JPS6446912A - Laminated chip capacitor - Google Patents
Laminated chip capacitorInfo
- Publication number
- JPS6446912A JPS6446912A JP20389187A JP20389187A JPS6446912A JP S6446912 A JPS6446912 A JP S6446912A JP 20389187 A JP20389187 A JP 20389187A JP 20389187 A JP20389187 A JP 20389187A JP S6446912 A JPS6446912 A JP S6446912A
- Authority
- JP
- Japan
- Prior art keywords
- chip capacitor
- distance
- internal electrode
- laminated chip
- smaller size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title abstract 5
- 230000035939 shock Effects 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 1
- 230000008646 thermal stress Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE:To improve thermal endurance, and to prevent the generation of a crack, etc., even when a laminated chip capacitor receives a heat shock such as soldering by forming an internal electrode at a specified distance from the surface of the laminated chip capacitor. CONSTITUTION:An internal electrode for a chip capacitor 1 is composed of a first internal electrode layer 2 and a second internal electrode layer 3. When smaller size of a distance a1 and a distance a2 is represented by (a) at that time, (a) is brought to either smaller size or more of 20% of a distance between a top face 15 and an underside 16 and 230mum. When smaller size of distances b1 and b2 is represented by (b), (b) is brought to either smaller size or more of 20% of a distance between a side face 13 and a side face 14 and 230mum, and a/b extends over 0.8-1.2. Accordingly, a laminated chip capacitor, which has high thermal endurance and in which the concentration of thermal stress at the time of a heat shock is prevented and the generation of cracks can be avoided, is acquired.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20389187A JPS6446912A (en) | 1987-08-17 | 1987-08-17 | Laminated chip capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20389187A JPS6446912A (en) | 1987-08-17 | 1987-08-17 | Laminated chip capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6446912A true JPS6446912A (en) | 1989-02-21 |
Family
ID=16481428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20389187A Pending JPS6446912A (en) | 1987-08-17 | 1987-08-17 | Laminated chip capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6446912A (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6780938B2 (en) | 2000-08-14 | 2004-08-24 | Samsung Atofina Co. Ltd. | Reactor alloy of syndiotactic polystyrene having high impact resistance |
WO2006129424A1 (en) | 2005-05-31 | 2006-12-07 | Konica Minolta Holdings, Inc. | Electrochromic display element and full-color electrochromic display element |
WO2007010653A1 (en) | 2005-07-19 | 2007-01-25 | Konica Minolta Holding, Inc. | Salt molten at room temperature and display device |
WO2007083483A1 (en) | 2006-01-19 | 2007-07-26 | Konica Minolta Holdings, Inc. | Display element |
WO2007142025A1 (en) | 2006-06-02 | 2007-12-13 | Konica Minolta Holdings, Inc. | Display element |
WO2007145100A1 (en) | 2006-06-15 | 2007-12-21 | Konica Minolta Holdings, Inc. | Display element |
WO2008007563A1 (en) | 2006-07-12 | 2008-01-17 | Konica Minolta Holdings, Inc. | Electrochromic display device |
WO2008029669A1 (en) | 2006-09-08 | 2008-03-13 | Konica Minolta Holdings, Inc. | Display element |
WO2008035547A1 (en) | 2006-09-20 | 2008-03-27 | Konica Minolta Holdings, Inc. | Display element |
WO2008056510A1 (en) | 2006-11-08 | 2008-05-15 | Konica Minolta Holdings, Inc. | Display element |
WO2008075565A1 (en) | 2006-12-21 | 2008-06-26 | Konica Minolta Holdings, Inc. | Display element and method for driving the same |
WO2008087790A1 (en) | 2007-01-17 | 2008-07-24 | Konica Minolta Holdings, Inc. | Display element and method for driving display element |
WO2008102604A1 (en) | 2007-02-21 | 2008-08-28 | Konica Minolta Holdings, Inc. | Display element driving method |
WO2008146573A1 (en) | 2007-05-25 | 2008-12-04 | Konica Minolta Holdings, Inc. | Method for production of display element |
WO2008149850A1 (en) | 2007-06-08 | 2008-12-11 | Konica Minolta Holdings, Inc. | Process for producing electrochemical display element and electrochemical display element |
EP2272917A1 (en) | 2001-01-22 | 2011-01-12 | Idemitsu Kosan Co., Ltd. | Polycarbonate resin compositions for laser marking and molded articles made thereof |
WO2011111713A1 (en) | 2010-03-08 | 2011-09-15 | 宇部興産株式会社 | Polyamide resin composition |
US20130201603A1 (en) * | 2012-02-07 | 2013-08-08 | Samsung Electro-Mechanics Co., Ltd. | Array-type multilayered ceramic electronic component |
US8902563B2 (en) * | 2012-04-26 | 2014-12-02 | Samsung Electro-Mechancis Co., Ltd. | Multilayer ceramic electronic component |
-
1987
- 1987-08-17 JP JP20389187A patent/JPS6446912A/en active Pending
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6780938B2 (en) | 2000-08-14 | 2004-08-24 | Samsung Atofina Co. Ltd. | Reactor alloy of syndiotactic polystyrene having high impact resistance |
EP2272917A1 (en) | 2001-01-22 | 2011-01-12 | Idemitsu Kosan Co., Ltd. | Polycarbonate resin compositions for laser marking and molded articles made thereof |
WO2006129424A1 (en) | 2005-05-31 | 2006-12-07 | Konica Minolta Holdings, Inc. | Electrochromic display element and full-color electrochromic display element |
WO2007010653A1 (en) | 2005-07-19 | 2007-01-25 | Konica Minolta Holding, Inc. | Salt molten at room temperature and display device |
WO2007083483A1 (en) | 2006-01-19 | 2007-07-26 | Konica Minolta Holdings, Inc. | Display element |
WO2007142025A1 (en) | 2006-06-02 | 2007-12-13 | Konica Minolta Holdings, Inc. | Display element |
WO2007145100A1 (en) | 2006-06-15 | 2007-12-21 | Konica Minolta Holdings, Inc. | Display element |
WO2008007563A1 (en) | 2006-07-12 | 2008-01-17 | Konica Minolta Holdings, Inc. | Electrochromic display device |
WO2008029669A1 (en) | 2006-09-08 | 2008-03-13 | Konica Minolta Holdings, Inc. | Display element |
WO2008035547A1 (en) | 2006-09-20 | 2008-03-27 | Konica Minolta Holdings, Inc. | Display element |
WO2008056510A1 (en) | 2006-11-08 | 2008-05-15 | Konica Minolta Holdings, Inc. | Display element |
WO2008075565A1 (en) | 2006-12-21 | 2008-06-26 | Konica Minolta Holdings, Inc. | Display element and method for driving the same |
WO2008087790A1 (en) | 2007-01-17 | 2008-07-24 | Konica Minolta Holdings, Inc. | Display element and method for driving display element |
WO2008102604A1 (en) | 2007-02-21 | 2008-08-28 | Konica Minolta Holdings, Inc. | Display element driving method |
WO2008146573A1 (en) | 2007-05-25 | 2008-12-04 | Konica Minolta Holdings, Inc. | Method for production of display element |
WO2008149850A1 (en) | 2007-06-08 | 2008-12-11 | Konica Minolta Holdings, Inc. | Process for producing electrochemical display element and electrochemical display element |
WO2011111713A1 (en) | 2010-03-08 | 2011-09-15 | 宇部興産株式会社 | Polyamide resin composition |
US20130201603A1 (en) * | 2012-02-07 | 2013-08-08 | Samsung Electro-Mechanics Co., Ltd. | Array-type multilayered ceramic electronic component |
US8937801B2 (en) * | 2012-02-07 | 2015-01-20 | Samsung Electro-Mechanics Co., Ltd. | Array-type multilayered ceramic electronic component |
US8902563B2 (en) * | 2012-04-26 | 2014-12-02 | Samsung Electro-Mechancis Co., Ltd. | Multilayer ceramic electronic component |
US9196421B2 (en) | 2012-04-26 | 2015-11-24 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6446912A (en) | Laminated chip capacitor | |
GB8807461D0 (en) | Low pressure fuel circuit with fuel pre-heating for air-compressing fuel-injected i c engine | |
JPS6442161A (en) | Semiconductor device and manufacture thereof | |
JPS53135585A (en) | Wiring for electronic components | |
JPS6473155A (en) | Piston for internal combustion engine | |
JPS55108790A (en) | Semiconductor luminous device | |
JPS57106056A (en) | Electrode structural body of semiconductor device | |
JPS56148857A (en) | Semiconductor device | |
JPS649690A (en) | Method for soldering thin flat ic | |
JPS56105670A (en) | Semiconductor device | |
JPS6424493A (en) | Method for mounting chip component | |
JPS5530815A (en) | Semiconductor containing vessel | |
JPS5578535A (en) | Pressure-contact type semiconductor device | |
JPS5391684A (en) | Semiconductor laser | |
ATE3353T1 (en) | ELECTRICALLY HEATED HOT PLATE. | |
JPS6442893A (en) | Circuit substrate | |
JPS6466528A (en) | Pressure sensor | |
JPS52116073A (en) | Hermetic structure in which integrated circuit element is sealed up ai rtightly | |
JPS5553447A (en) | Semiconductor package of ultraviolet ray transmitting type | |
JPS527676A (en) | Semiconductor integrated circuit | |
JPS5436182A (en) | Manufacture for semiconductor device | |
JPS57147266A (en) | Condenser structure for integrated circuit | |
JPS54111760A (en) | Electrode construction for semiconductor device | |
JPS6457814A (en) | Surface acoustic wave element | |
JPS6447060A (en) | Semiconductor device |