NO20032185D0 - Blyfrie loddemidler - Google Patents

Blyfrie loddemidler

Info

Publication number
NO20032185D0
NO20032185D0 NO20032185A NO20032185A NO20032185D0 NO 20032185 D0 NO20032185 D0 NO 20032185D0 NO 20032185 A NO20032185 A NO 20032185A NO 20032185 A NO20032185 A NO 20032185A NO 20032185 D0 NO20032185 D0 NO 20032185D0
Authority
NO
Norway
Prior art keywords
free solder
lead
bismuth
antimony
indium
Prior art date
Application number
NO20032185A
Other languages
English (en)
Other versions
NO20032185L (no
NO333677B1 (no
Inventor
Alan Leonard Meddle
Original Assignee
Singapore Asahi Chemical And S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical And S filed Critical Singapore Asahi Chemical And S
Publication of NO20032185L publication Critical patent/NO20032185L/no
Publication of NO20032185D0 publication Critical patent/NO20032185D0/no
Publication of NO333677B1 publication Critical patent/NO333677B1/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Materials For Medical Uses (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Organic Insulating Materials (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Products (AREA)
  • Conductive Materials (AREA)
NO20032185A 2000-11-16 2003-05-14 Blyfri loddelegering NO333677B1 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2000/004365 WO2002040213A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Publications (3)

Publication Number Publication Date
NO20032185L NO20032185L (no) 2003-05-14
NO20032185D0 true NO20032185D0 (no) 2003-05-14
NO333677B1 NO333677B1 (no) 2013-08-05

Family

ID=9886311

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20032185A NO333677B1 (no) 2000-11-16 2003-05-14 Blyfri loddelegering

Country Status (14)

Country Link
EP (1) EP1333957B1 (no)
AT (1) ATE293513T1 (no)
AU (1) AU2001214037A1 (no)
CY (1) CY1105145T1 (no)
CZ (1) CZ297089B6 (no)
DE (1) DE60019651T2 (no)
DK (1) DK1333957T3 (no)
ES (1) ES2241671T3 (no)
HU (1) HU228577B1 (no)
NO (1) NO333677B1 (no)
PL (1) PL195528B1 (no)
PT (1) PT1333957E (no)
RU (1) RU2254971C2 (no)
WO (1) WO2002040213A1 (no)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
US20050199323A1 (en) * 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
DE602004009982T2 (de) * 2003-03-31 2008-09-18 Sanyo Electric Co., Ltd., Moriguchi Metallschablone und Verfahren zum Drucken von bleifreier Lötpaste mit derselben
US7459794B2 (en) 2003-08-26 2008-12-02 Tokuyama Corporation Substrate for device bonding, device bonded substrate, and method for producing same
FR2867469A1 (fr) * 2004-03-15 2005-09-16 Alliant Techsystems Inc Compositions reactives contenant un metal, et leur procede de production
CZ300575B6 (cs) * 2005-01-04 2009-06-17 Jeník@Jan Bezolovnatá pájka
EP2116807A2 (en) 2005-10-04 2009-11-11 Alliant Techsystems Inc. Reactive Material Enhanced Projectiles And Related Methods
CN100453244C (zh) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 无铅锡焊料
CN101357421B (zh) * 2005-12-16 2010-12-29 浙江亚通焊材有限公司 无铅锡焊料
JP4962570B2 (ja) * 2007-07-18 2012-06-27 千住金属工業株式会社 車載電子回路用Ｉｎ入り鉛フリーはんだ
US7821130B2 (en) * 2008-03-31 2010-10-26 Infineon Technologies Ag Module including a rough solder joint
CN103962744B (zh) * 2009-04-20 2016-05-18 松下知识产权经营株式会社 焊锡材料及电子部件接合体
RU2627822C2 (ru) * 2011-08-02 2017-08-11 Альфа Эссембли Солюшнз Инк. Составы для припоя
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
CN103042315B (zh) * 2013-01-22 2015-05-27 马莒生 耐热耐湿低熔点无铅焊料合金
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
WO2015166945A1 (ja) * 2014-04-30 2015-11-05 株式会社日本スペリア社 鉛フリーはんだ合金
MY162428A (en) * 2014-06-24 2017-06-15 Harima Chemicals Inc Solder alloy, solder composition, solder paste, and electronic circuit board
MY186064A (en) * 2015-05-05 2021-06-18 Indium Corp High reliability lead-free solder alloys for harsh environment electronics applications
JP6135885B2 (ja) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
WO2016185674A1 (ja) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP6397079B1 (ja) * 2017-04-07 2018-09-26 株式会社ケーヒン はんだ材料
CN109894768B (zh) * 2019-03-29 2021-06-18 东莞市千岛金属锡品有限公司 一种低温无铅合金焊料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (ko) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JP3736819B2 (ja) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 無鉛はんだ合金
WO1999004048A1 (en) * 1997-07-17 1999-01-28 Litton Systems, Inc. Tin-bismuth based lead-free solders
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ

Also Published As

Publication number Publication date
NO20032185L (no) 2003-05-14
EP1333957B1 (en) 2005-04-20
NO333677B1 (no) 2013-08-05
PT1333957E (pt) 2005-09-30
RU2003114304A (ru) 2005-01-20
DE60019651T2 (de) 2005-09-22
AU2001214037A1 (en) 2002-05-27
RU2254971C2 (ru) 2005-06-27
HUP0301858A2 (hu) 2003-08-28
DE60019651D1 (de) 2005-05-25
WO2002040213A1 (en) 2002-05-23
PL361336A1 (en) 2004-10-04
HU228577B1 (en) 2013-04-29
CZ297089B6 (cs) 2006-09-13
CY1105145T1 (el) 2009-11-04
ES2241671T3 (es) 2005-11-01
DK1333957T3 (da) 2005-06-20
CZ20031348A3 (cs) 2004-04-14
PL195528B1 (pl) 2007-09-28
ATE293513T1 (de) 2005-05-15
EP1333957A1 (en) 2003-08-13
HUP0301858A3 (en) 2005-05-30

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Legal Events

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