MY116826A - Solder alloy. - Google Patents
Solder alloy.Info
- Publication number
- MY116826A MY116826A MYPI9403119A MY116826A MY 116826 A MY116826 A MY 116826A MY PI9403119 A MYPI9403119 A MY PI9403119A MY 116826 A MY116826 A MY 116826A
- Authority
- MY
- Malaysia
- Prior art keywords
- alloy
- soft
- soldered
- weight
- solder alloy
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
THE SOLDERED PARTS OF ELECTRONIC MACHINES, WHILE SUBJECTED TO REPEATED ALTERNATING PHASES OF LOW AND HIGH TEMPERATURES, TEND TO CRACK DUE TO LONG - TERM CYCLES OF HEAT CHANGES. THE FOLLOWING INVENTION IS MEANT TO RECTIFY SUCH A PHYSICAL ANOMALY BY PROVIDING A TYPE OF SOFT SOLDERING ALLOY TO PREVENT CRACKS CAUSED BY SUCH THERMAL CHANGES. THE INVENTION ADDS ON TO THE SOFT SOLDERED ALLOY EUTECTIC WHICH IS COMPOSED OF 60 TO 70TIN IN WEIGHT AS WELL AS THE FOLLOWING ELEMENTS (BY WEIGHT) : 0.2 TO 2.0 ANTIMONY, 0.005 TO 0.2 NICKEL, AND/OR 0.1 TO 2.0 ILVER. THIS GIVES RISE TO A SOFT SOLDERED ALLOY WITH GREATER FATIGUE STRENGTH.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11608594A JP3254901B2 (en) | 1994-05-06 | 1994-05-06 | Solder alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
MY116826A true MY116826A (en) | 2004-04-30 |
Family
ID=14678345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI9403119 MY116826A (en) | 1994-05-06 | 1994-11-23 | Solder alloy. |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3254901B2 (en) |
MY (1) | MY116826A (en) |
TW (1) | TW323304B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6033488A (en) * | 1996-11-05 | 2000-03-07 | Samsung Electronics Co., Ltd. | Solder alloy |
JP3752064B2 (en) * | 1997-05-23 | 2006-03-08 | 内橋エステック株式会社 | Solder material and electronic component using the same |
CN108788511A (en) * | 2018-06-25 | 2018-11-13 | 深圳市博士达焊锡制品有限公司 | It is a kind of to have kupper solder and preparation method thereof with high anti-oxidation ability |
-
1994
- 1994-05-06 JP JP11608594A patent/JP3254901B2/en not_active Expired - Lifetime
- 1994-07-26 TW TW83106794A patent/TW323304B/zh not_active IP Right Cessation
- 1994-11-23 MY MYPI9403119 patent/MY116826A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW323304B (en) | 1997-12-21 |
JP3254901B2 (en) | 2002-02-12 |
JPH07299585A (en) | 1995-11-14 |
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