DK0776596T3 - Stiv, fleksibel, trykt kredsløbsplade - Google Patents

Stiv, fleksibel, trykt kredsløbsplade

Info

Publication number
DK0776596T3
DK0776596T3 DK95929418T DK95929418T DK0776596T3 DK 0776596 T3 DK0776596 T3 DK 0776596T3 DK 95929418 T DK95929418 T DK 95929418T DK 95929418 T DK95929418 T DK 95929418T DK 0776596 T3 DK0776596 T3 DK 0776596T3
Authority
DK
Denmark
Prior art keywords
rigid
layer
flex
window
printed circuit
Prior art date
Application number
DK95929418T
Other languages
Danish (da)
English (en)
Inventor
E Covino Alfred
M Waite John
J Jr Doane Howard
Original Assignee
Coesen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coesen Inc filed Critical Coesen Inc
Application granted granted Critical
Publication of DK0776596T3 publication Critical patent/DK0776596T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
  • Joints Allowing Movement (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DK95929418T 1994-08-02 1995-07-25 Stiv, fleksibel, trykt kredsløbsplade DK0776596T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/285,126 US5499444A (en) 1994-08-02 1994-08-02 Method of manufacturing a rigid flex printed circuit board
PCT/US1995/010039 WO1996004773A1 (en) 1994-08-02 1995-07-25 Rigid flex printed circuit board

Publications (1)

Publication Number Publication Date
DK0776596T3 true DK0776596T3 (da) 2002-02-18

Family

ID=23092835

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95929418T DK0776596T3 (da) 1994-08-02 1995-07-25 Stiv, fleksibel, trykt kredsløbsplade

Country Status (8)

Country Link
US (1) US5499444A (ko)
EP (1) EP0776596B1 (ko)
JP (1) JPH10506501A (ko)
KR (1) KR100380783B1 (ko)
AT (1) ATE207690T1 (ko)
DE (1) DE69523463T2 (ko)
DK (1) DK0776596T3 (ko)
WO (1) WO1996004773A1 (ko)

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DE59410240D1 (de) * 1994-03-23 2003-03-13 Dyconex Ag Bassersdorf Folienleiterplatten und verfahren zu deren herstellung
JPH08107266A (ja) * 1994-10-04 1996-04-23 Cmk Corp プリント配線板
US5629497A (en) * 1994-10-04 1997-05-13 Cmk Corporation Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
JP2606177B2 (ja) * 1995-04-26 1997-04-30 日本電気株式会社 印刷配線板
AU5926396A (en) * 1995-05-22 1996-12-11 Dynaco Corporation Rigid-flex printed circuit boards
US5872337A (en) * 1996-09-09 1999-02-16 International Business Machines Corporation Chip carrier and cable assembly reinforced at edges
US6350387B2 (en) * 1997-02-14 2002-02-26 Teledyne Industries, Inc. Multilayer combined rigid/flex printed circuit board containing flexible soldermask
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KR102432541B1 (ko) * 2015-09-24 2022-08-17 주식회사 기가레인 벤딩 내구성이 개선된 연성회로기판 및 그 제조방법
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KR102059279B1 (ko) * 2018-12-19 2019-12-24 주식회사 기가레인 차폐성이 향상된 벤딩부를 포함하는 연성회로기판 및 이의 제조방법
JP7311985B2 (ja) * 2019-03-11 2023-07-20 日本シイエムケイ株式会社 リジッド・フレックス多層プリント配線板
KR102663936B1 (ko) 2019-05-08 2024-05-08 쌩-고벵 글래스 프랑스 차량 판유리
CN111970858B (zh) * 2020-07-14 2022-04-15 深圳崇达多层线路板有限公司 一种高断差刚挠结合pcb及其制作方法
CN113973420B (zh) * 2020-07-22 2024-05-31 庆鼎精密电子（淮安）有限公司 软硬结合板及软硬结合板的制作方法
KR20220072540A (ko) * 2020-11-25 2022-06-02 삼성전기주식회사 플렉서블 인쇄회로기판 및 이를 포함하는 전자장치
CN113286437B (zh) * 2021-06-11 2021-10-01 四川英创力电子科技股份有限公司 一种加工软硬结合板的辅助装置及其使用方法
TWI808614B (zh) * 2022-01-17 2023-07-11 大陸商廣東則成科技有限公司 軟硬複合板的製程

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Also Published As

Publication number Publication date
ATE207690T1 (de) 2001-11-15
DE69523463D1 (de) 2001-11-29
WO1996004773A1 (en) 1996-02-15
US5499444A (en) 1996-03-19
EP0776596A4 (en) 1998-09-23
EP0776596A1 (en) 1997-06-04
KR100380783B1 (ko) 2003-07-18
DE69523463T2 (de) 2002-06-27
EP0776596B1 (en) 2001-10-24
JPH10506501A (ja) 1998-06-23
KR970705332A (ko) 1997-09-06

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