JPS5413267A - Assembling method of package for semiconductor device - Google Patents

Assembling method of package for semiconductor device

Info

Publication number
JPS5413267A
JPS5413267A JP7869377A JP7869377A JPS5413267A JP S5413267 A JPS5413267 A JP S5413267A JP 7869377 A JP7869377 A JP 7869377A JP 7869377 A JP7869377 A JP 7869377A JP S5413267 A JPS5413267 A JP S5413267A
Authority
JP
Japan
Prior art keywords
package
semiconductor device
assembling method
surely
provision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7869377A
Other languages
Japanese (ja)
Other versions
JPS579702B2 (en
Inventor
Eiji Yamamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7869377A priority Critical patent/JPS5413267A/en
Publication of JPS5413267A publication Critical patent/JPS5413267A/en
Publication of JPS579702B2 publication Critical patent/JPS579702B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To enable to mount chips easily and surely with excellent bonding, by avoiding the appearance of silver solder on the chip mounting surface of the package through the provision of nickel plating on the metal part in advance.
COPYRIGHT: (C)1979,JPO&Japio
JP7869377A 1977-07-01 1977-07-01 Assembling method of package for semiconductor device Granted JPS5413267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7869377A JPS5413267A (en) 1977-07-01 1977-07-01 Assembling method of package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7869377A JPS5413267A (en) 1977-07-01 1977-07-01 Assembling method of package for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5413267A true JPS5413267A (en) 1979-01-31
JPS579702B2 JPS579702B2 (en) 1982-02-23

Family

ID=13668935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7869377A Granted JPS5413267A (en) 1977-07-01 1977-07-01 Assembling method of package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5413267A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913085U (en) * 1972-05-08 1974-02-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913085U (en) * 1972-05-08 1974-02-04

Also Published As

Publication number Publication date
JPS579702B2 (en) 1982-02-23

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