GB131299A - Improvements in or relating to Aluminium Solders. - Google Patents

Improvements in or relating to Aluminium Solders.

Info

Publication number
GB131299A
GB131299A GB19750/19A GB1975019A GB131299A GB 131299 A GB131299 A GB 131299A GB 19750/19 A GB19750/19 A GB 19750/19A GB 1975019 A GB1975019 A GB 1975019A GB 131299 A GB131299 A GB 131299A
Authority
GB
United Kingdom
Prior art keywords
tin
copper
added
silver
aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB19750/19A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laminoirs Et Cablerie SA Des
Original Assignee
Laminoirs Et Cablerie SA Des
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of GB131299A publication Critical patent/GB131299A/en
Application filed by Laminoirs Et Cablerie SA Des filed Critical Laminoirs Et Cablerie SA Des
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

131,299. Soc. Anon. des Laminoirs et Cablerie, (Assignees of Ferriere, G., and Pfyffer, S.). Aug. 9, 1918, [Convention date]. Void [Published under Sect. 91 of the Act]. Alloys.-A solder for aluminium contains silver or zinc and not less than 63 per cent. of tin. In the case of tin and silver, copper may be added to increase the hardness, and in the case of tin and zinc, copper and lead or copper and silver may be added. To increase the fluidity, cadmium or bismuth may be added.
GB19750/19A 1918-08-09 1919-08-11 Improvements in or relating to Aluminium Solders. Expired GB131299A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH131299X 1918-08-09

Publications (1)

Publication Number Publication Date
GB131299A true GB131299A (en) 1900-01-01

Family

ID=32660997

Family Applications (1)

Application Number Title Priority Date Filing Date
GB19750/19A Expired GB131299A (en) 1918-08-09 1919-08-11 Improvements in or relating to Aluminium Solders.

Country Status (2)

Country Link
CH (1) CH80998A (en)
GB (1) GB131299A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058802A1 (en) * 1980-12-19 1982-09-01 Universal Solder Company (Pty) Limited Solder
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
EP0499452A1 (en) * 1991-02-13 1992-08-19 Lancashire Fittings Limited Lead-free soft solder for stainless steel
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
EP0622151A1 (en) * 1993-04-30 1994-11-02 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
EP0643903A1 (en) * 1993-04-02 1995-03-22 Motorola Inc Tin-bismuth solder connection having improved high temperature properties, and process for forming same.
EP0710521A1 (en) * 1994-11-02 1996-05-08 Mitsui Mining & Smelting Co., Ltd. Lead-free solder
EP0787559A1 (en) * 1996-02-09 1997-08-06 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
WO1997047425A1 (en) * 1996-06-12 1997-12-18 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
EP0855242A1 (en) * 1995-09-29 1998-07-29 Matsushita Electric Industrial Co., Ltd. Lead-free solder
US6080497A (en) 1992-03-27 2000-06-27 The Louis Berkman Company Corrosion-resistant coated copper metal and method for making the same
US6652990B2 (en) 1992-03-27 2003-11-25 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6784086B2 (en) 2001-02-08 2004-08-31 International Business Machines Corporation Lead-free solder structure and method for high fatigue life
US6794060B2 (en) 1992-03-27 2004-09-21 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
EP0704272B1 (en) * 1994-09-30 2002-01-09 AT&T Corp. Lead-free alloys for use in solder bonding

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058802A1 (en) * 1980-12-19 1982-09-01 Universal Solder Company (Pty) Limited Solder
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
US4929423A (en) * 1988-03-31 1990-05-29 Cookson Group Plc Low toxicity alloy compositions for joining and sealing
EP0499452A1 (en) * 1991-02-13 1992-08-19 Lancashire Fittings Limited Lead-free soft solder for stainless steel
US6811891B2 (en) 1992-03-27 2004-11-02 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6794060B2 (en) 1992-03-27 2004-09-21 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6652990B2 (en) 1992-03-27 2003-11-25 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6080497A (en) 1992-03-27 2000-06-27 The Louis Berkman Company Corrosion-resistant coated copper metal and method for making the same
US5762866A (en) * 1993-02-22 1998-06-09 Lucent Technologies Inc. Article comprising a Pb-free solder having improved mechanical properties
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
EP0643903A1 (en) * 1993-04-02 1995-03-22 Motorola Inc Tin-bismuth solder connection having improved high temperature properties, and process for forming same.
EP0643903A4 (en) * 1993-04-02 1995-09-20 Motorola Inc Tin-bismuth solder connection having improved high temperature properties, and process for forming same.
EP0622151A1 (en) * 1993-04-30 1994-11-02 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
JPH08187590A (en) * 1994-11-02 1996-07-23 Mitsui Mining & Smelting Co Ltd Solder alloy containing non-lead
JP2805595B2 (en) 1994-11-02 1998-09-30 三井金属鉱業株式会社 Lead-free solder alloy
EP0710521A1 (en) * 1994-11-02 1996-05-08 Mitsui Mining & Smelting Co., Ltd. Lead-free solder
EP0855242B1 (en) * 1995-09-29 2004-07-07 Matsushita Electric Industrial Co., Ltd. Lead-free solder
EP0855242A1 (en) * 1995-09-29 1998-07-29 Matsushita Electric Industrial Co., Ltd. Lead-free solder
EP0878265A1 (en) * 1996-02-09 1998-11-18 Matsushita Electric Industrial Co., Ltd. Solder, solder paste and soldering method
EP0878265A4 (en) * 1996-02-09 1999-10-13 Matsushita Electric Ind Co Ltd Solder, solder paste and soldering method
US6267823B1 (en) 1996-02-09 2001-07-31 Matsushita Electric Industrial Co., Ltd. Solder, solder paste and soldering method
US6428745B2 (en) 1996-02-09 2002-08-06 Matsushita Electric Industrial Co., Ltd. Solder, solder paste and soldering method
EP0787559A1 (en) * 1996-02-09 1997-08-06 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
WO1997047425A1 (en) * 1996-06-12 1997-12-18 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
US6784086B2 (en) 2001-02-08 2004-08-31 International Business Machines Corporation Lead-free solder structure and method for high fatigue life
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition

Also Published As

Publication number Publication date
CH80998A (en) 1920-01-02

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