CY1105145T1 - Συγκολλητικα υλικα μεταλλων χωρις μολυβδο - Google Patents

Συγκολλητικα υλικα μεταλλων χωρις μολυβδο

Info

Publication number
CY1105145T1
CY1105145T1 CY20051100509T CY051100509T CY1105145T1 CY 1105145 T1 CY1105145 T1 CY 1105145T1 CY 20051100509 T CY20051100509 T CY 20051100509T CY 051100509 T CY051100509 T CY 051100509T CY 1105145 T1 CY1105145 T1 CY 1105145T1
Authority
CY
Cyprus
Prior art keywords
lead
free metal
adhesive materials
metal adhesive
liquefiability
Prior art date
Application number
CY20051100509T
Other languages
English (en)
Inventor
Jennie S. Hwang
Zhenfeng Guo
Original Assignee
Singapore Asahi Chemical & Solder Industries Pte. Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical & Solder Industries Pte. Ltd filed Critical Singapore Asahi Chemical & Solder Industries Pte. Ltd
Publication of CY1105145T1 publication Critical patent/CY1105145T1/el

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Abstract

Γνωστοποιείται συγκολλητικό υλικό μετάλλων χωρίς μόλυβδο με υψηλή αντοχή, υψηλή ανθεκτικότητα κόπωσης και υψηλή υγροποιησιμότητα το οποίο περιέχει αποτελεσματικές ποσότητες κασσιτέρου, χαλκού, αργύρου, βισμούθιου, ινδίου και αντιμονίου και διαθέτει θερμοκρασία τήξεως μεταξύ 175-215°C.
CY20051100509T 2000-11-16 2005-04-21 Συγκολλητικα υλικα μεταλλων χωρις μολυβδο CY1105145T1 (el)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2000/004365 WO2002040213A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Publications (1)

Publication Number Publication Date
CY1105145T1 true CY1105145T1 (el) 2009-11-04

Family

ID=9886311

Family Applications (1)

Application Number Title Priority Date Filing Date
CY20051100509T CY1105145T1 (el) 2000-11-16 2005-04-21 Συγκολλητικα υλικα μεταλλων χωρις μολυβδο

Country Status (14)

Country Link
EP (1) EP1333957B1 (el)
AT (1) ATE293513T1 (el)
AU (1) AU2001214037A1 (el)
CY (1) CY1105145T1 (el)
CZ (1) CZ297089B6 (el)
DE (1) DE60019651T2 (el)
DK (1) DK1333957T3 (el)
ES (1) ES2241671T3 (el)
HU (1) HU228577B1 (el)
NO (1) NO333677B1 (el)
PL (1) PL195528B1 (el)
PT (1) PT1333957E (el)
RU (1) RU2254971C2 (el)
WO (1) WO2002040213A1 (el)

Families Citing this family (27)

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Publication number Priority date Publication date Assignee Title
US8122833B2 (en) 2005-10-04 2012-02-28 Alliant Techsystems Inc. Reactive material enhanced projectiles and related methods
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
US20050199323A1 (en) 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
DE602004009982T2 (de) * 2003-03-31 2008-09-18 Sanyo Electric Co., Ltd., Moriguchi Metallschablone und Verfahren zum Drucken von bleifreier Lötpaste mit derselben
US7459794B2 (en) 2003-08-26 2008-12-02 Tokuyama Corporation Substrate for device bonding, device bonded substrate, and method for producing same
FR2867469A1 (fr) 2004-03-15 2005-09-16 Alliant Techsystems Inc Compositions reactives contenant un metal, et leur procede de production
CZ300575B6 (cs) * 2005-01-04 2009-06-17 Jeník@Jan Bezolovnatá pájka
CN101357421B (zh) * 2005-12-16 2010-12-29 浙江亚通焊材有限公司 无铅锡焊料
CN100453244C (zh) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 无铅锡焊料
WO2009011392A1 (ja) 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. 車載電子回路用Ｉｎ入り鉛フリーはんだ
US7821130B2 (en) * 2008-03-31 2010-10-26 Infineon Technologies Ag Module including a rough solder joint
EP2422918B1 (en) * 2009-04-20 2017-12-06 Panasonic Intellectual Property Management Co., Ltd. Soldering material and electronic component assembly
KR20140063662A (ko) * 2011-08-02 2014-05-27 알파 메탈즈, 인코포레이티드 솔더 조성물
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
CN103042315B (zh) * 2013-01-22 2015-05-27 马莒生 耐热耐湿低熔点无铅焊料合金
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
US10286497B2 (en) 2014-04-30 2019-05-14 Nihon Superior Co., Ltd. Lead-free solder alloy
MY162879A (en) 2014-06-24 2017-07-20 Harima Chemicals Inc Solder alloy, solder paste, and electronic circuit board
JP6730999B2 (ja) * 2015-05-05 2020-07-29 インディウム コーポレーション 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金
JP6135885B2 (ja) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
WO2016185674A1 (ja) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP6397079B1 (ja) * 2017-04-07 2018-09-26 株式会社ケーヒン はんだ材料
CN109894768B (zh) * 2019-03-29 2021-06-18 东莞市千岛金属锡品有限公司 一种低温无铅合金焊料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (ko) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JP3736819B2 (ja) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 無鉛はんだ合金
WO1999004048A1 (en) * 1997-07-17 1999-01-28 Litton Systems, Inc. Tin-bismuth based lead-free solders
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ

Also Published As

Publication number Publication date
RU2254971C2 (ru) 2005-06-27
RU2003114304A (ru) 2005-01-20
PL195528B1 (pl) 2007-09-28
HUP0301858A2 (hu) 2003-08-28
CZ20031348A3 (cs) 2004-04-14
WO2002040213A1 (en) 2002-05-23
HUP0301858A3 (en) 2005-05-30
AU2001214037A1 (en) 2002-05-27
PT1333957E (pt) 2005-09-30
EP1333957B1 (en) 2005-04-20
DK1333957T3 (da) 2005-06-20
HU228577B1 (en) 2013-04-29
DE60019651T2 (de) 2005-09-22
NO20032185L (no) 2003-05-14
EP1333957A1 (en) 2003-08-13
NO333677B1 (no) 2013-08-05
ATE293513T1 (de) 2005-05-15
ES2241671T3 (es) 2005-11-01
PL361336A1 (en) 2004-10-04
CZ297089B6 (cs) 2006-09-13
NO20032185D0 (no) 2003-05-14
DE60019651D1 (de) 2005-05-25

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