CH80998A - Welding for aluminum - Google Patents

Welding for aluminum

Info

Publication number
CH80998A
CH80998A CH80998A CH80998DA CH80998A CH 80998 A CH80998 A CH 80998A CH 80998 A CH80998 A CH 80998A CH 80998D A CH80998D A CH 80998DA CH 80998 A CH80998 A CH 80998A
Authority
CH
Switzerland
Prior art keywords
welding
aluminum
Prior art date
Application number
CH80998A
Other languages
French (fr)
Inventor
Gustave Ferriere
Siegfried Pfyffer
Original Assignee
Gustave Ferriere
Siegfried Pfyffer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gustave Ferriere, Siegfried Pfyffer filed Critical Gustave Ferriere
Publication of CH80998A publication Critical patent/CH80998A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
CH80998A 1918-08-09 1918-08-09 Welding for aluminum CH80998A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH131299X 1918-08-09

Publications (1)

Publication Number Publication Date
CH80998A true CH80998A (en) 1920-01-02

Family

ID=32660997

Family Applications (1)

Application Number Title Priority Date Filing Date
CH80998A CH80998A (en) 1918-08-09 1918-08-09 Welding for aluminum

Country Status (2)

Country Link
CH (1) CH80998A (en)
GB (1) GB131299A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0251611A2 (en) * 1986-07-03 1988-01-07 Engelhard Corporation Low toxicity corrosion resistant solder
EP0704272A1 (en) * 1994-09-30 1996-04-03 AT&T Corp. Lead-free alloys for use in solder bonding

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058802A1 (en) * 1980-12-19 1982-09-01 Universal Solder Company (Pty) Limited Solder
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
US6794060B2 (en) 1992-03-27 2004-09-21 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6652990B2 (en) 1992-03-27 2003-11-25 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6080497A (en) 1992-03-27 2000-06-27 The Louis Berkman Company Corrosion-resistant coated copper metal and method for making the same
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
US5320272A (en) * 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
TW251249B (en) * 1993-04-30 1995-07-11 At & T Corp
JP2805595B2 (en) * 1994-11-02 1998-09-30 三井金属鉱業株式会社 Lead-free solder alloy
DE69632866T2 (en) * 1995-09-29 2005-07-14 Matsushita Electric Industrial Co., Ltd., Kadoma LEAD-FREE LOT
JP3220635B2 (en) 1996-02-09 2001-10-22 松下電器産業株式会社 Solder alloy and cream solder
WO1997047425A1 (en) * 1996-06-12 1997-12-18 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
US6784086B2 (en) 2001-02-08 2004-08-31 International Business Machines Corporation Lead-free solder structure and method for high fatigue life
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0251611A2 (en) * 1986-07-03 1988-01-07 Engelhard Corporation Low toxicity corrosion resistant solder
EP0251611A3 (en) * 1986-07-03 1989-05-31 Engelhard Corporation Low toxicity corrosion resistant solder
EP0704272A1 (en) * 1994-09-30 1996-04-03 AT&T Corp. Lead-free alloys for use in solder bonding
US5698160A (en) * 1994-09-30 1997-12-16 Lucent Technologies Inc. Lead-free alloys for use in solder bonding

Also Published As

Publication number Publication date
GB131299A (en) 1900-01-01

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