DE60142387D1 - Bleifreie Lötpaste - Google Patents

Bleifreie Lötpaste

Info

Publication number
DE60142387D1
DE60142387D1 DE60142387T DE60142387T DE60142387D1 DE 60142387 D1 DE60142387 D1 DE 60142387D1 DE 60142387 T DE60142387 T DE 60142387T DE 60142387 T DE60142387 T DE 60142387T DE 60142387 D1 DE60142387 D1 DE 60142387D1
Authority
DE
Germany
Prior art keywords
solder paste
peak
solder
mass percent
solder alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60142387T
Other languages
English (en)
Inventor
Rikiya Katoh
Osamu Munekata
Yoshitaka Toyoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8182639&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60142387(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Application granted granted Critical
Publication of DE60142387D1 publication Critical patent/DE60142387D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60142387T 2001-03-01 2001-03-01 Bleifreie Lötpaste Expired - Lifetime DE60142387D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01400534.2A EP1245328B9 (de) 2001-03-01 2001-03-01 Verwendung von Silber in einer bleifreien Lötpaste

Publications (1)

Publication Number Publication Date
DE60142387D1 true DE60142387D1 (de) 2010-07-29

Family

ID=8182639

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60142387T Expired - Lifetime DE60142387D1 (de) 2001-03-01 2001-03-01 Bleifreie Lötpaste

Country Status (5)

Country Link
EP (3) EP2147740B1 (de)
AT (1) ATE471224T1 (de)
DE (1) DE60142387D1 (de)
DK (1) DK2147740T3 (de)
ES (2) ES2345810T4 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
GB2413565A (en) * 2004-04-15 2005-11-02 Henkel Loctite Adhesives Ltd Lead-free, bismuth-free solder alloy powders and a method of production thereof
TWI279281B (en) * 2004-05-20 2007-04-21 Theresa Inst Co Ltd Lead-free solder alloy and preparation thereof
GB2419137A (en) * 2004-10-15 2006-04-19 Alpha Fry Ltd Solder alloy
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
FR2888253B1 (fr) * 2005-07-07 2007-11-23 Ind Des Poudres Spheriques Sa Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.
CN1325680C (zh) * 2005-08-04 2007-07-11 上海交通大学 Sn－Ag－Cu－Cr合金无铅焊料的制备方法
US8641964B2 (en) 2005-08-24 2014-02-04 Fry's Metals, Inc. Solder alloy
JP2009506203A (ja) * 2005-08-24 2009-02-12 フライズ メタルズ インコーポレイテッド 半田合金
US9260768B2 (en) 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US9175368B2 (en) 2005-12-13 2015-11-03 Indium Corporation MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
WO2007081775A2 (en) * 2006-01-10 2007-07-19 Illinois Tool Works Inc. Lead-free solder with low copper dissolution
JP4076182B2 (ja) * 2006-07-27 2008-04-16 トピー工業株式会社 無鉛はんだ合金
JP5019179B2 (ja) * 2007-03-29 2012-09-05 日立金属株式会社 はんだ合金およびそれを用いたガラス接合体
JP4787384B1 (ja) * 2010-10-29 2011-10-05 ハリマ化成株式会社 低銀はんだ合金およびはんだペースト組成物
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
EP2698225B1 (de) * 2011-04-15 2018-07-25 Nihon Superior Co., Ltd. Bleifreie messinglegierung
KR20210008568A (ko) * 2011-08-02 2021-01-22 알파 어셈블리 솔루션스 인크. 고 충격 인성 땜납 합금
CN103906596B (zh) * 2011-10-04 2017-03-01 铟泰公司 具有优越的降落冲击可靠性的Mn掺杂的Sn基焊料合金及其焊缝
JP2013239470A (ja) * 2012-05-11 2013-11-28 Fuji Electric Fa Components & Systems Co Ltd 表面実装基板
US10322471B2 (en) * 2014-07-21 2019-06-18 Alpha Assembly Solutions Inc. Low temperature high reliability alloy for solder hierarchy
RU2609583C2 (ru) * 2015-03-27 2017-02-02 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Припой для бесфлюсовой пайки и способ его изготовления
CN105290642B (zh) * 2015-11-28 2018-02-23 上海一远电子科技有限公司 一种抗氧化锡铜系合金钎料
JP6011709B1 (ja) * 2015-11-30 2016-10-19 千住金属工業株式会社 はんだ合金
DE102016112390B4 (de) 2016-07-06 2021-08-12 Infineon Technologies Ag Lötpad und Verfahren zum Verbessern der Lötpadoberfläche
CN106702243A (zh) * 2016-12-07 2017-05-24 北京态金科技有限公司 低熔点金属及其制备方法和应用
JP6708942B1 (ja) * 2019-05-27 2020-06-10 千住金属工業株式会社 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板
JP6700568B1 (ja) * 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手
CN111468860A (zh) * 2020-04-16 2020-07-31 深圳市博士达焊锡制品有限公司 一种高温锡条及其制备方法
CN113385853A (zh) * 2021-07-30 2021-09-14 浙江亚通焊材有限公司 一种低银高可靠无铅软钎料及其制备方法、应用
CN115028467B (zh) * 2022-06-20 2023-07-18 昆明冶金研究院有限公司北京分公司 低空洞率陶瓷覆铜板及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4670217A (en) * 1985-07-26 1987-06-02 J. W. Harris Company Solder composition
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
JP2805595B2 (ja) * 1994-11-02 1998-09-30 三井金属鉱業株式会社 鉛無含有半田合金
JPH08215880A (ja) † 1995-02-14 1996-08-27 Ishikawa Kinzoku Kk 無鉛はんだ
JP3874031B2 (ja) * 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
JP3673021B2 (ja) * 1996-06-12 2005-07-20 内橋エステック株式会社 電子部品実装用無鉛はんだ
JPH10146690A (ja) 1996-11-14 1998-06-02 Senju Metal Ind Co Ltd チップ部品のはんだ付け用ソルダペースト
JP3736819B2 (ja) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 無鉛はんだ合金
JPH10314980A (ja) * 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP4445046B2 (ja) † 1998-02-06 2010-04-07 株式会社日本スペリア社 無鉛はんだ合金
GB2346380B (en) * 1999-01-28 2001-07-11 Murata Manufacturing Co Lead-free solder and soldered article
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys

Also Published As

Publication number Publication date
EP1245328B1 (de) 2010-06-16
ES2345810T4 (es) 2018-04-12
ES2541439T3 (es) 2015-07-20
EP1245328B2 (de) 2017-12-20
EP2147740A1 (de) 2010-01-27
EP1245328A1 (de) 2002-10-02
ES2345810T3 (es) 2010-10-04
DK2147740T3 (en) 2015-08-03
ES2345810T5 (es) 2018-03-12
EP2942410A1 (de) 2015-11-11
EP2147740B1 (de) 2015-05-20
ATE471224T1 (de) 2010-07-15
EP1245328B9 (de) 2018-07-25

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Legal Events

Date Code Title Description
8363 Opposition against the patent