cannot handle such extremely fine pitches due to welding defects such as bridging or solder balls. Another technique that uses p b -S η eutectic solder is limited to a high flow temperature 'of about 2 1 5 ° C. This temperature is already higher than the glass transition temperature of epoxy resins used in most polymer printed circuit board materials. Heat exposure to this reflow temperature causes extremely high thermal strain in the printed circuit board after soldering, especially in a direction perpendicular to the PCB surface. This age is inward: with structural strengthening. Therefore, the residual thermal strain in the assembly PCB will affect the credibility of the electronic system. The more serious problem with the use of lead (Pb) solders is environmental issues, like the trends and impacts of lead removal from gasoline and coatings in other industries. The paper scale is applicable to China National Standard (CNS) A4 specification (210 x 297 mm) (Please read the notes on the back before filling out this page) > Order n. B7 Invention Description (The possibility of Section ^ Check the two types of materials instead of containing The pb solder material is discussed in this article. The "metal" and conductive paste (Ecp. The invention. Agent) is due to the development and application of polymer / material materials. Conductive paste (or sticky. Filled with gold concentration filler particles in silver dream / preparation matrix as shown in the picture, the lipid system is the most common example of conductive paste 6, and epoxy resin = 2 The silver particles 1 2 3 4 5 6 provide conductivity through the exudation mechanism. This filling ... provides adhesive particles between the 7 and the substrate 10 adhesive resin material for a long time in electronic applications as crystals can not be used to guide and Non-conductive properties. However, this kind of oxygen resin material has nuclear restrictions. The 20 silver ^ ^ has increased contact resistance, low connection strength, silver migration, and properties. Therefore, the oxygen resin material has all directions in all directions. Conductive: two = Γ isotropic ,, ... outer-a kind of conductive adhesive '(or thick film) only provides conductivity in a single-direction. Such materials P anisotropic "conductive adhesive 12 or thin film, as shown in the figure; The so-called anisotropic conductive adhesive 12 or film is only compressed in two; 1 force 1 and = become conductive in time. This method-generally requires = 2 force. The main application of the anisotropic film is The liquid crystal display panel is mounted on an electronic printed circuit board. The conductive particles 14 are usually variable in steps. 4 Solder balls or plastic balls coated with nickel and gold. Adhesion 荽 σ 5 is mostly thermosetting resin, adhesive agent material family 16 6 In my recent invention ⑽ 8 93 _0292) t 'Revelation-a conductive 7 paste (ECP ) Material, which is made of low-melting lead-free metal such as s printed by the Central Bureau of Standards of the Ministry of Economic Affairs, Behr Consumer Cooperatives, BM 7-V. Description of the invention (4
In、Bi、Sb及其合金薄層之銅粉所組成，混合有具有 環境安全性之助熔劑，而分散於熱塑性或熱固性聚合物 中。塗有含Sn之ECP之64 Cu粉末62之剖面圖表示於 圖3 〇 由鍍錫Cu粉及聚醯亞胺-矽氧烷樹脂所製造之ECP針 對陶瓷基板而言，係良好之高溫焊科接點諸如C4及焊球 連接（S B C)。然而，就聚合物印刷電路板應用而言，該 ECP並不適用，因爲回流溫度諸如250 X：大幅高於聚合 物樹脂例如FR-4之玻璃化溫度。適於此種應用之材料係 爲由鍍銦Cu粉調配聚醯亞胺-矽氧烷樹脂所製造之 ECP。鍍銦Cu粉糊之回流溫度預測應約1 8 0。(：，甚至低 於P b / S η共熔焊料之回流溫度2丨5。 於吾人新近之發明（Υ〇994-280 , Υ〇994-281)中， 吾人揭示一種製造供高導電性糊使用之樹枝狀粉末材料之 結構及方法，如圖4所示。該銅樹枝狀結構44係沉積於 虛設基板40上，之後另外於銅樹枝狀結構頂部電沉積低 熔點金屬42(In、Six、Zn、Bi、及Sb及其合金）。自 孩基板收集樹枝狀粉末，與熱塑性或熱固性聚合物樹脂混 合形成導電性特）。 ..。 於先前技藝中，焊料/聚合物複合糊狀材料係揭示於美 國專利第5,〇62,896號（Huang等人），主要比例爲可户 化蛘料粉末填料諸如In, Bi, Sb and its alloy thin copper powder, mixed with environmentally safe flux, dispersed in thermoplastic or thermosetting polymers. The cross-section of 64 Cu powder coated with ECP containing Sn is shown in Fig. 3. The ECP made of tin-plated Cu powder and polyimide-silicone resin is a good high-temperature soldering branch for ceramic substrates. Contacts such as C4 and solder ball connection (SBC). However, for polymer printed circuit board applications, this ECP is not suitable because the reflow temperature such as 250 X: significantly higher than the glass transition temperature of polymer resins such as FR-4. A suitable material for this application is ECP made from indium-plated Cu powder blended with polyimide-silicone resin. The reflow temperature prediction of the indium-plated Cu powder paste should be about 180. (:, Even lower than the reflow temperature of P b / S η eutectic solder 2 丨 5. In my recent inventions (Υ〇994-280, Υ〇994-281), I have disclosed a method for manufacturing a highly conductive paste The structure and method of the dendritic powder material used is shown in Fig. 4. The copper dendritic structure 44 is deposited on the dummy substrate 40, and then a low melting point metal 42 (In, Six, Zn, Bi, and Sb and their alloys). Collect dendritic powder from the substrate and mix it with thermoplastic or thermosetting polymer resin to form conductive properties). .. In the prior art, a solder / polymer composite paste material was disclosed in U.S. Patent No. 5,062,896 (Huang et al.), The main proportion of which is a customizable filler powder filler such as
Bi_Sn、Pb-Sn、Bi-Sn_Pb 人 金，次要比例之熱塑性聚合物諸如聚醯亞胺-矽氧烷，及 /人要比例之助熔劑。得到無氧化物而部分凝集之烊料人金 ㈤度適用中 (請先閏讀背面之注意事項再填寫本頁)Bi_Sn, Pb-Sn, Bi-Sn_Pb are human gold, thermoplastic polymers in minor proportions such as polyimide-siloxane, and fluxes in minor proportions. Obtained oxide-free and partially agglomerated consumer gold. Applicable degrees (Please read the precautions on the back before filling this page)
-五、發明説明（5 連接’其係經聚合物強彳μ 1 叱. 強化’而自身或於聚合物溶劑存在下 可於低回流溫度下再作用。 於相同之先前技蓺击 .A/r , 』 w中’美國專利第5,286,417號 (Mahmoud等人）揾子 不—種可熔化之導電性黏著劑，其包 «金屬口金填料諸如Sa 客A思pm人 Au及Bi-Au，及玻瑪化溫度涵 :ίί: 之熔點之熱塑性聚合物。該導電性材料於 聚合物中之充填量係介於約15重量百分比至约2量 分比之範圍内。 先前技藝美國專利第5，1 3 6,3 65號⑴ ㈣4 v —㈣著劑材料’其環氧樹脂基質中含有助 落劑及用相流焊接之金屬粒子諸如Sn、Pb、In、 B\、Sb、Ag等。於回流焊接時，該黏著劑於電子组件 及基板&間形成各向異性導電性。 於另—個先前技藝美國專利第5,213,715號 atterson等人）中，揭示_種方向導電性聚合物，其含 有Ni或Cu (金屬填料粉末。該金屬粉末以異於充作基 質樹脂之聚合物處理。經塗覆之聚合物於壓縮時移位，而 於填料粒于中得到導電性。 經濟部中央榡準局員工消費合作社印聚 簡述 +本發明之目的係提供—種具有環境安全性及低成本之導 電性糊射料。 、本發明另一個目的係提供一種導電性翔材料，其產生高 於習用充填銀之環氧樹脂之電導係數。 门 本發明另一個目的係提供一種導電性糊材料，其可於較 8- 本紙張尺度適用準（CNS )八4雜（210X297公釐） ：----— A7 A7 工 經濟部中央標準局員工消費合作社印裝 五、發明説明（6-Fifth, the description of the invention (5 connection 'It is strengthened by the polymer 彳 μ 1 叱. Strengthened' and can work at low reflux temperature by itself or in the presence of a polymer solvent. Strike in the same prior technology. A / r, "W", US Patent No. 5,286,417 (Mahmoud et al.), a fusible conductive adhesive, which includes metal fillers such as Sa, Au, Bi, Au, and glass. Martens temperature culm: ί: melting point of the thermoplastic polymer. The amount of the conductive material in the polymer is in the range of about 15% by weight to about 2% by weight. Prior art US Patent No. 5,1 3 6,3 65 ⑴ ㈣ 4 v —Chesive material 'whose epoxy resin matrix contains a drop aid and metal particles such as Sn, Pb, In, B \, Sb, Ag, etc. which are welded by phase flow. During soldering, the adhesive forms anisotropic conductivity between the electronic component and the substrate & in another prior art US Patent No. 5,213,715 (atterson et al.), A directional conductive polymer is disclosed which contains Ni Or Cu (metal filler powder. The metal powder is different from filling the matrix Polymer treatment of resin. The coated polymer shifts during compression and gets conductivity in the filler particles. Printed by the Consumers' Cooperative of the Central Economic and Technical Bureau of the Ministry of Economic Affairs + Brief description of the present invention is to provide—species A conductive paste material with environmental safety and low cost. Another object of the present invention is to provide a conductive material which produces a higher conductivity than the conventional silver-filled epoxy resin. Another object of the present invention is Provide a conductive paste material, which can be more than 8- this paper size (CNS) 8 4 miscellaneous (210X297 mm): A7 A7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Industry and Economics Invention Description (6
Pb-Sn共溶焊料糊之回流溫度低之溫度下加— ，發明另—個目的係提供—種導電性糊材料，其抗腐银 性高於習用充填銀之環氧樹脂糊。 於-特定具體實例中，吾人揭示一種電沉積粉末結構， 由Sn(底塗層）/Cu(樹枝狀體）/Sn(障壁層）/in(頂塗層）所 、且成此種粉末結構依序電沉積於虛擬基板諸如鈦或不銹 =上，可自彼處輕易分離電沉積材料。該底塗層Sn層保 濩Cu表面防止氧化或腐蝕，並於接觸而於粉末粒子之間 形成冶金鍵結時控制頂塗層之组成。該Sn障壁層使快速 C u - In複合物形成速度減慢，而防止粒子對粒子之鍵結。 孩In頂塗層與該Sn底塗層及障壁層於諸如ΐ5〇 π之低 下製迨粒予對粒子鍵結。而該底塗層、障壁層及頂塗層 之厚度係介於約i毫米或較薄之範園卜該以樹枝狀體 之長度係介於1至50毫米範圍内。 於另個特疋具體實例中，吾人揭示一種電沉積粉末結 構，由Sn(底塗層）/Cu(樹枝狀體）/Bi_Sn合金（頂塗層） 所組成。此結構中不需要介sCu&Bi_Sn金屬之間之障 壁層。該B1 - S η頂塗層係使用市售電鍍溶液而於近共熔 組成下電沉積。 初收集之電沉積粉末粒子之粒徑變化極大。爲了得到均 勻之粒徑，於微分子篩篩選過程中需同時使用噴射研磨法 或起音波粒fe縮減法^較佳粒徑分佈係介於5至丨〇臺 範圍内。 具有均勻而較佳粒徑之電沉積粉末與熱塑性或熱固性聚 -9 f紙張尺度適用中國國家標準（CNS ) A4規格（210Χ.297公瘦） (讀先閱讀背面之注意事項再填寫本頁)Pb-Sn eutectic solder paste is added at a low reflow temperature, and another object of the invention is to provide a conductive paste material that has a higher anti-corrosive silver resistance than the conventional silver-filled epoxy paste. In a specific specific example, we have disclosed an electrodeposited powder structure composed of Sn (undercoat layer) / Cu (dendritic body) / Sn (barrier layer) / in (top coating) and formed into such a powder structure Sequential electrodeposition on a dummy substrate such as titanium or stainless steel can easily separate the electrodeposition material from there. The Sn layer of the undercoat layer protects the Cu surface from oxidation or corrosion, and controls the composition of the top coat when metallurgical bonds are formed between the powder particles upon contact. The Sn barrier layer slows down the formation of the fast Cu-In complex and prevents particle-to-particle bonding. The In top coating and the Sn undercoat layer and the barrier layer are bonded to the particles at a particle diameter as low as ΐ50 π. The thickness of the undercoat layer, the barrier layer and the top coating layer is between about 1 mm or thinner. The length of the dendrimer is in the range of 1 to 50 mm. In another specific example, we have disclosed an electrodeposited powder structure composed of Sn (undercoat) / Cu (dendritic body) / Bi_Sn alloy (top coating). No barrier layer between sCu & Bi_Sn metal is required in this structure. The B1-Sn top coating was electrodeposited with a near eutectic composition using a commercially available plating solution. The particle size of the initially collected electrodeposited powder particles varies greatly. In order to obtain a uniform particle size, it is necessary to simultaneously use a jet milling method or an ultrasonic particle reduction method during the screening process of the micromolecular sieve. The preferred particle size distribution is in the range of 5 to 10 units. Electrodeposited powder with uniform and better particle size and thermoplastic or thermosetting poly-9 f paper size is applicable to Chinese National Standard (CNS) A4 specifications (210 × .297 male thin) (read the precautions on the back before filling in this page)
A7 B7 -五、發明説明（ 合物樹脂混合，以調配導電性糊，如吾人先前發明 (YO994-280，γ〇994-281)所述。 附圖簡述 、圖1係爲導電性糊之説明圖，其包含於環氧樹脂基質中 充作填料之«粒子。該導電性糊之導電性係分類爲各向 同性（先前技藝）。 圖2A及2B係爲導電性黏著劑之説明圖，其於該黏著 劑薄膜壓縮於兩接點或結合片之間時，僅於單一方向變成 導電性。該導電性黏著劑（或薄膜）係分類爲各向異性（先 前技藝）。 圖3係爲導電性糊材料之説明圖，其包含充填於熱塑性 聚合物樹脂基質中之球形铜粉。該銅粒係塗覆低熔點、無 毒性金屬諸如踢、姻、叙等。 圖4係爲樹枝狀體銅粉之説明圖，沉積於虛設基板上， 之後於樹枝狀體粉末上電解沉積鋼金屬薄層。 圖5係爲沉積於虛擬基板上之新穎電沉積粉末結構之説 明圖；Sn(底塗層）/Cu(樹枝狀體）/sn(障壁層）/ιη(頂塗 層）。 經濟部中央標準局員工消費合作社印m (請先閣讀背面之注意事項再填寫本頁) 圖6係爲沉積於虛擬基板上之新穎電沉積粉末結構之說 明圖；Sn(底塗層）/Cu(樹枝狀體）/Bi-Sn(頂塗層）。 詳述 於先前發明YO994-28 0及Y0 9 94-281中，吾人揭示 一種銅樹枝狀體結構，其沉積於虛擬基板上，之後於該鋼 樹枝狀體結構頂部電沉積銦金屬薄層。該塗覆銦之納樹枝 -10- 本紙張尺度適用中國國家標準（.CNS ) A4規格（210X297公釐）. A7 B7 經濟部中央標準局員工消費合作社印掣 五、發明説明（8 ) 狀鍾粉末可藉著自該虚擬基板括除而輕易收集。銅樹枝狀 體電沉積所用之詳細條件經揭示係爲三階電鍍流程；（j )致 密銅之初期電鍍，（ii)樹枝狀體核化階段，及（iii)樹枝狀 體生長階段。 亦揭示銦電鍍條件及浸浴。 圖5係爲沉積於虛擬基板5 0上之新穎電沉積粉末結構 之説明圖；Sn(底塗層）52/(：11(樹枝狀體）54/31!(障壁 層）56/In(頂塗層）58。底塗層Sn 52及障壁層Sn層56 係使用得自 LeaRonal，Inc.之 Solderon Tin Concentrate溶液電沉積。該Six障壁層可由其他金屬及 合金諸如Ni、Co、Cr、Fe、Pd及其合金所取代。 圖6係爲沉積於虛擬基板6 0上之新穎電沉積粉末結構 之説明圖；Sn(底塗層）62/Cu(樹枝狀體）64/Bi-Sn(頂 塗層）66。頂塗層Bi-Sn層66係以Bi-Sn合金之狀態沉 積’其組成接近共熔，60重量百分比Bi-40重量百分比 Sn 。孩Bi-Sn合金層係使用得自LeaRonal，Inc.之 Solderon Tin Concentrate 、 Solderon BiA7 B7-V. Description of the invention (composite resin is mixed to formulate conductive paste, as described in my previous invention (YO994-280, γ 994-281). Brief description of the drawings, Figure 1 is the conductive paste Explanatory diagram, which contains «particles filled as filler in the epoxy resin matrix. The conductivity of the conductive paste is classified as isotropic (previous technique). Figures 2A and 2B are explanatory diagrams of conductive adhesives, When the adhesive film is compressed between two contacts or a bonding sheet, it becomes conductive in only one direction. The conductive adhesive (or film) is classified as anisotropic (previous technique). Figure 3 is An illustration of a conductive paste material, which contains spherical copper powder filled in a thermoplastic polymer resin matrix. The copper particles are coated with low-melting, non-toxic metals such as kicks, marriages, Syria, etc. Figure 4 is a dendrimer An illustration of copper powder is deposited on a dummy substrate, and then a thin layer of steel metal is electrolytically deposited on the dendritic powder. Figure 5 is an illustration of a novel electrodeposition powder structure deposited on a dummy substrate; Sn (undercoating) ) / Cu (Dendrite) / sn (Bundle ) / Ιη (top coating). Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Figure 6 is a description of the novel electrodeposition powder structure deposited on the virtual substrate Figure; Sn (undercoat) / Cu (dendritic body) / Bi-Sn (top coating). Detailed description in the previous inventions YO994-28 0 and Y0 9 94-281, we reveal a copper dendritic structure It is deposited on a virtual substrate, and then a thin layer of indium metal is electrodeposited on top of the steel dendritic structure. The indium-coated nano-branch-10- This paper size applies to Chinese National Standard (.CNS) A4 (210X297) %). A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (8) The bell powder can be easily collected by removing it from the virtual substrate. The detailed conditions used for the electrodeposition of copper dendrimers have been revealed. It is a three-stage plating process; (j) the initial plating of dense copper, (ii) the dendritic nucleation stage, and (iii) the dendritic growth stage. The indium plating conditions and immersion bath are also revealed. Figure 5 shows the deposition Novel electrodeposition powder junction on virtual substrate 50 Explanation of the structure; Sn (undercoat layer) 52 / (: 11 (dendritic body) 54/31! (Barrier layer) 56 / In (top coat) 58. Undercoat layer Sn 52 and barrier layer Sn layer 56 Electrodeposition using a Soleron Tin Concentrate solution from LeaRonal, Inc. The Six barrier layer can be replaced by other metals and alloys such as Ni, Co, Cr, Fe, Pd, and their alloys. Figure 6 shows the deposition on the dummy substrate 6 An illustration of the structure of a novel electrodeposited powder on 0; Sn (base coat) 62 / Cu (dendritic body) 64 / Bi-Sn (top coat) 66. The top coating Bi-Sn layer 66 is deposited in the state of a Bi-Sn alloy 'and its composition is close to eutectic, 60 wt% Bi to 40 wt% Sn. The Bi-Sn alloy layer uses Solderon Tin Concentrate, Solderon Bi from LeaRonal, Inc.
Concentrate > Solderon Acid、Solderon Bi Primary 及 Solderon Bi Secondary 溶液沉積。用於 Sn/Cu/Bi-Sn粉末材料之典型電沉積條件如下： i) Sn(底塗層）；2埃，〇.5伏特’ 3分鐘，1〇〇平方英 咕面積·， ii) Cu(樹枝狀體）；2〇埃，2.5伏特，2分鐘，1〇〇 平方英吋面積， 11 Μ氏張尺度適用中國國家標準（CNS )八顿洛（2ι〇χ297公釐 (請先閱讀背面之ii意事項再填寫本頁) -.ii ^~. 訂----- A7 -：__ 〜 B7 五、發明説明（9 ) ii〇Bi-Sn(頂塗層）；14埃，2 〇伏特，2分鐘，1 〇〇 平方英吋面積。 用於CU電鍍之陽極材料係爲無氧銅金屬，而及 Bi-Sn電鍍則使用純錫金屬。 初收集之電沉積粉末粒子之粒徑變化極大。爲丁得到均 勻之粒杈’於微分子篩篩選過程中需同時使用嘴射研磨法 或超音波粒徑縮減法。較佳粒徑分佈係介於5至1〇毫米 範園内。 ’ 具有均勻而最佳粒徑範圍之電沉積粉末係儲存於“非清 潔性助溶劑Q u a 1 i t e k # 3 0 5中’直至用於糊調配物。導 電性糊係藉將具有均勻而需要之粒徑之填料粉末分散於熱 塑性或熱固性聚合物樹脂基質中而調配，如先前發明 (YO994-280，Y0994-281)所述。 爲了針對電及機械性質進行定性，藉著連接兩個“L形，， 銅標籤而製造低溫、無鉛導電性糊之連接試樣。該連接操 作係於180Ό、15分鐘、25psi下進行。使用聚酿亞胺 硬氧燒樹脂自Sn/Cu/m-Sn製造之模型連接點顯示較焊 料接點優越之電及機械性質。 ----^----~.1' 一衣--- (請先閱讀背面之注意事項再填寫本頁) 、11 丨©- 經濟部中央橾準局員工消背合作社印製 -12- 本紙張尺度適^"中國國家標準（CNS ) Μ規格(2 6x297公嫠）Concentrate > Solderon Acid, Solderon Bi Primary, and Solderon Bi Secondary solution deposition. Typical electrodeposition conditions for Sn / Cu / Bi-Sn powder materials are as follows: i) Sn (undercoat); 2 angstroms, 0.5 volts' for 3 minutes, 100 square feet area, ii) Cu (Dendritic body); 20 angstroms, 2.5 volts, 2 minutes, 100 square inches area, 11 μM scale applicable to Chinese National Standard (CNS) Badun Luo (2 × 297 mm (please read the back first) Please fill in this page again for the meaning of ii) -.ii ^ ~. Order ----- A7-: __ ~ B7 V. Description of the invention (9) ii〇 Bi-Sn (top coating); 14 angstrom, 2 〇 Volt, 2 minutes, area of 100 square inches. The anode material used for CU plating is oxygen-free copper metal, and Bi-Sn plating uses pure tin metal. The particle size change of the initially collected electrodeposited powder particles Very large. In order to obtain uniform grains, it is necessary to use mouth-shot grinding or ultrasonic particle size reduction in the screening process of micromolecular sieves. The preferred particle size distribution is within the range of 5 to 10 mm. The electrodeposition powder with the optimal particle size range is stored in "non-cleaning co-solvent Q ua 1 itek # 3 0 5 'until it is used for paste formulation. Conductive The paste is formulated by dispersing filler powder having a uniform and desired particle size in a thermoplastic or thermosetting polymer resin matrix, as described in the previous invention (YO994-280, Y0994-281). In order to characterize electrical and mechanical properties , By connecting two "L-shaped, copper labels," a connection sample of a low-temperature, lead-free conductive paste was produced. The connection operation was performed at 180 ° F, 15 minutes, and 25 psi. Using polyimide hard oxygen resin The connection points of the model made of Sn / Cu / m-Sn show superior electrical and mechanical properties than solder joints. ---- ^ ---- ~ .1 'Yiyi --- (Please read the precautions on the back first (Fill in this page again), 11 丨 ©-Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs -12-This paper is suitable for ^ " China National Standard (CNS) Μ size (2 6x297 cm)