JPS6437890A - Semiconductor light-emitting device - Google Patents

Semiconductor light-emitting device

Info

Publication number
JPS6437890A
JPS6437890A JP19377587A JP19377587A JPS6437890A JP S6437890 A JPS6437890 A JP S6437890A JP 19377587 A JP19377587 A JP 19377587A JP 19377587 A JP19377587 A JP 19377587A JP S6437890 A JPS6437890 A JP S6437890A
Authority
JP
Japan
Prior art keywords
electrode
heat sink
bonding
wire
photodetector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19377587A
Other languages
Japanese (ja)
Inventor
Kumiko Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP19377587A priority Critical patent/JPS6437890A/en
Publication of JPS6437890A publication Critical patent/JPS6437890A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To enable stabilized wire bonding, to reduce the generation of defects and to improve reproducibility by forming an angle to a lead section for a leading-out electrode. CONSTITUTION:A stem base 1 consisting of iron, etc., is brazed onto a heat sink 2 composed of copper, etc., having excellent thermal conductivity, a laser head 3 is bonded with the heat sink 2, and an external leading-out electrode 5B for the pellet 3 is connected by a bonding wire 4. A photodetector 7 is connected by an external leading out electrode 6 and a bonding wire 4. The electrode lead sections 5B, 6 are sealed with seal glass, etc. The common electrode 8 of the pellet 3 and the photodetector 7 is brazed to the stem base 1. The electrode lead 5B is inclined to the heat sink 2 in order to stabilize wire bonding.
JP19377587A 1987-08-04 1987-08-04 Semiconductor light-emitting device Pending JPS6437890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19377587A JPS6437890A (en) 1987-08-04 1987-08-04 Semiconductor light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19377587A JPS6437890A (en) 1987-08-04 1987-08-04 Semiconductor light-emitting device

Publications (1)

Publication Number Publication Date
JPS6437890A true JPS6437890A (en) 1989-02-08

Family

ID=16313597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19377587A Pending JPS6437890A (en) 1987-08-04 1987-08-04 Semiconductor light-emitting device

Country Status (1)

Country Link
JP (1) JPS6437890A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097333A (en) * 1988-10-24 1992-03-17 Matsushita Electric Industrial Co., Ltd. Interframe deinterleave switching circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097333A (en) * 1988-10-24 1992-03-17 Matsushita Electric Industrial Co., Ltd. Interframe deinterleave switching circuit

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