NO333677B1 - Blyfri loddelegering - Google Patents
Blyfri loddelegering Download PDFInfo
- Publication number
- NO333677B1 NO333677B1 NO20032185A NO20032185A NO333677B1 NO 333677 B1 NO333677 B1 NO 333677B1 NO 20032185 A NO20032185 A NO 20032185A NO 20032185 A NO20032185 A NO 20032185A NO 333677 B1 NO333677 B1 NO 333677B1
- Authority
- NO
- Norway
- Prior art keywords
- alloy
- solder
- lead
- fatigue life
- fatigue
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 61
- 229910045601 alloy Inorganic materials 0.000 title claims description 96
- 239000000956 alloy Substances 0.000 title claims description 96
- 229910052709 silver Inorganic materials 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 229910052738 indium Inorganic materials 0.000 claims abstract description 31
- 229910052718 tin Inorganic materials 0.000 claims abstract description 22
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 15
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 abstract description 44
- 230000008018 melting Effects 0.000 abstract description 43
- 238000002844 melting Methods 0.000 abstract description 43
- 239000011135 tin Substances 0.000 abstract description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000000203 mixture Substances 0.000 description 12
- 238000005476 soldering Methods 0.000 description 11
- 238000009736 wetting Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- -1 2.5 to 4.5 wt% Substances 0.000 description 1
- 229910017692 Ag3Sn Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910006913 SnSb Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000005050 thermomechanical fatigue Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/GB2000/004365 WO2002040213A1 (en) | 2000-11-16 | 2000-11-16 | Lead-free solders |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20032185L NO20032185L (no) | 2003-05-14 |
| NO20032185D0 NO20032185D0 (no) | 2003-05-14 |
| NO333677B1 true NO333677B1 (no) | 2013-08-05 |
Family
ID=9886311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20032185A NO333677B1 (no) | 2000-11-16 | 2003-05-14 | Blyfri loddelegering |
Country Status (14)
| Country | Link |
|---|---|
| EP (1) | EP1333957B1 (el) |
| AT (1) | ATE293513T1 (el) |
| AU (1) | AU2001214037A1 (el) |
| CY (1) | CY1105145T1 (el) |
| CZ (1) | CZ297089B6 (el) |
| DE (1) | DE60019651T2 (el) |
| DK (1) | DK1333957T3 (el) |
| ES (1) | ES2241671T3 (el) |
| HU (1) | HU228577B1 (el) |
| NO (1) | NO333677B1 (el) |
| PL (1) | PL195528B1 (el) |
| PT (1) | PT1333957E (el) |
| RU (1) | RU2254971C2 (el) |
| WO (1) | WO2002040213A1 (el) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE45899E1 (en) | 2000-02-23 | 2016-02-23 | Orbital Atk, Inc. | Low temperature, extrudable, high density reactive materials |
| US20050199323A1 (en) * | 2004-03-15 | 2005-09-15 | Nielson Daniel B. | Reactive material enhanced munition compositions and projectiles containing same |
| US8122833B2 (en) | 2005-10-04 | 2012-02-28 | Alliant Techsystems Inc. | Reactive material enhanced projectiles and related methods |
| US7977420B2 (en) | 2000-02-23 | 2011-07-12 | Alliant Techsystems Inc. | Reactive material compositions, shot shells including reactive materials, and a method of producing same |
| SG139507A1 (en) * | 2001-07-09 | 2008-02-29 | Quantum Chem Tech Singapore | Improvements in or relating to solders |
| EP1465468B1 (en) * | 2003-03-31 | 2007-11-14 | SANYO ELECTRIC Co., Ltd. | Metal mask and method of printing lead-free solder paste using same |
| WO2005020315A1 (ja) * | 2003-08-26 | 2005-03-03 | Tokuyama Corporation | 素子接合用基板、素子接合基板及びその製造方法 |
| FR2867469A1 (fr) | 2004-03-15 | 2005-09-16 | Alliant Techsystems Inc | Compositions reactives contenant un metal, et leur procede de production |
| CZ300575B6 (cs) * | 2005-01-04 | 2009-06-17 | Jeník@Jan | Bezolovnatá pájka |
| CN101357421B (zh) * | 2005-12-16 | 2010-12-29 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
| CN100453244C (zh) * | 2005-12-16 | 2009-01-21 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
| EP2177305B1 (en) * | 2007-07-18 | 2013-07-03 | Senju Metal Industry Co., Ltd | In-containing lead-free solder for on-vehicle electronic circuit |
| US7821130B2 (en) * | 2008-03-31 | 2010-10-26 | Infineon Technologies Ag | Module including a rough solder joint |
| CN103962744B (zh) | 2009-04-20 | 2016-05-18 | 松下知识产权经营株式会社 | 焊锡材料及电子部件接合体 |
| CA2842762A1 (en) * | 2011-08-02 | 2013-02-07 | Alpha Metals, Inc. | Solder compositions |
| JP2013252548A (ja) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | 微細部品接合用のソルダペースト |
| CN103042315B (zh) * | 2013-01-22 | 2015-05-27 | 马莒生 | 耐热耐湿低熔点无铅焊料合金 |
| JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| CA2946994C (en) | 2014-04-30 | 2020-04-14 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| EP3093098B1 (en) | 2014-06-24 | 2019-01-02 | Harima Chemicals, Inc. | Solder alloy, solder paste and electronic circuit board |
| US11229979B2 (en) * | 2015-05-05 | 2022-01-25 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
| WO2016185674A1 (ja) * | 2015-05-19 | 2016-11-24 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| JP6135885B2 (ja) * | 2015-05-19 | 2017-05-31 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| JP6745453B2 (ja) * | 2016-05-18 | 2020-08-26 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| JP6230737B1 (ja) * | 2017-03-10 | 2017-11-15 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、ソルダペースト及び電子回路基板 |
| JP6397079B1 (ja) * | 2017-04-07 | 2018-09-26 | 株式会社ケーヒン | はんだ材料 |
| CN109894768B (zh) * | 2019-03-29 | 2021-06-18 | 东莞市千岛金属锡品有限公司 | 一种低温无铅合金焊料的制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
| KR980006783A (ko) * | 1996-05-13 | 1998-03-30 | 이. 힐러 윌리엄 | 저가의 위상 고정 모터 제어 방법 및 구조 |
| JP3736819B2 (ja) * | 1997-01-17 | 2006-01-18 | 株式会社豊田中央研究所 | 無鉛はんだ合金 |
| WO1999004048A1 (en) * | 1997-07-17 | 1999-01-28 | Litton Systems, Inc. | Tin-bismuth based lead-free solders |
| US5938862A (en) * | 1998-04-03 | 1999-08-17 | Delco Electronics Corporation | Fatigue-resistant lead-free alloy |
| JP2000288772A (ja) * | 1999-02-02 | 2000-10-17 | Nippon Genma:Kk | 無鉛はんだ |
-
2000
- 2000-11-16 AU AU2001214037A patent/AU2001214037A1/en not_active Abandoned
- 2000-11-16 EP EP00976153A patent/EP1333957B1/en not_active Expired - Lifetime
- 2000-11-16 RU RU2003114304/02A patent/RU2254971C2/ru active
- 2000-11-16 WO PCT/GB2000/004365 patent/WO2002040213A1/en active IP Right Grant
- 2000-11-16 ES ES00976153T patent/ES2241671T3/es not_active Expired - Lifetime
- 2000-11-16 DK DK00976153T patent/DK1333957T3/da active
- 2000-11-16 DE DE60019651T patent/DE60019651T2/de not_active Expired - Lifetime
- 2000-11-16 HU HU0301858A patent/HU228577B1/hu unknown
- 2000-11-16 CZ CZ20031348A patent/CZ297089B6/cs not_active IP Right Cessation
- 2000-11-16 PL PL00361336A patent/PL195528B1/pl unknown
- 2000-11-16 AT AT00976153T patent/ATE293513T1/de active
- 2000-11-16 PT PT00976153T patent/PT1333957E/pt unknown
-
2003
- 2003-05-14 NO NO20032185A patent/NO333677B1/no not_active IP Right Cessation
-
2005
- 2005-04-21 CY CY20051100509T patent/CY1105145T1/el unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ATE293513T1 (de) | 2005-05-15 |
| CZ297089B6 (cs) | 2006-09-13 |
| AU2001214037A1 (en) | 2002-05-27 |
| NO20032185L (no) | 2003-05-14 |
| PT1333957E (pt) | 2005-09-30 |
| DE60019651D1 (de) | 2005-05-25 |
| EP1333957A1 (en) | 2003-08-13 |
| PL361336A1 (en) | 2004-10-04 |
| CY1105145T1 (el) | 2009-11-04 |
| WO2002040213A1 (en) | 2002-05-23 |
| DE60019651T2 (de) | 2005-09-22 |
| RU2003114304A (ru) | 2005-01-20 |
| RU2254971C2 (ru) | 2005-06-27 |
| NO20032185D0 (no) | 2003-05-14 |
| HUP0301858A3 (en) | 2005-05-30 |
| PL195528B1 (pl) | 2007-09-28 |
| EP1333957B1 (en) | 2005-04-20 |
| DK1333957T3 (da) | 2005-06-20 |
| ES2241671T3 (es) | 2005-11-01 |
| HUP0301858A2 (hu) | 2003-08-28 |
| HU228577B1 (en) | 2013-04-29 |
| CZ20031348A3 (cs) | 2004-04-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK1K | Patent expired |