TW325517B - Inspection device for terminals of a semiconductor package - Google Patents

Inspection device for terminals of a semiconductor package

Info

Publication number
TW325517B
TW325517B TW086103475A TW86103475A TW325517B TW 325517 B TW325517 B TW 325517B TW 086103475 A TW086103475 A TW 086103475A TW 86103475 A TW86103475 A TW 86103475A TW 325517 B TW325517 B TW 325517B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
terminals
inspection device
photographing
inspection
Prior art date
Application number
TW086103475A
Other languages
Chinese (zh)
Inventor
Tomikazu Tanuki
Takashi Kurihara
Takahiro Kamita
Naoshi Hamachi
Original Assignee
Komatsu Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Mfg Co Ltd filed Critical Komatsu Mfg Co Ltd
Application granted granted Critical
Publication of TW325517B publication Critical patent/TW325517B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

An inspection device for terminals of a semiconductor package, which is characterized in comprising: photographing means for photographing the packaging face of the semiconductor package at a specific elevation, and inspection means for inspecting the terminals of the semiconductor package by the photograph data taken from the photographing means.
TW086103475A 1996-05-20 1997-03-17 Inspection device for terminals of a semiconductor package TW325517B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12495396A JPH09304030A (en) 1996-05-20 1996-05-20 Instrument for inspecting terminal of semiconductor package

Publications (1)

Publication Number Publication Date
TW325517B true TW325517B (en) 1998-01-21

Family

ID=14898306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103475A TW325517B (en) 1996-05-20 1997-03-17 Inspection device for terminals of a semiconductor package

Country Status (3)

Country Link
JP (1) JPH09304030A (en)
TW (1) TW325517B (en)
WO (1) WO1997044634A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072898A (en) * 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6915006B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
DE60027175D1 (en) * 1999-07-13 2006-05-18 Beaty Elwin M METHOD AND APPARATUS FOR THE THREE-DIMENSIONAL INSPECTION OF ELECTRONIC COMPONENTS
KR19990078765A (en) * 1999-08-05 1999-11-05 김동걸 inspecting apparatus and method of ball grid array
JP2005340648A (en) * 2004-05-28 2005-12-08 Yamaha Motor Co Ltd Part recognition method, part recognition apparatus, surface mounter, and part inspection apparatus
DE102007002082B3 (en) * 2007-01-09 2008-07-10 Deutsches Zentrum für Luft- und Raumfahrt e.V. Detecting method for relative motions of two camera of stereo camera system, involves taking auxiliary picture of object from camera, where auxiliary line of sight of auxiliary pictures runs from line of sight of camera to another camera
JP2009276207A (en) * 2008-05-14 2009-11-26 Nikon Corp Surface defect inspection device
JP6122310B2 (en) * 2013-02-27 2017-04-26 ヴィスコ・テクノロジーズ株式会社 Inspection device
KR101725427B1 (en) * 2015-08-31 2017-04-11 (주)다원넥스뷰 Laser Soldering Device Having Height Adjustment Function
TWI735330B (en) * 2020-09-03 2021-08-01 由田新技股份有限公司 Sphere height measurement system and method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2969011B2 (en) * 1991-05-23 1999-11-02 日立電子株式会社 Appearance inspection device for soldering condition
JPH05180622A (en) * 1992-01-08 1993-07-23 Hitachi Ltd Position and attitude detecting apparatus

Also Published As

Publication number Publication date
WO1997044634A1 (en) 1997-11-27
JPH09304030A (en) 1997-11-28

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