ATE390241T1 - Bleifreie lötkugel - Google Patents
Bleifreie lötkugelInfo
- Publication number
- ATE390241T1 ATE390241T1 AT03292592T AT03292592T ATE390241T1 AT E390241 T1 ATE390241 T1 AT E390241T1 AT 03292592 T AT03292592 T AT 03292592T AT 03292592 T AT03292592 T AT 03292592T AT E390241 T1 ATE390241 T1 AT E390241T1
- Authority
- AT
- Austria
- Prior art keywords
- solder ball
- free solder
- lead free
- substrate
- solder
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002303197 | 2002-10-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE390241T1 true ATE390241T1 (de) | 2008-04-15 |
Family
ID=32040837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03292592T ATE390241T1 (de) | 2002-10-17 | 2003-10-17 | Bleifreie lötkugel |
Country Status (4)
Country | Link |
---|---|
US (2) | US20040112474A1 (de) |
EP (1) | EP1410871B1 (de) |
AT (1) | ATE390241T1 (de) |
DE (1) | DE60319932T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI305403B (en) * | 2004-06-15 | 2009-01-11 | Advanced Semiconductor Eng | Lead-free conductive jointing bump |
EP1894667A4 (de) * | 2005-06-10 | 2009-12-02 | Senju Metal Industry Co | Verfahren zum löten eines stromlos vernickelten teils |
US8641964B2 (en) | 2005-08-24 | 2014-02-04 | Fry's Metals, Inc. | Solder alloy |
EP1924394A2 (de) * | 2005-08-24 | 2008-05-28 | FRY'S METALS, INC. d/b/a ALPHA METALS, INC. | Lötlegierung |
CN100460136C (zh) * | 2007-01-30 | 2009-02-11 | 山东大学 | 焊接用填充金属颗粒及其制备方法 |
CN100443246C (zh) * | 2007-01-30 | 2008-12-17 | 山东大学 | 堆焊用填充金属颗粒及其制备方法 |
US8013444B2 (en) * | 2008-12-24 | 2011-09-06 | Intel Corporation | Solder joints with enhanced electromigration resistance |
JP6082952B1 (ja) | 2016-07-04 | 2017-02-22 | 株式会社弘輝 | はんだ合金、ヤニ入りはんだ |
US11847651B2 (en) | 2017-05-23 | 2023-12-19 | Kenneth A Kopf | Systems and methods for facilitating biometric tokenless authentication for services |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4242645C2 (de) * | 1992-12-17 | 1997-12-18 | Deutsche Forsch Luft Raumfahrt | Verfahren und Einrichtung zur Herstellung von Metallkügelchen annähernd gleichen Durchmessers |
US5653783A (en) * | 1994-01-20 | 1997-08-05 | Nippon Steel Corporation | Method of producing fine metal balls |
JPH10144718A (ja) * | 1996-11-14 | 1998-05-29 | Fukuda Metal Foil & Powder Co Ltd | スズ基鉛フリーハンダワイヤー及びボール |
US6231691B1 (en) * | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
US6638847B1 (en) * | 2000-04-19 | 2003-10-28 | Advanced Interconnect Technology Ltd. | Method of forming lead-free bump interconnections |
JP3599101B2 (ja) * | 2000-12-11 | 2004-12-08 | 株式会社トッパンNecサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
-
2003
- 2003-10-15 US US10/684,589 patent/US20040112474A1/en not_active Abandoned
- 2003-10-17 AT AT03292592T patent/ATE390241T1/de not_active IP Right Cessation
- 2003-10-17 EP EP03292592A patent/EP1410871B1/de not_active Expired - Lifetime
- 2003-10-17 DE DE60319932T patent/DE60319932T2/de not_active Expired - Lifetime
-
2005
- 2005-04-29 US US11/117,719 patent/US20050248020A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE60319932T2 (de) | 2009-04-16 |
EP1410871A1 (de) | 2004-04-21 |
EP1410871B1 (de) | 2008-03-26 |
DE60319932D1 (de) | 2008-05-08 |
US20050248020A1 (en) | 2005-11-10 |
US20040112474A1 (en) | 2004-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |