KR970058427A - 저융점 솔더 페이스트 - Google Patents

저융점 솔더 페이스트 Download PDF

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Publication number
KR970058427A
KR970058427A KR1019950048697A KR19950048697A KR970058427A KR 970058427 A KR970058427 A KR 970058427A KR 1019950048697 A KR1019950048697 A KR 1019950048697A KR 19950048697 A KR19950048697 A KR 19950048697A KR 970058427 A KR970058427 A KR 970058427A
Authority
KR
South Korea
Prior art keywords
solder paste
low melting
melting point
alloy
ball
Prior art date
Application number
KR1019950048697A
Other languages
English (en)
Other versions
KR0185305B1 (ko
Inventor
조일제
Original Assignee
구자홍
Lg 전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 구자홍, Lg 전자 주식회사 filed Critical 구자홍
Priority to KR1019950048697A priority Critical patent/KR0185305B1/ko
Publication of KR970058427A publication Critical patent/KR970058427A/ko
Application granted granted Critical
Publication of KR0185305B1 publication Critical patent/KR0185305B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 플럭스와; 합금볼과; 상기 합금볼보다 용융점이 높고, 지름이 큰 금속볼로 구성된 저융점 솔더 페이스트에 관한 것으로서, 낮은 온도에서 용융되기 때문에 내열성이 낮은 전자부품의 납땜을 가능하게 하고, 용융점이 높은 금속볼을 포함하기 때문에 납땜 강도 및 수명을 월등히 향상시킬 수 있는 잇점이 있다.

Description

저융점 솔더 페이스트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 저융점 솔더 페이스트를 이용한 납땜방법에 관한 것으로서, a도는 구리전극 위에 저융점 솔더 페이스트가 올려진 상태를 도시한 도면, b도는 a도의 저융점 솔더 페이스트 위에 전자부품이 올려진 상태를 도시한 도면, c도는 b도에 열을 가하는 상태를 도시한 도면, d도는 납땜 완료된 상태를 도시한 도면임.

Claims (5)

  1. 플럭스와; 합금볼과; 상기 합금볼보다 용융점이 높고, 지름이 큰 금속볼로 구성된 것을 특징으로 하는 저융점 솔더 페이스트.
  2. 제1항에 있어서, 상기 합금볼은 용융점이 165 내지 175℃인 것을 특징으로 하는 저융점 솔더 페이스트.
  3. 제1항에 있어서, 상기 합금볼은 주석 43 내지 46 중량%와, 납 40 내지 46 중량%와, 비스무트 8 내지 17 중량%가 혼합되어 조성된 합금으로 형성된 것을 특징으로 하는 저융점 솔더 페이스트.
  4. 제1항에 있어서, 상기 금속볼은 구리로 형성된 것을 특징으로 하는 저융점 솔더 페이스트.
  5. 제1항에 있어서, 상기 금속볼은 지름이 20~50㎛인 것을 특징으로 하는 저융점 솔더 페이스트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950048697A 1995-12-12 1995-12-12 저융점 솔더 페이스트 KR0185305B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950048697A KR0185305B1 (ko) 1995-12-12 1995-12-12 저융점 솔더 페이스트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950048697A KR0185305B1 (ko) 1995-12-12 1995-12-12 저융점 솔더 페이스트

Publications (2)

Publication Number Publication Date
KR970058427A true KR970058427A (ko) 1997-07-31
KR0185305B1 KR0185305B1 (ko) 1999-05-15

Family

ID=19439252

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950048697A KR0185305B1 (ko) 1995-12-12 1995-12-12 저융점 솔더 페이스트

Country Status (1)

Country Link
KR (1) KR0185305B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4416373B2 (ja) * 2002-03-08 2010-02-17 株式会社日立製作所 電子機器

Also Published As

Publication number Publication date
KR0185305B1 (ko) 1999-05-15

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