TW325517B - Inspection device for terminals of a semiconductor package - Google Patents
Inspection device for terminals of a semiconductor packageInfo
- Publication number
- TW325517B TW325517B TW086103475A TW86103475A TW325517B TW 325517 B TW325517 B TW 325517B TW 086103475 A TW086103475 A TW 086103475A TW 86103475 A TW86103475 A TW 86103475A TW 325517 B TW325517 B TW 325517B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor package
- terminals
- inspection device
- photographing
- inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
An inspection device for terminals of a semiconductor package, which is characterized in comprising: photographing means for photographing the packaging face of the semiconductor package at a specific elevation, and inspection means for inspecting the terminals of the semiconductor package by the photograph data taken from the photographing means.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12495396A JPH09304030A (en) | 1996-05-20 | 1996-05-20 | Instrument for inspecting terminal of semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
TW325517B true TW325517B (en) | 1998-01-21 |
Family
ID=14898306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086103475A TW325517B (en) | 1996-05-20 | 1997-03-17 | Inspection device for terminals of a semiconductor package |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH09304030A (en) |
TW (1) | TW325517B (en) |
WO (1) | WO1997044634A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6915006B2 (en) | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6915007B2 (en) | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
ATE322665T1 (en) * | 1999-07-13 | 2006-04-15 | Beaty Elwin M | METHOD AND APPARATUS FOR THE THREE-DIMENSIONAL INSPECTION OF ELECTRONIC COMPONENTS |
KR19990078765A (en) * | 1999-08-05 | 1999-11-05 | 김동걸 | inspecting apparatus and method of ball grid array |
JP2005340648A (en) * | 2004-05-28 | 2005-12-08 | Yamaha Motor Co Ltd | Part recognition method, part recognition apparatus, surface mounter, and part inspection apparatus |
DE102007002082B3 (en) * | 2007-01-09 | 2008-07-10 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Detecting method for relative motions of two camera of stereo camera system, involves taking auxiliary picture of object from camera, where auxiliary line of sight of auxiliary pictures runs from line of sight of camera to another camera |
JP2009276207A (en) * | 2008-05-14 | 2009-11-26 | Nikon Corp | Surface defect inspection device |
JP6122310B2 (en) * | 2013-02-27 | 2017-04-26 | ヴィスコ・テクノロジーズ株式会社 | Inspection device |
KR101725427B1 (en) * | 2015-08-31 | 2017-04-11 | (주)다원넥스뷰 | Laser Soldering Device Having Height Adjustment Function |
TWI735330B (en) * | 2020-09-03 | 2021-08-01 | 由田新技股份有限公司 | Sphere height measurement system and method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2969011B2 (en) * | 1991-05-23 | 1999-11-02 | 日立電子株式会社 | Appearance inspection device for soldering condition |
JPH05180622A (en) * | 1992-01-08 | 1993-07-23 | Hitachi Ltd | Position and attitude detecting apparatus |
-
1996
- 1996-05-20 JP JP12495396A patent/JPH09304030A/en active Pending
-
1997
- 1997-03-17 TW TW086103475A patent/TW325517B/en active
- 1997-05-09 WO PCT/JP1997/001561 patent/WO1997044634A1/en active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
JPH09304030A (en) | 1997-11-28 |
WO1997044634A1 (en) | 1997-11-27 |
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