AU6333096A - Lead-free, high tin ternary solder alloy of tin, silver, and bismuth - Google Patents

Lead-free, high tin ternary solder alloy of tin, silver, and bismuth

Info

Publication number
AU6333096A
AU6333096A AU63330/96A AU6333096A AU6333096A AU 6333096 A AU6333096 A AU 6333096A AU 63330/96 A AU63330/96 A AU 63330/96A AU 6333096 A AU6333096 A AU 6333096A AU 6333096 A AU6333096 A AU 6333096A
Authority
AU
Australia
Prior art keywords
tin
bismuth
silver
lead
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU63330/96A
Inventor
Amit K. Sarkhel
Charles G. Woychik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU6333096A publication Critical patent/AU6333096A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
AU63330/96A 1996-06-12 1996-06-13 Lead-free, high tin ternary solder alloy of tin, silver, and bismuth Abandoned AU6333096A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1959196P 1996-06-12 1996-06-12
US60019591 1996-06-12
PCT/US1996/010298 WO1997047425A1 (en) 1996-06-12 1996-06-13 Lead-free, high tin ternary solder alloy of tin, silver, and bismuth

Publications (1)

Publication Number Publication Date
AU6333096A true AU6333096A (en) 1998-01-07

Family

ID=21794009

Family Applications (1)

Application Number Title Priority Date Filing Date
AU63330/96A Abandoned AU6333096A (en) 1996-06-12 1996-06-13 Lead-free, high tin ternary solder alloy of tin, silver, and bismuth

Country Status (2)

Country Link
AU (1) AU6333096A (en)
WO (1) WO1997047425A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL132555A0 (en) * 1997-04-22 2001-03-19 Ecosolder Internat Pty Ltd Lead-free solder
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
US20210197322A1 (en) * 2019-12-31 2021-07-01 Joyson Safety Systems Acquisition Llc Method for coupling a wire to conductive fabric with low-temperature solder

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH80998A (en) * 1918-08-09 1920-01-02 Gustave Ferriere Welding for aluminum
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5439639A (en) * 1994-01-05 1995-08-08 Sandia Corporation Tin-silver-bismuth solders for electronics assembly
JP2805595B2 (en) * 1994-11-02 1998-09-30 三井金属鉱業株式会社 Lead-free solder alloy

Also Published As

Publication number Publication date
WO1997047425A1 (en) 1997-12-18

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