ATE407450T1 - Halbleiterbearbeitungsvorrichtung - Google Patents

Halbleiterbearbeitungsvorrichtung

Info

Publication number
ATE407450T1
ATE407450T1 AT99959795T AT99959795T ATE407450T1 AT E407450 T1 ATE407450 T1 AT E407450T1 AT 99959795 T AT99959795 T AT 99959795T AT 99959795 T AT99959795 T AT 99959795T AT E407450 T1 ATE407450 T1 AT E407450T1
Authority
AT
Austria
Prior art keywords
supporting member
substrate
processing
vessel
processing apparatus
Prior art date
Application number
AT99959795T
Other languages
English (en)
Inventor
Norio Maeda
Masao Oono
Hiroshi Aihara
Original Assignee
Toho Kasei Ltd
Daikin Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18425115&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE407450(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toho Kasei Ltd, Daikin Ind Ltd filed Critical Toho Kasei Ltd
Application granted granted Critical
Publication of ATE407450T1 publication Critical patent/ATE407450T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
  • Polarising Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT99959795T 1998-12-11 1999-12-13 Halbleiterbearbeitungsvorrichtung ATE407450T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35259398A JP3364620B2 (ja) 1998-12-11 1998-12-11 基板処理装置

Publications (1)

Publication Number Publication Date
ATE407450T1 true ATE407450T1 (de) 2008-09-15

Family

ID=18425115

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99959795T ATE407450T1 (de) 1998-12-11 1999-12-13 Halbleiterbearbeitungsvorrichtung

Country Status (8)

Country Link
US (1) US6589386B1 (de)
EP (1) EP1045439B1 (de)
JP (1) JP3364620B2 (de)
KR (1) KR100720992B1 (de)
AT (1) ATE407450T1 (de)
DE (1) DE69939458D1 (de)
TW (1) TW555147U (de)
WO (1) WO2000036644A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3174038B2 (ja) * 1999-01-18 2001-06-11 東邦化成株式会社 基板乾燥方法およびその装置
JP3802446B2 (ja) * 2002-05-15 2006-07-26 東邦化成株式会社 基板乾燥方法およびその装置
KR101009643B1 (ko) * 2008-07-16 2011-01-19 삼성모바일디스플레이주식회사 기판 에칭 장치
JP5450309B2 (ja) * 2009-10-05 2014-03-26 東京エレクトロン株式会社 超音波洗浄装置、超音波洗浄方法、およびこの超音波洗浄方法を実行するためのコンピュータプログラムが記録された記録媒体
CN102029273B (zh) 2009-10-05 2015-09-16 东京毅力科创株式会社 超声波清洗装置、超声波清洗方法
TWI490931B (zh) * 2009-10-05 2015-07-01 Tokyo Electron Ltd 超音波清洗裝置、超音波清洗方法、及記錄有用來執行此超音波清洗方法之電腦程式的記錄媒體

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2733771B2 (ja) * 1988-07-29 1998-03-30 日本テキサス・インスツルメンツ株式会社 液体による処理装置
JP2574411B2 (ja) 1988-08-09 1997-01-22 富士通株式会社 純水引き上げ乾燥用支持方法
JPH0345636U (de) * 1989-09-11 1991-04-26
JP3165435B2 (ja) * 1990-11-17 2001-05-14 東京エレクトロン株式会社 洗浄装置
DE4040131A1 (de) * 1990-12-15 1992-06-17 Semax Gmbh Verfahren zum trocknen von scheiben
JPH04349626A (ja) 1991-05-27 1992-12-04 Toshiba Corp 半導体基板の引き上げ方法および引き上げ装置
JPH0536668A (ja) 1991-07-30 1993-02-12 Toshiba Corp 半導体基板乾燥方法
JP3325135B2 (ja) 1994-11-22 2002-09-17 大日本スクリーン製造株式会社 基板処理装置およびそれに用いられる処理槽
JPH1022256A (ja) * 1996-07-05 1998-01-23 Tokyo Electron Ltd 洗浄・乾燥処理装置及び洗浄・乾燥処理方法
JP3043709B2 (ja) 1997-11-19 2000-05-22 株式会社カイジョー 基板の乾燥装置
JP2962705B1 (ja) 1998-04-27 1999-10-12 株式会社ダン科学 基板の乾燥装置および乾燥方法
JPH11345798A (ja) 1998-06-01 1999-12-14 Daikin Ind Ltd 被洗浄体処理方法およびその装置

Also Published As

Publication number Publication date
DE69939458D1 (de) 2008-10-16
JP3364620B2 (ja) 2003-01-08
KR20010040938A (ko) 2001-05-15
WO2000036644A1 (fr) 2000-06-22
JP2000183134A (ja) 2000-06-30
TW555147U (en) 2003-09-21
EP1045439A1 (de) 2000-10-18
EP1045439B1 (de) 2008-09-03
US6589386B1 (en) 2003-07-08
EP1045439A4 (de) 2007-01-10
KR100720992B1 (ko) 2007-05-22

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Legal Events

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