JPS6467925A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6467925A
JPS6467925A JP22600887A JP22600887A JPS6467925A JP S6467925 A JPS6467925 A JP S6467925A JP 22600887 A JP22600887 A JP 22600887A JP 22600887 A JP22600887 A JP 22600887A JP S6467925 A JPS6467925 A JP S6467925A
Authority
JP
Japan
Prior art keywords
pellet
electrodes
sides
heat sinks
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22600887A
Other languages
Japanese (ja)
Inventor
Tokiyasu Aoyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP22600887A priority Critical patent/JPS6467925A/en
Publication of JPS6467925A publication Critical patent/JPS6467925A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent members from loosely contacting due to the difference of disposition, thermal expansion coefficients in a semiconductor of a structure in which a pellet having pad plated electrodes is held by heat sinks on both sides and sealed with a glass bulb by connecting the electrodes of the pellet to the heat sinks with high melting point solder. CONSTITUTION:A pellet 1 having pad plated electrodes 2 is held on both sides by heat sinks 4 at which small amounts of high melting point solders 3 are bonded in advance to the sides to be connected with the pellet, and sealed with a glass bulb. 5. The solders 3 are melted due to the temperature rise in case of sealing to connect the electrodes 2 to the sinks 4.
JP22600887A 1987-09-08 1987-09-08 Semiconductor device Pending JPS6467925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22600887A JPS6467925A (en) 1987-09-08 1987-09-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22600887A JPS6467925A (en) 1987-09-08 1987-09-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6467925A true JPS6467925A (en) 1989-03-14

Family

ID=16838342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22600887A Pending JPS6467925A (en) 1987-09-08 1987-09-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6467925A (en)

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