JPS6489347A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6489347A JPS6489347A JP24718087A JP24718087A JPS6489347A JP S6489347 A JPS6489347 A JP S6489347A JP 24718087 A JP24718087 A JP 24718087A JP 24718087 A JP24718087 A JP 24718087A JP S6489347 A JPS6489347 A JP S6489347A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- temperature
- cap
- mounting
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To reduce a sealing temperature by employing a glass material for securing a lead frame to a ceramic substrate, having higher melting point than the mounting temperature of a semiconductor chip and that of glass for securing a cap. CONSTITUTION:A lead frame 4 is secured to a ceramic substrate 1 with glass 7 having higher melting point than the temperature of mounting a semiconductor chip 5. Thus, since the glass 7 is not melted at the time of mounting, the displacement of the frame 4 does not occur. Since the cap 2 can be sealed at the melting temperature of low melting point sealing glass 3 of the side of the cap 2, it can be sealed at lower temperature, thereby reducing the disconnections of wirings due to an alloy spike, a stress migration. Accordingly, a semiconductor device having high reliability can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24718087A JPS6489347A (en) | 1987-09-29 | 1987-09-29 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24718087A JPS6489347A (en) | 1987-09-29 | 1987-09-29 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6489347A true JPS6489347A (en) | 1989-04-03 |
Family
ID=17159631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24718087A Pending JPS6489347A (en) | 1987-09-29 | 1987-09-29 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6489347A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02303053A (en) * | 1989-05-17 | 1990-12-17 | Sumitomo Special Metals Co Ltd | Manufacture of semiconductor package |
JPH04254356A (en) * | 1991-02-06 | 1992-09-09 | Nec Corp | Package for glass sealed ic |
-
1987
- 1987-09-29 JP JP24718087A patent/JPS6489347A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02303053A (en) * | 1989-05-17 | 1990-12-17 | Sumitomo Special Metals Co Ltd | Manufacture of semiconductor package |
JPH04254356A (en) * | 1991-02-06 | 1992-09-09 | Nec Corp | Package for glass sealed ic |
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