JP2002288612A - Manufacturing method for tag for loading - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a tag for load, capable of easily manufacturing the load tag with high reliability at a low cost, in which it is not required that a change of design of an IC mounting part is carried out every at products, if the load tag is in a state of a little production and many kinds. SOLUTION: The manufacturing method for the load tag comprises steps (1) of forming an antenna part, in which land parts are provided on a surface of a sheet base material; (2) of forming an insulation layer between the land parts; (3) of forming second land parts on a surface of an interposer base material, by conducting them corresponding to the land parts and adhering an interposer mounted with an IC chip onto a conductor between the second land parts, such that the land parts of the sheet base material and the second land parts of the interposer are superposed; and (4) of lamitating an adhesive sheet and of adhering onto the surface of the sheet base material, to which the interposer is adhered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a luggage tag, and more particularly to a method for manufacturing a luggage tag such as a non-contact IC tag having a non-contact data transceiver.

[0002]

Conventionally, when a package such as a luggage is delivered with delivery information related to the package, a package tag (such as an air baggage tag or the like) which is attached through a baggage handle or the like is attached. ) Is used,
Delivery work is performed based on the delivery information and the like.
As an example of the luggage tag, there is a type in which a string is passed through a luggage handle or the like to stop it, like a tag, but it can be passed through a luggage handle or the like for reasons such as facilitating attachment work. As described above, a tag having a band shape and having an adhesive means is increasingly used.

However, a conventional air baggage tag is:
Although delivery destination management was performed using barcodes, barcodes require manual data reading operations, cannot be rewritten, and can be read by third parties because they are explicit data. There were problems such as weakness on the surface.

Therefore, an information recording medium [RF-ID (Radio F) capable of recording and erasing data by transmitting and receiving data in a non-contact state instead of a bar code.
frequency IDentification)]
Have been proposed.

[0005]

However, the process of separately manufacturing an inlet having an RF-ID module and then tagging the same has a problem that the process is complicated and expensive, and the RF-ID module is provided for each product. Since it is necessary to design, it is necessary to change the design of the IC mounting portion and the setting of the manufacturing process conditions, and there is a problem that it is not possible to cope with a small number of products. A first object of the present invention is to solve the conventional problems and to provide a method of manufacturing a highly reliable and inexpensive luggage tag easily and at a low cost even in a small number of types. It is.

[0006]

Means for Solving the Problems Claim 1 of the present invention has been made in consideration of the above-mentioned problems, and comprises the following steps (1) to (4).
This is a method for manufacturing a luggage tag, which is manufactured according to (3). (1) A step of winding a linear antenna around the surface of a sheet substrate to form an antenna portion having lands at one end and the other end. (2) a second land portion is formed by conducting to the interposer substrate surface corresponding to the land portion, respectively;
A step of attaching an interposer having an IC chip mounted on the conductor between the second lands so that the lands of the sheet base and the second lands of the interposer overlap. (3) A step of laminating and adhering an adhesive sheet on the surface of the sheet substrate on which the interposer is adhered.

A second aspect of the present invention is characterized in that a step of forming an insulating layer between the lands is added between the steps (1) and (2).

According to a third aspect of the present invention, in the method for manufacturing a luggage tag according to the first or second aspect, the sheet base is a peelable sheet base.

According to a fourth aspect of the present invention, in the method for manufacturing a luggage tag according to the first to third aspects, the adhesive sheet is a heat-sensitive recording sheet.

In the present invention, since the interposer on which the IC chip is mounted is adhered to the sheet substrate, it is not necessary to change the design of the IC mounting section for each product. In addition, a reliable and inexpensive luggage tag can be easily manufactured at low cost.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to FIGS. 1 (1) to 1 (4) are explanatory views illustrating an embodiment of a method for manufacturing a luggage tag of the present invention.
FIG. 2 is an explanatory cross-sectional view of the luggage tag manufactured by the manufacturing process shown in FIG.

As shown in FIG. 1A, first, a linear antenna is wound on the upper surface of a sheet substrate 1 and lands 2-1 and 2-2 are provided at one end and the other end thereof, respectively. Form 3

As the sheet substrate 1 used in the present invention, known materials such as paper, synthetic paper containing resin and various fillers, woven fabric, nonwoven fabric, mat and resin film can be used. Specifically, for example, various papers, woven fabrics, nonwoven fabrics, mats or a combination thereof made of organic fibers such as polyester fibers and polyamide fibers, or those and / or glass fibers, and inorganic fibers such as alumina fibers are used. , A composite resin substrate formed by impregnating with a resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer substrate, and polyvinyl alcohol Resin base material, polyvinyl chloride resin base material, polyvinylidene chloride resin base material, polystyrene resin base material, polycarbonate resin base material, acrylonitrile butadiene styrene copolymer resin base material, polyether sulfone resin base material Such as plastic resin base material, or matte treatment, Na discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, and the like that has been subjected to surface treatment such as flame plasma treatment and ozone treatment, or various adhesion facilitating treatment.

The sheet substrate 1 used in the present invention can be laminated on the pressure-sensitive adhesive sheet 9 by adhering through a pressure-sensitive adhesive layer 13 described later. Therefore, the sheet base 1 is used at the time of use.
A sheet substrate having a releasability that can be easily separated at the interface between the adhesive sheet 13 and the adhesive layer 13 of the adhesive sheet 9, that is, a releasable sheet can be preferably used. The release agent layer of the releasable sheet may be provided on the entire surface of the sheet or on a necessary portion.

In order to form the antenna section 3 provided with the lands 2-1 and 2-2, for example, a solvent-evaporating type, a thermosetting type,
Screen printing using a photo-curing or electron beam-curing conductive paste for drying and fixing, or uncoated metal wire bonding, metal foil bonding, metal deposition film transfer, A known method such as a molecular layer forming method can be used. A method of screen printing using a conductive paste and drying and fixing can be preferably used.

Next, as shown in FIG. 1B, an insulating layer 4 is formed to cover the linear antenna between the lands 2-1 and 2-2. In the present embodiment, such an insulating layer is formed, but this step is not necessarily required depending on the shape of the lands, the distance between the lands, and the arrangement.

The formation of the insulating layer 4 can be performed by a known method such as a method of printing and fixing an insulating ink, a method of attaching an insulating film, papers, or insulating tapes. When printing is performed, any printing method can be used, but screen printing is most preferably used.

The insulating ink is, for example, silica, alumina,
Examples thereof include those containing insulating particles such as talc and resin powder and binders such as a penetration drying type, a solvent drying type, a thermosetting type, a photocuring type, and an electron beam curing type as essential components.
Of these, photocurable binders are preferred because they can shorten the curing time and improve efficiency, and solventless binders are preferred because they can prevent microcracks due to solvent volatilization. The thickness of the insulating layer 4 is preferably equal to or greater than the thickness of the antenna unit 3.

Next, as shown in FIG. 1C, the second land portions 5-1 and 5-2 are electrically connected to the surface of the interposer substrate 5 corresponding to the land portions 2-1 and 2-2, respectively. 2
And the second land portions 5-1 and 5-2 are formed.
The interposer 8 prepared in advance by mounting the IC chip 7 on the conductor 6 between the land portions 2-1 and 2-
2 and the second land portions 5-1 and 5-2 of the interposer 8 are attached so as to overlap each other.

The interposer substrate 5 used in the present invention can be selected from those usable as the sheet substrate 1 and used. The interposer substrate 5 may be the same as or different from the sheet substrate 1.

The formation of the second lands 5-1 and 5-2 connected and conductive by the conductor 6 can be performed by the same method as the method of forming the antenna section 3. Similar to the formation of the antenna section 3, a method of screen printing using a conductive paste and drying and fixing can be preferably used.

To mount the IC chip 7 on the conductor 6, for example, a coating method, a dispensing method, a printing method,
NCF (Non-Conductive Film,
Insulating film) or NCP (Non-Conductive Past)
e, an insulating paste) (adhesive) is arranged, pressurized from above with a necessary pressure by a heat and pressure device (flip chip bonder) to pierce a bump (not shown) of the IC chip 7, and then heat, irradiate light, The bumps and the conductors 6 are hardened by a wire, a high frequency wave, an ultrasonic wave, or the like so as to conduct. Or ACF (Un-iso
IC chip 7 using tropic conductive film (Anisotropic conductive film) or ACP (Un-isotropic Conductive Paste) (conductive adhesive).
It is also possible to achieve conduction between the bumps (not shown) and the conductor 6.

As the IC chip 7 used in the present invention, any known IC chip can be used, and the pattern of the antenna section 3 may be designed correspondingly. The thickness of the IC chip 7 is desirably substantially the same as the thickness of the conductor 6, and is preferably, for example, about 200 to 10 μm. As described above, bumps may be formed on the IC chip 7 by metal electroplating, studs, electroless metal plating, or fixing of a conductive resin.

Next, as shown in FIG. 1 (4), an adhesive sheet 9 is laminated and adhered on the upper surface of the sheet substrate 1 to which the interposer 8 is adhered, thereby forming a luggage tag 10.

As shown in FIG. 2, the pressure-sensitive adhesive sheet 9 in this embodiment is made of a known second sheet substrate 11 such as paper, synthetic paper containing resin or various fillers, woven fabric, non-woven fabric, and resin film. A heat-sensitive printing layer 12 is provided on the upper surface side as a portion for writing luggage information, and an adhesive layer 13 formed by a known method using a known adhesive is provided on the lower surface side for thermal recording. It is a sheet.

Sheet substrate 1 with interposer 8 attached
A pressure-sensitive adhesive sheet 9 is laminated and adhered to the upper surface through a pressure-sensitive adhesive layer 13 to form a luggage tag 10.

The second sheet substrate 11 used in the present invention can be selected from those which can be used as the sheet substrate 1 and used.
It may be the same or different.

Numeral 14 denotes a half cut portion such as a perforation. When the luggage tag 10 is used, the half cut portion 1 is used.
The portion of the sheet substrate 1 outside the portion 4 is cut off at the half-cut portion 14 and peeled off to expose the corresponding pressure-sensitive adhesive layer 13, which is then attached to the baggage as it is via the adhesive layer 13, or the baggage is gripped. The luggage tag 10 can be attached by bonding the pressure-sensitive adhesive layers 13 to each other by passing through the like.

In the above example, an example was shown in which the interposer 8 having the antenna section 3 on which the IC chip 7 was mounted was used. However, in the present invention, the interposer 8 (only the antenna section 3 on which the IC chip 7 was not mounted was formed). (In the case of an individual recognition module based on a resonance frequency) can also be used.

In the above example, the thermal recording sheet provided with the thermal printing layer 12 in advance as a portion for describing luggage information on the upper surface side of the second sheet substrate 11 was used. However, the thermal printing layer 12 was not provided in advance. Luggage tag 10 formed other than thermal printing layer 12
After the production, the thermal printing layer 12 can be provided last.

The description of the above embodiment is for describing the present invention, and does not limit the invention described in the claims or reduce the scope. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0032]

According to the method for manufacturing a luggage tag according to the first and second aspects of the present invention, an interposer on which an IC chip is mounted is attached to a sheet base material. This eliminates the necessity of performing such a process, and has a remarkable effect that a highly reliable and inexpensive luggage tag can be easily manufactured at low cost even in a small number of products.

According to the third aspect of the present invention, there is provided a method for manufacturing a luggage tag,
Since the sheet substrate is a releasable sheet substrate, the same effect as in the production method of claim 1 is obtained, and a half-cut portion such as a perforation is provided in the sheet substrate. Cut and peel off the outer part of the sheet base material at the half-cut part, exposing the corresponding adhesive layer, pasting it on the baggage as it is through this adhesive layer, or passing it through the baggage handle etc. This has a remarkable effect that the luggage tag can be attached by bonding the layers together.

[0034] The method for manufacturing a luggage tag according to claim 4 of the present invention is as follows.
Since the pressure-sensitive adhesive sheet is a heat-sensitive recording sheet, it has the same effects as the production methods of claims 1 and 2, and
There is a remarkable effect that the configuration is simpler and the cost is lower.

[Brief description of the drawings]

FIGS. 1A to 1D are explanatory views illustrating an embodiment of a method for manufacturing a luggage tag according to the present invention.

FIG. 2 is an explanatory sectional view of a luggage tag according to the present invention manufactured by the manufacturing process shown in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sheet base material 2-1 and 2-2 Land part 3 Antenna part 4 Insulation layer 5-1 and 5-2 Second land part 6 Conductor 7 IC chip 8 Interposer 9 Adhesive sheet 10 Luggage tag 11 Second sheet Base material 12 Thermal printing layer 13 Adhesive layer 14 Half cut part

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 3/02 G06K 19/00 H 3/14 K F term (Reference) 2C005 HA17 JC03 KA01 LB06 MA19 MB06 NA09 PA02 PA18 QB04 RA04 RA22 5B035 AA04 BA05 BB09 CA23

Claims (4)

[Claims] 1. A method for manufacturing a luggage tag, which is manufactured by the following steps (1) to (3). (1) A step of winding a linear antenna around the surface of a sheet substrate to form an antenna portion having lands at one end and the other end. (2) a second land portion is formed by conducting to the interposer substrate surface corresponding to the land portion, respectively;
A step of attaching an interposer having an IC chip mounted on the conductor between the second lands so that the lands of the sheet base and the second lands of the interposer overlap. (3) A step of laminating and adhering an adhesive sheet on the surface of the sheet substrate on which the interposer is adhered. 2. The method for manufacturing a luggage tag according to claim 1, further comprising a step of forming an insulating layer between said lands between said steps (1) and (2). 3. The method for manufacturing a luggage tag according to claim 1, wherein the sheet base is a peelable sheet base. 4. The method according to claim 1, wherein the pressure-sensitive adhesive sheet is a heat-sensitive recording sheet.