DE60319932D1 - Bleifreie Lötkugel - Google Patents

Bleifreie Lötkugel

Info

Publication number
DE60319932D1
DE60319932D1 DE60319932T DE60319932T DE60319932D1 DE 60319932 D1 DE60319932 D1 DE 60319932D1 DE 60319932 T DE60319932 T DE 60319932T DE 60319932 T DE60319932 T DE 60319932T DE 60319932 D1 DE60319932 D1 DE 60319932D1
Authority
DE
Germany
Prior art keywords
solder ball
lead
free solder
substrate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60319932T
Other languages
English (en)
Other versions
DE60319932T2 (de
Inventor
Rikiya Katoh
Shinichi Nomoto
Hiroshi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of DE60319932D1 publication Critical patent/DE60319932D1/de
Application granted granted Critical
Publication of DE60319932T2 publication Critical patent/DE60319932T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60319932T 2002-10-17 2003-10-17 Bleifreie Lötkugel Expired - Lifetime DE60319932T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002303197 2002-10-17
JP2002303197 2002-10-17

Publications (2)

Publication Number Publication Date
DE60319932D1 true DE60319932D1 (de) 2008-05-08
DE60319932T2 DE60319932T2 (de) 2009-04-16

Family

ID=32040837

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60319932T Expired - Lifetime DE60319932T2 (de) 2002-10-17 2003-10-17 Bleifreie Lötkugel

Country Status (4)

Country Link
US (2) US20040112474A1 (de)
EP (1) EP1410871B1 (de)
AT (1) ATE390241T1 (de)
DE (1) DE60319932T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI305403B (en) * 2004-06-15 2009-01-11 Advanced Semiconductor Eng Lead-free conductive jointing bump
US8887980B2 (en) 2005-06-10 2014-11-18 Senju Metal Industry Co., Ltd. Method of soldering portions plated by electroless Ni plating
EP1924394A2 (de) * 2005-08-24 2008-05-28 FRY'S METALS, INC. d/b/a ALPHA METALS, INC. Lötlegierung
US8641964B2 (en) 2005-08-24 2014-02-04 Fry's Metals, Inc. Solder alloy
CN100443246C (zh) * 2007-01-30 2008-12-17 山东大学 堆焊用填充金属颗粒及其制备方法
CN100460136C (zh) * 2007-01-30 2009-02-11 山东大学 焊接用填充金属颗粒及其制备方法
US8013444B2 (en) 2008-12-24 2011-09-06 Intel Corporation Solder joints with enhanced electromigration resistance
JP6082952B1 (ja) * 2016-07-04 2017-02-22 株式会社弘輝 はんだ合金、ヤニ入りはんだ
US11847651B2 (en) 2017-05-23 2023-12-19 Kenneth A Kopf Systems and methods for facilitating biometric tokenless authentication for services

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4242645C2 (de) * 1992-12-17 1997-12-18 Deutsche Forsch Luft Raumfahrt Verfahren und Einrichtung zur Herstellung von Metallkügelchen annähernd gleichen Durchmessers
US5653783A (en) * 1994-01-20 1997-08-05 Nippon Steel Corporation Method of producing fine metal balls
JPH10144718A (ja) * 1996-11-14 1998-05-29 Fukuda Metal Foil & Powder Co Ltd スズ基鉛フリーハンダワイヤー及びボール
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
US6638847B1 (en) * 2000-04-19 2003-10-28 Advanced Interconnect Technology Ltd. Method of forming lead-free bump interconnections
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法

Also Published As

Publication number Publication date
US20050248020A1 (en) 2005-11-10
EP1410871B1 (de) 2008-03-26
EP1410871A1 (de) 2004-04-21
DE60319932T2 (de) 2009-04-16
ATE390241T1 (de) 2008-04-15
US20040112474A1 (en) 2004-06-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition