DK1333957T3 - Blyfrie loddemetaller - Google Patents

Blyfrie loddemetaller

Info

Publication number
DK1333957T3
DK1333957T3 DK00976153T DK00976153T DK1333957T3 DK 1333957 T3 DK1333957 T3 DK 1333957T3 DK 00976153 T DK00976153 T DK 00976153T DK 00976153 T DK00976153 T DK 00976153T DK 1333957 T3 DK1333957 T3 DK 1333957T3
Authority
DK
Denmark
Prior art keywords
free solder
lead
bismuth
antimony
indium
Prior art date
Application number
DK00976153T
Other languages
Danish (da)
English (en)
Inventor
Jennie S Hwang
Zhenfeng Guo
Original Assignee
Singapore Asahi Chemical & Solder Ind Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Singapore Asahi Chemical & Solder Ind Pte Ltd
Application granted granted Critical
Publication of DK1333957T3 publication Critical patent/DK1333957T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Materials For Medical Uses (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Organic Insulating Materials (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DK00976153T 2000-11-16 2000-11-16 Blyfrie loddemetaller DK1333957T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00976153A EP1333957B1 (en) 2000-11-16 2000-11-16 Lead-free solders
PCT/GB2000/004365 WO2002040213A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Publications (1)

Publication Number Publication Date
DK1333957T3 true DK1333957T3 (da) 2005-06-20

Family

ID=9886311

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00976153T DK1333957T3 (da) 2000-11-16 2000-11-16 Blyfrie loddemetaller

Country Status (14)

Country Link
EP (1) EP1333957B1 (el)
AT (1) ATE293513T1 (el)
AU (1) AU2001214037A1 (el)
CY (1) CY1105145T1 (el)
CZ (1) CZ297089B6 (el)
DE (1) DE60019651T2 (el)
DK (1) DK1333957T3 (el)
ES (1) ES2241671T3 (el)
HU (1) HU228577B1 (el)
NO (1) NO333677B1 (el)
PL (1) PL195528B1 (el)
PT (1) PT1333957E (el)
RU (1) RU2254971C2 (el)
WO (1) WO2002040213A1 (el)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
US20050199323A1 (en) 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
US8122833B2 (en) 2005-10-04 2012-02-28 Alliant Techsystems Inc. Reactive material enhanced projectiles and related methods
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
DE602004009982T2 (de) * 2003-03-31 2008-09-18 Sanyo Electric Co., Ltd., Moriguchi Metallschablone und Verfahren zum Drucken von bleifreier Lötpaste mit derselben
CN100423217C (zh) 2003-08-26 2008-10-01 德山株式会社 元件接合用基板、元件接合基板及其制造方法
FR2867469A1 (fr) * 2004-03-15 2005-09-16 Alliant Techsystems Inc Compositions reactives contenant un metal, et leur procede de production
CZ300575B6 (cs) * 2005-01-04 2009-06-17 Jeník@Jan Bezolovnatá pájka
CN100453244C (zh) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 无铅锡焊料
CN101357421B (zh) * 2005-12-16 2010-12-29 浙江亚通焊材有限公司 无铅锡焊料
US8888932B2 (en) 2007-07-18 2014-11-18 Senju Metal Industry Co., Ltd. Indium-containing lead-free solder for vehicle-mounted electronic circuits
US7821130B2 (en) * 2008-03-31 2010-10-26 Infineon Technologies Ag Module including a rough solder joint
JP5280520B2 (ja) * 2009-04-20 2013-09-04 パナソニック株式会社 はんだ材料および電子部品接合体
EP2739431B1 (en) * 2011-08-02 2020-06-24 Alpha Assembly Solutions Inc. Solder compositions
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
CN103042315B (zh) * 2013-01-22 2015-05-27 马莒生 耐热耐湿低熔点无铅焊料合金
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
SG11201608933SA (en) * 2014-04-30 2016-12-29 Nihon Superior Co Ltd Lead-free solder alloy
JP5638174B1 (ja) * 2014-06-24 2014-12-10 ハリマ化成株式会社 はんだ合金、はんだ組成物、ソルダペーストおよび電子回路基板
JP6730999B2 (ja) * 2015-05-05 2020-07-29 インディウム コーポレーション 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金
WO2016185674A1 (ja) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6135885B2 (ja) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP6397079B1 (ja) * 2017-04-07 2018-09-26 株式会社ケーヒン はんだ材料
CN109894768B (zh) * 2019-03-29 2021-06-18 东莞市千岛金属锡品有限公司 一种低温无铅合金焊料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (ko) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JP3736819B2 (ja) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 無鉛はんだ合金
WO1999004048A1 (en) * 1997-07-17 1999-01-28 Litton Systems, Inc. Tin-bismuth based lead-free solders
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ

Also Published As

Publication number Publication date
EP1333957A1 (en) 2003-08-13
WO2002040213A1 (en) 2002-05-23
CZ297089B6 (cs) 2006-09-13
ES2241671T3 (es) 2005-11-01
CY1105145T1 (el) 2009-11-04
EP1333957B1 (en) 2005-04-20
RU2254971C2 (ru) 2005-06-27
RU2003114304A (ru) 2005-01-20
PL361336A1 (en) 2004-10-04
PL195528B1 (pl) 2007-09-28
NO20032185L (no) 2003-05-14
HUP0301858A2 (hu) 2003-08-28
PT1333957E (pt) 2005-09-30
ATE293513T1 (de) 2005-05-15
CZ20031348A3 (cs) 2004-04-14
NO20032185D0 (no) 2003-05-14
NO333677B1 (no) 2013-08-05
DE60019651T2 (de) 2005-09-22
AU2001214037A1 (en) 2002-05-27
HUP0301858A3 (en) 2005-05-30
HU228577B1 (en) 2013-04-29
DE60019651D1 (de) 2005-05-25

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