JPS6477954A - Package for semiconductor element - Google Patents
Package for semiconductor elementInfo
- Publication number
- JPS6477954A JPS6477954A JP23552787A JP23552787A JPS6477954A JP S6477954 A JPS6477954 A JP S6477954A JP 23552787 A JP23552787 A JP 23552787A JP 23552787 A JP23552787 A JP 23552787A JP S6477954 A JPS6477954 A JP S6477954A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- micro
- tips
- packaging
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To facilitate mounting and dismantling, and to attain high density packaging by engaging a chip with a pocket section for a member through hermetic seal by filling a sealing medium and projecting the tip of a micro-pin directly attached to the chip to the outside. CONSTITUTION:A chip 4 with which micro-pins 5 are joined through direct attachment is fixed to a pocket section 2 for a member 1 formed by an insulating material such as a ceramic material. Joining tips 5A at one tips are held by a sealing medium 6, and tips 5B are shaped so as to be projected to an opening 3. According to such constitution, the micro-pins 5 can be formed to the whole surface of one surface of the chip 4. A large number of the chips 4 can be juxtaposed by being brought near on packaging, thus improving packaging efficiency.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23552787A JPS6477954A (en) | 1987-09-18 | 1987-09-18 | Package for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23552787A JPS6477954A (en) | 1987-09-18 | 1987-09-18 | Package for semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6477954A true JPS6477954A (en) | 1989-03-23 |
Family
ID=16987295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23552787A Pending JPS6477954A (en) | 1987-09-18 | 1987-09-18 | Package for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6477954A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6586845B1 (en) | 1998-10-28 | 2003-07-01 | Shinko Electric Industries Co., Ltd. | Semiconductor device module and a part thereof |
-
1987
- 1987-09-18 JP JP23552787A patent/JPS6477954A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6586845B1 (en) | 1998-10-28 | 2003-07-01 | Shinko Electric Industries Co., Ltd. | Semiconductor device module and a part thereof |
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