DK0706855T3 - Maskine til polering af wafere - Google Patents

Maskine til polering af wafere

Info

Publication number
DK0706855T3
DK0706855T3 DK95307174T DK95307174T DK0706855T3 DK 0706855 T3 DK0706855 T3 DK 0706855T3 DK 95307174 T DK95307174 T DK 95307174T DK 95307174 T DK95307174 T DK 95307174T DK 0706855 T3 DK0706855 T3 DK 0706855T3
Authority
DK
Denmark
Prior art keywords
fluid
support
wafer
polishing pad
wafer holder
Prior art date
Application number
DK95307174T
Other languages
Danish (da)
English (en)
Inventor
David Edwin Weldon
Boguslaw A Nagorski
Homayoun Talieh
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of DK0706855T3 publication Critical patent/DK0706855T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DK95307174T 1994-10-11 1995-10-11 Maskine til polering af wafere DK0706855T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/321,085 US5593344A (en) 1994-10-11 1994-10-11 Wafer polishing machine with fluid bearings and drive systems

Publications (1)

Publication Number Publication Date
DK0706855T3 true DK0706855T3 (da) 2000-11-06

Family

ID=23249121

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95307174T DK0706855T3 (da) 1994-10-11 1995-10-11 Maskine til polering af wafere

Country Status (7)

Country Link
US (2) US5593344A (fr)
EP (1) EP0706855B1 (fr)
JP (1) JP3672362B2 (fr)
AT (1) ATE194536T1 (fr)
DE (1) DE69517906T2 (fr)
DK (1) DK0706855T3 (fr)
ES (1) ES2149929T3 (fr)

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Also Published As

Publication number Publication date
JPH08195365A (ja) 1996-07-30
JP3672362B2 (ja) 2005-07-20
US5593344A (en) 1997-01-14
EP0706855A2 (fr) 1996-04-17
DE69517906D1 (de) 2000-08-17
US5558568A (en) 1996-09-24
EP0706855A3 (fr) 1996-07-31
DE69517906T2 (de) 2000-12-07
EP0706855B1 (fr) 2000-07-12
ES2149929T3 (es) 2000-11-16
ATE194536T1 (de) 2000-07-15

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