DE69939458D1 - Halbleiterbearbeitungsvorrichtung - Google Patents

Halbleiterbearbeitungsvorrichtung

Info

Publication number
DE69939458D1
DE69939458D1 DE69939458T DE69939458T DE69939458D1 DE 69939458 D1 DE69939458 D1 DE 69939458D1 DE 69939458 T DE69939458 T DE 69939458T DE 69939458 T DE69939458 T DE 69939458T DE 69939458 D1 DE69939458 D1 DE 69939458D1
Authority
DE
Germany
Prior art keywords
supporting member
substrate
processing
vessel
processing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69939458T
Other languages
English (en)
Inventor
Norio Maeda
Masao Oono
Hiroshi Aihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Toho Kasei Co Ltd
Original Assignee
Daikin Industries Ltd
Toho Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18425115&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69939458(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Daikin Industries Ltd, Toho Kasei Co Ltd filed Critical Daikin Industries Ltd
Application granted granted Critical
Publication of DE69939458D1 publication Critical patent/DE69939458D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polarising Elements (AREA)
DE69939458T 1998-12-11 1999-12-13 Halbleiterbearbeitungsvorrichtung Expired - Fee Related DE69939458D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35259398A JP3364620B2 (ja) 1998-12-11 1998-12-11 基板処理装置
PCT/JP1999/006998 WO2000036644A1 (fr) 1998-12-11 1999-12-13 Dispositif de traitement de plaquettes

Publications (1)

Publication Number Publication Date
DE69939458D1 true DE69939458D1 (de) 2008-10-16

Family

ID=18425115

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69939458T Expired - Fee Related DE69939458D1 (de) 1998-12-11 1999-12-13 Halbleiterbearbeitungsvorrichtung

Country Status (8)

Country Link
US (1) US6589386B1 (de)
EP (1) EP1045439B1 (de)
JP (1) JP3364620B2 (de)
KR (1) KR100720992B1 (de)
AT (1) ATE407450T1 (de)
DE (1) DE69939458D1 (de)
TW (1) TW555147U (de)
WO (1) WO2000036644A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3174038B2 (ja) * 1999-01-18 2001-06-11 東邦化成株式会社 基板乾燥方法およびその装置
JP3802446B2 (ja) * 2002-05-15 2006-07-26 東邦化成株式会社 基板乾燥方法およびその装置
KR101009643B1 (ko) * 2008-07-16 2011-01-19 삼성모바일디스플레이주식회사 기판 에칭 장치
CN102029273B (zh) 2009-10-05 2015-09-16 东京毅力科创株式会社 超声波清洗装置、超声波清洗方法
TWI490931B (zh) * 2009-10-05 2015-07-01 Tokyo Electron Ltd 超音波清洗裝置、超音波清洗方法、及記錄有用來執行此超音波清洗方法之電腦程式的記錄媒體
JP5450309B2 (ja) * 2009-10-05 2014-03-26 東京エレクトロン株式会社 超音波洗浄装置、超音波洗浄方法、およびこの超音波洗浄方法を実行するためのコンピュータプログラムが記録された記録媒体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2733771B2 (ja) * 1988-07-29 1998-03-30 日本テキサス・インスツルメンツ株式会社 液体による処理装置
JP2574411B2 (ja) * 1988-08-09 1997-01-22 富士通株式会社 純水引き上げ乾燥用支持方法
JPH0345636U (de) * 1989-09-11 1991-04-26
JP3165435B2 (ja) * 1990-11-17 2001-05-14 東京エレクトロン株式会社 洗浄装置
DE4040131A1 (de) * 1990-12-15 1992-06-17 Semax Gmbh Verfahren zum trocknen von scheiben
JPH04349626A (ja) * 1991-05-27 1992-12-04 Toshiba Corp 半導体基板の引き上げ方法および引き上げ装置
JPH0536668A (ja) * 1991-07-30 1993-02-12 Toshiba Corp 半導体基板乾燥方法
JP3325135B2 (ja) * 1994-11-22 2002-09-17 大日本スクリーン製造株式会社 基板処理装置およびそれに用いられる処理槽
JPH1022256A (ja) 1996-07-05 1998-01-23 Tokyo Electron Ltd 洗浄・乾燥処理装置及び洗浄・乾燥処理方法
JP3043709B2 (ja) * 1997-11-19 2000-05-22 株式会社カイジョー 基板の乾燥装置
JP2962705B1 (ja) * 1998-04-27 1999-10-12 株式会社ダン科学 基板の乾燥装置および乾燥方法
JPH11345798A (ja) * 1998-06-01 1999-12-14 Daikin Ind Ltd 被洗浄体処理方法およびその装置

Also Published As

Publication number Publication date
EP1045439A1 (de) 2000-10-18
EP1045439A4 (de) 2007-01-10
TW555147U (en) 2003-09-21
EP1045439B1 (de) 2008-09-03
JP3364620B2 (ja) 2003-01-08
US6589386B1 (en) 2003-07-08
KR100720992B1 (ko) 2007-05-22
WO2000036644A1 (fr) 2000-06-22
ATE407450T1 (de) 2008-09-15
KR20010040938A (ko) 2001-05-15
JP2000183134A (ja) 2000-06-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee