MY125740A - Method and apparatus for processing an array of packaged semiconductor devices - Google Patents

Method and apparatus for processing an array of packaged semiconductor devices

Info

Publication number
MY125740A
MY125740A MYPI20030538A MYPI20030538A MY125740A MY 125740 A MY125740 A MY 125740A MY PI20030538 A MYPI20030538 A MY PI20030538A MY PI20030538 A MYPI20030538 A MY PI20030538A MY 125740 A MY125740 A MY 125740A
Authority
MY
Malaysia
Prior art keywords
array
processing
semiconductor devices
packaged semiconductor
mounting means
Prior art date
Application number
MYPI20030538A
Inventor
Tsui Ching Man Stanley
Curito M Bilan Jr
Chow Lap Kei Eric
Original Assignee
Invensas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/083,177 external-priority patent/US6806725B2/en
Application filed by Invensas Corp filed Critical Invensas Corp
Publication of MY125740A publication Critical patent/MY125740A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
    • B65B35/10—Feeding, e.g. conveying, single articles
    • B65B35/16—Feeding, e.g. conveying, single articles by grippers
    • B65B35/18—Feeding, e.g. conveying, single articles by grippers by suction-operated grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
    • B65B35/56—Orientating, i.e. changing the attitude of, articles, e.g. of non-uniform cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B41/00—Supplying or feeding container-forming sheets or wrapping material
    • B65B41/12—Feeding webs from rolls
    • B65B41/16—Feeding webs from rolls by rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/10—Applying or generating heat or pressure or combinations thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

THE INVENTION PROVIDES A METHOD AND APPARATUS FOR PROCESSING AN ARRAY OF ELECTRONIC COMPONENTS (16). IT INVOLVES PROVIDING MOUNTING MEANS (12) TO MOUNT UNSINGULATED COMPONENTS ONTO THE MOUNTING MEANS (12),SINGULATING THE COMPONENTS TO PHYSICALLY SEPARATE THEM, AND TESTING THE SINGULATED ELECTRONIC COMPONENTS (16) FOR DEFECTS WHILST THEY ARE MOUNTED ON THE MOUNTING MEANS (12),AND WITHOUT REMOVAL THEREFROM. (FIGS.1A-C)
MYPI20030538A 2002-02-25 2003-02-17 Method and apparatus for processing an array of packaged semiconductor devices MY125740A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/083,177 US6806725B2 (en) 1992-08-05 2002-02-25 Method and apparatus for processing an array of packaged semiconductor devices

Publications (1)

Publication Number Publication Date
MY125740A true MY125740A (en) 2006-08-30

Family

ID=33476248

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20030538A MY125740A (en) 2002-02-25 2003-02-17 Method and apparatus for processing an array of packaged semiconductor devices

Country Status (4)

Country Link
KR (1) KR100563022B1 (en)
MY (1) MY125740A (en)
SG (1) SG106122A1 (en)
TW (1) TWI231553B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4642436B2 (en) * 2004-11-12 2011-03-02 リンテック株式会社 Marking method and protective film forming and dicing sheet
KR200451994Y1 (en) * 2008-10-30 2011-01-25 오유정 A baby carrying strap and knapsack
US9933479B2 (en) * 2015-11-11 2018-04-03 Spire Manufacturing Multi-die interface for semiconductor testing and method of manufacturing same

Also Published As

Publication number Publication date
KR100563022B1 (en) 2006-03-22
SG106122A1 (en) 2004-09-30
TW200421510A (en) 2004-10-16
TWI231553B (en) 2005-04-21
KR20030070552A (en) 2003-08-30

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