ATE182103T1 - Vorrichtung zum polieren eines halbleiters - Google Patents

Vorrichtung zum polieren eines halbleiters

Info

Publication number
ATE182103T1
ATE182103T1 AT95307203T AT95307203T ATE182103T1 AT E182103 T1 ATE182103 T1 AT E182103T1 AT 95307203 T AT95307203 T AT 95307203T AT 95307203 T AT95307203 T AT 95307203T AT E182103 T1 ATE182103 T1 AT E182103T1
Authority
AT
Austria
Prior art keywords
support
polishing pad
pad assembly
polishing
fluid
Prior art date
Application number
AT95307203T
Other languages
English (en)
Inventor
Homayoun Talieh
David Edwin Weldon
Boguslaw A Nagorski
Original Assignee
Ontrak Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/321,085 external-priority patent/US5593344A/en
Application filed by Ontrak Systems Inc filed Critical Ontrak Systems Inc
Application granted granted Critical
Publication of ATE182103T1 publication Critical patent/ATE182103T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT95307203T 1994-10-11 1995-10-11 Vorrichtung zum polieren eines halbleiters ATE182103T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/321,085 US5593344A (en) 1994-10-11 1994-10-11 Wafer polishing machine with fluid bearings and drive systems
US08/333,463 US5558568A (en) 1994-10-11 1994-11-02 Wafer polishing machine with fluid bearings

Publications (1)

Publication Number Publication Date
ATE182103T1 true ATE182103T1 (de) 1999-07-15

Family

ID=26982813

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95307203T ATE182103T1 (de) 1994-10-11 1995-10-11 Vorrichtung zum polieren eines halbleiters

Country Status (4)

Country Link
EP (1) EP0706857B1 (de)
JP (1) JPH08195363A (de)
AT (1) ATE182103T1 (de)
DE (1) DE69510745T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961372A (en) * 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
US5886535A (en) * 1996-11-08 1999-03-23 W. L. Gore & Associates, Inc. Wafer level burn-in base unit substrate and assembly
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad
US6062959A (en) * 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
US6336845B1 (en) * 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6068539A (en) 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
US7204924B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Method and apparatus to deposit layers with uniform properties
US6413388B1 (en) 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US7141146B2 (en) 2000-02-23 2006-11-28 Asm Nutool, Inc. Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US6729945B2 (en) 2001-03-30 2004-05-04 Lam Research Corporation Apparatus for controlling leading edge and trailing edge polishing
US6991512B2 (en) * 2001-03-30 2006-01-31 Lam Research Corporation Apparatus for edge polishing uniformity control
US6939212B1 (en) 2001-12-21 2005-09-06 Lam Research Corporation Porous material air bearing platen for chemical mechanical planarization
US6790128B1 (en) 2002-03-29 2004-09-14 Lam Research Corporation Fluid conserving platen for optimizing edge polishing
US6769970B1 (en) 2002-06-28 2004-08-03 Lam Research Corporation Fluid venting platen for optimizing wafer polishing
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
CN112975721B (zh) * 2021-03-10 2022-04-22 江苏特丽亮镀膜科技有限公司 金属件表面抛光系统及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US529732A (en) 1894-11-27 Cravat
DE3411120A1 (de) * 1983-03-26 1984-11-08 TOTO Ltd., Kitakyushyu, Fukuoka Laeppvorrichtung
JPS59232768A (ja) * 1983-06-16 1984-12-27 Kanebo Ltd 平面研磨装置
JPS63200965A (ja) * 1987-02-12 1988-08-19 Fujitsu Ltd ウエ−ハ研磨装置
US4811522A (en) 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
JPS63251166A (ja) * 1987-04-07 1988-10-18 Hitachi Ltd ウエハチヤツク
JPH0811356B2 (ja) * 1989-04-06 1996-02-07 ロデール・ニッタ株式会社 ポリッシング方法およびポリッシング装置
DE69206685T2 (de) 1991-06-06 1996-07-04 Commissariat Energie Atomique Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf
FR2677276B1 (fr) 1991-06-06 1995-12-01 Commissariat Energie Atomique Machine de polissage a table porte-echantillon perfectionnee.
JP3334139B2 (ja) * 1991-07-01 2002-10-15 ソニー株式会社 研磨装置
US5287663A (en) 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers

Also Published As

Publication number Publication date
EP0706857B1 (de) 1999-07-14
DE69510745T2 (de) 1999-12-09
JPH08195363A (ja) 1996-07-30
EP0706857A1 (de) 1996-04-17
DE69510745D1 (de) 1999-08-19

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties