JPS649690A - Method for soldering thin flat ic - Google Patents

Method for soldering thin flat ic

Info

Publication number
JPS649690A
JPS649690A JP16561687A JP16561687A JPS649690A JP S649690 A JPS649690 A JP S649690A JP 16561687 A JP16561687 A JP 16561687A JP 16561687 A JP16561687 A JP 16561687A JP S649690 A JPS649690 A JP S649690A
Authority
JP
Japan
Prior art keywords
thin flat
flat
soldering
metallic cover
passing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16561687A
Other languages
Japanese (ja)
Inventor
Shigemitsu Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsushima Kogyo KK
Original Assignee
Matsushima Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushima Kogyo KK filed Critical Matsushima Kogyo KK
Priority to JP16561687A priority Critical patent/JPS649690A/en
Publication of JPS649690A publication Critical patent/JPS649690A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To prevent a sudden thermal shock to a thin flat IC at the time of passing through a solder bath by attaching and soldering a cover surrounding the flat IC at the time of flow soldering. CONSTITUTION:A thin flat IC is capped with a metallic cover 4 surrounding the IC, and the metallic cover and the package part of the thin flat IC are not in contact with each other. Therefore, when passing through a solder bath, since the metallic cover and the package are not in contact with each other, a thermal insulating layer by air is caused in that part. For this, the heat of a solder 6 is not directly transmitted to the thin flat IC. Also, the heat shock given to the thin flat IC is greatly reduced, so that no crack occurs in the thin flat IC.
JP16561687A 1987-07-02 1987-07-02 Method for soldering thin flat ic Pending JPS649690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16561687A JPS649690A (en) 1987-07-02 1987-07-02 Method for soldering thin flat ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16561687A JPS649690A (en) 1987-07-02 1987-07-02 Method for soldering thin flat ic

Publications (1)

Publication Number Publication Date
JPS649690A true JPS649690A (en) 1989-01-12

Family

ID=15815749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16561687A Pending JPS649690A (en) 1987-07-02 1987-07-02 Method for soldering thin flat ic

Country Status (1)

Country Link
JP (1) JPS649690A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088564A (en) * 1990-06-02 1992-02-18 Kobayashi Construction Co., Ltd. Method of and apparatus for driving piles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088564A (en) * 1990-06-02 1992-02-18 Kobayashi Construction Co., Ltd. Method of and apparatus for driving piles

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