TW200421510A - Method and apparatus for processing an array of components - Google Patents

Abstract

The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.

Description

200421510

V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method and a device for processing an array of electronic components, and more particularly to an electronic device having a test and marking function for the subsequent processing of an array of classified components. element. The electronic component of the present invention is also two kinds of multi-variable devices. 'It is not limited to a chip wafer, a chip scale package (csp), or an approximate wafer size spherical format array ( chipsca 1 eba 1 1 gid array package; CSBGA). [Prior art]

In order to miniaturize the growth and demand of consumer electronic products (especially portable electronic devices), the size of semiconductor packages is continuously shrinking, and the size of die components is also shrinking at the same time. The number of pins must be increased. In order to realize that the driving die can increase the capacity of integrated eifeuit (1C) in a small package, an approximate wafer size packaging process has been developed "" soil scale package; CSP). At the same time, the micro-line pitch Spherical format array (Pitch baii grid array; FBGA) and miniature lead frame package (micr〇)

iead rr⑽e packages; MLF,) and other similar wafers & inch number of wheat = ground is used 'approximate wafer size packaging process', said that the size increase after η 疋 9 package does not exceed 2 of the wafer size. %. ^ = In terms of assembly process (CSP), the challenge lies in testing the solidity and handling area of a thousand mouths. In the front-end process of a typical semiconductor device, a plurality of two

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The body circuit is called-ask L. The circle will be 祜 +, φ / sunday, such as the evening sun yen. When the integrated circuit is formed, the circle will be broken and cut into individual crystal grains. Then, these wafers will be picked out in the next group of ===; pieces, and the components marked ^ 払 S are defective, and only the positive # f pieces can continue to the next process. ^-There is a properly formed element. I know this artisan. The formation of other process work pieces requires many. This i. 2 ί # The circuit is implemented in a special related program; the parent term of Π must be accurately controlled and monitored in order to facilitate the control and monitoring of the integrated circuit. The missing component of the integrated circuit component: 袁 元: & ' Detect the defects of integrated circuits as early as possible, and can prevent the unnecessary production of defective electronic: Generally, after manufacturing integrated circuit components on a wafer and before cutting the wafer, test the integrated circuit components on the wafer. Then, the wafer will be electrically connected to the substrate by the pads of the individual wafers in the subsequent process to form a micro-pitch ball-shaped array array (FBGA) and electrical connections. Individual electrical circuits to the lead frame are faded in two rows of miniature lead frame packaging process (MLP). This process is the wire bonding process. This is traditionally done using a gold wire of 25 mu mu. The subsequent process steps are to protect the element from external influences. It is performed by a laser-markable plastic molding compound with a laser mark 200421510.

A tablet molding process with a base plate for electronic components, as disclosed in US Patent No. 753 863. ’’ ’In the next successive process operation, this wafer is cut and divided into individual wafers to electrically insulate these individual crystals # 1 and then test these individual crystals M. Heretofore, 'integrated circuit wafers are usually individually tested and labeled after singulation. In the formation of wafers, if the general method of testing the electrical properties of electronic components is used, the testing and marking process is a very difficult and careful process. & Traditional tests require physical contact with input and output wires or signal paths, respectively. In addition, there is a need to reduce the processing time of electronic components and reduce the processing time and costs. The test operation generally requires physical contact between a plurality of independent contacts (balls or pads) on an electronic component and a plurality of test contacts (test contacts) packaged in a test contact housing (“μ contactor housing”). The test contacts are formed of metal materials and exist in the test contactor housing extension circuit to enter the interior. Test contacts may be a flexible mechanism: structure Second, each point of the test contact (test c〇ntacts) is electrically connected to the dielectric panel of the device within the contact housing (eontax t 〇rhusing), which guides the electrical test signal to the electronic component Extend to the contact (bal Is or pa (js)) of the test contacts that contact the electronic components outside the test contactor housing. Anyway, unless these devices are electrically Detect distinction, otherwise not

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It can be confirmed that these components are good products. And electrically distinguishing chips need to be distinguished by physical inspection by visual inspection or other independent tools. Individually test this electronic component on a test platform and determine if each device is faUed or passed. Based on the above situation, it is very difficult to not delay the process. The electronic components on a wafer can be tested for special electrical properties by sending and / or receiving signals through test contacts. Then, make a note of the electronic component that failed the test procedure so that when the component is diced on the wafer, the defective component will not be singled out and packaged.

-Traditional Japanese post assembly includes many independent processes or mechanized processes, which are specialized special equipment. Die Bonding, Wire Bonding, Molding, Ball Placement, Marking, Cutting

), Testing and packaging are examples of individual processes and equipment. The traditional back-end assembly and testing process is not limited to the production of small electronic components. The production of these devices requires a fully automated process, so automating and integrating these processes and preparations is beneficial to improving yield and efficiency. Reducing costs is also an important purpose of automation and 1-in-1. The implementation of the overall function achieves a method of reducing costs more than the progress of individual processes. In any case, making the above changes &% has developed a new sealing system that can handle seamless products. To meet the requirements of this new packaging process, an integrated independent mechanical system must have both testing and marking functions. [Summary of the Invention] #In the above background of the invention, in order to have a test and mark function, the present invention provides an electronic component with a test and mark function which can be used for

200421510 V. Description of the invention (5) Improving the yield and efficiency of the traditional process According to the above-mentioned prior art, one of the methods of the present invention and its device are used to test and process electronic components. This system provides simultaneous and efficient processing of electronic components. Array. $ And attack can be another object of the present invention is to improve a small array and increase the test output, and has the ability to cut files. In addition, according to one of the implementation methods of the present invention, the method of the present invention, the array method of 7C pieces, the steps include providing-solid: manufacturing independent sub-components, and then cutting these components in order; ：： Setting is fixed on this fixing device without removing Shitian ^ some components to find the defective elements in these independent components. Test step = hairpin: another implementation method of the fixing device of the present invention,-a kind for cutting the ;; Yuan = = 丄 electronic components and a test device to test that each two knife cutting device is fixed here Due to the shortcomings of 6 μ A Α pieces, many electronic elements and electronic components were divided and removed from the state, and many implementations were performed; ί; i :: The description in the examples, the present invention may There is something to add: understand that ΐ is only within the scope of the appended claims, and 2 ^ 亍. The above is only a preferred embodiment of the present invention. The present invention = limits the scope of the patent application of the present invention; all other equivalent changes or modifications made in the spirit of the present invention should be

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V. Description of the invention (6) It is included in the scope of the following patent applications. [Embodiment] ... Refer to figure _ (a), which is a shape of a fixing device on a support or a single frame 12, wherein a separate film (singulation film) or a carrier sheet (tape) 14 A mask has a viscous mixture, and the independent film (singulation fUm) or tape 14 is fixed by the support or the single frame 12. The carrier sheet 1 is a transparent film, and one side of the transparent film has a viscous compound, so that the transparent film can allow electronic components to adhere to its surface. A cassette on-loader (not shown on _ legend) 'It is used to carry an array of strips of uncut electronic components 16. This uncut electronic component 丨The wafer of 6 is completely carried on a carrier sheet (tape) 14. An array of uncut electronic components 16 is fixed on a carrier sheet j 4. The carrier sheet 14 is supported by a single frame 12. The single frame 12 may include stainless steel. Ring. A micro-porous air-permeable aluminum plate (same as Portec METAPORR Fl〇〇AL plate) with gas-permeable micro-porous, which is used in a vacuum table v acuu 丨 1 丨 〔: 丨 丨丨) 2〗 / 22 on the surface, so as to provide suction on the surface; An array 16 for approximate chip size package (CSP) is placed on the adhesive side of an independent carrier sheet (tape) i 4. This array 16 will be cut. The electrical contacts of the array 16 are facing away from the carrier tape 1 4 so as to be tested through the contact points. In the

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5. Description of the invention (7) The right side of (a) is an enlarged view illustrating a cut array 16 for approximate wafer size sealing (CSP). Referring to the first figure, it is a single frame 12 and an array 18 for a ball-shaped array array package (CSBGA) of approximate wafer size. The array 18 is adhered to the independent carrier sheet 14. The electrical contact points (arrays) of the array 18 used for the approximate chip size spherical format array package (CSBGA) are facing away from the carrier sheet 14. On the right side of the first (b) figure, it illustrates an enlarged view of a cut-out array 18 for a chip size ball format array package (CSBGA). These exemplary arrays for the approximate chip size package (csp) and the approximate chip size ball format array package (CSBGA) are collectively referred to as "arrays of electronic components" in the following description. Referring to the first (c) diagram, it is a single frame 12 placed on a vacuum chuck 21 so that the single frame 12 can be fixed by a single device in a single process in a front view. The electronic component M is placed on a carrier sheet, and a cutting blade (saw) 2 will regularly perform the cutting process along the cutting line of the array of electronic components j6. The reference to the first figure is not according to a preferred embodiment of the present invention at a test 4 position of a test handling apparatus 10 'The second figure includes a test head 2 G of a tester, a Schematic illustration of test contacts, φ contactor 24 and other components, and a cross-sectional view of the vacuum chuck 22 and XYZ-Theta platform 50 device 'its XYZ-Theta platform 50 can be used for vacuum table (vacuunl chuck) 22 moves in the linear and rotary axis directions. The XYZ-Theta platform 50 is used to move and position the electronic component 16 so that the electronic component 16 can be reached for testing

Page 11 200421510 V. Description of the invention (8), the position of turning and carving. A test contact 24 includes a socket having a plurality of contact pins 28. A contact board 60 is electrically connected to the contact pins 28 and the contact pins 28 at the back of the contact pins 28, and the contact pins (contac1: pin〇64) at the two ends are electrically connected to the contact board. (Contact board) 60 for electrical connection to a device interface board 66. Alignment pins 62 with fixing devices are used to align and fix contact pins 28. A driver Device interface board stiffener 68 is the _ cover used to complete this tester. Test head al ignment pins 70 and test head locking mechanisms 72 are used for The test contactor (testc ntactor) 2 4 and the tester (s test head) 26. The XYZ-Theta platform 50 includes a x-axis mount (x-axis mount) 52, y -Axis mount (y-axis mount) 54 and theta-mount (theta mount) 56 'whereby the electronic component 16 can position x, y, z and a rotation axis. Referring to the third figure, it is attached to the At the prepared engraving position, the electronic fan 1 δ is fixed to the cross-section of the cutting piece 1 4 藉 with an adhesive. Among them, the electronic component 1 ·· spring is on the vacuum chuck 22. An engraving device emits a laser beam 48 on the surface of an electronic component 16 with an engraving mark 4 9. The electronic component 16 is adhered to the adhesive side of the carrier sheet 14. The laser beam 48 may Through the carrier sheet 14, that is, the carrier sheet 14 is permeable to the laser beam 48 'to avoid absorbing the energy of the laser. The molding compound

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It is a substance for laser marking, such as U.S. Patent No. 4,753,863 (Moulding compound) can be applied to those disclosed on the electronic component 16. At the same time, the purpose of bringing the marker into electrical contact is to replace the opposite surface of the electrical contact surface of the conventional process. Therefore, according to the embodiment of the present invention, the single frame 12 is used. The main middle marking surface for the same side of the electronic component 16 acts on the electronic component j6. This can reduce unnecessary flipping steps. The marking step does not need to be reversed again ... The fourth diagram is a general description of the test processing device 10 according to this embodiment, which includes—eliminates 丨 4 $ Λ _ then 忒 position A, a flip position Β And a engraving position C. The present invention includes a filling machine with a single frame 12 having electronic components 16 (Shixian is not shown in the figure). After the electronic component 16 is cut by a cutting machine 20, it is loaded by the filling machine. The electronic component 16 is on the XYZ_Theta platform 50 = stage 22 located in the position b. -Positioning device 'system, including-image recognition vision system 42 (iraage recognition system; for example, Recognition System), which is a device for checking and confirming the position of the device' 1 can correct the position of the device. Each electronic component is confirmed by the image recognition vision system 42 and the corrected position. The back stage 50 together with the array of electronic components 16 is moved to a test position under the test contactor 24 to perform a test step. In order to be precise, the image recognition 4 vision system 4 2 will refer to an image stored in it to guide the system. Then, the XYZ-Theta platform 50 arranges the array of electronic components 16 according to the positioning of the imaging system and the test contactor 24 for testing. this

η 200421510 V. Description of the invention (10): ί == The head 2 6 is engaged with the test contactor 2 4 to facilitate the electrical contact between the two. Vacuum table (vacuum chuck) 22 in

Dind 9 «& will be raised so that the contact pins (contact 16's Chen component 16 are in electrical contact with each other. Then, the electronic components are placed, and the steps are marked to find any defective electronic components 1 6 Make sure that the image of this array has been obtained before the test step: the location of the two pieces 16. The above steps help to remove the defective electronic component 16 in the subsequent I spear. In the test of the electronic element and the 6 array, the test is performed by the pattern of the contact pin 28 in each step of testing the contact-teSt,) under each device. , "L column 1 so that adjacent electronic components 16 will not be measured at the same time Φ = 疋 1 a plurality of electronic components 16 in the adjacent form, independent: special: only: U 'in order to interfere, interference Or, the distortion-reduced minimum array of "children", 1 / 妾 stylus 28 will repeatedly move in this column under continuous conditions. After this r library-Ji, go back and move repeatedly to the even number of the array until the trial. Two: All columns and rows in the array are completed. ^. Μ · "^, a plurality of contact pins 28 are included in a plurality of tests, and the contact pins 28 can be connected with Each raised complex is tested. However, under any circumstances, it is better to test the two electronic components 16 that are not at the same time. # After marking the position of any defective electronic component 16, this vacuum is made of m-Theta platform 50 together with a single frame. 12. Carrier sheet "and electrical sub-port

200421510 V. Description of the invention (11) Move to the-flip device f (ir-Ung device),) 4〇〇 9 (Ό mechan1 ^ piece "with a sticky surface: = to make it adhere to the support + electronics The element 16 changes shape together; the bottom of the support piece is underneath. The non-contact surface of the electronic component 16 is used as a marking surface for laser beam irradiation. This surface is designated for electrical contact The other side of the surface. Because of the sticky nature of 14, the electronic component 16 can still be fixed on the carrier sheet η even if the single-frame i 2 is turned over. Then, XYZ-Theta platform 50 and the vacuum stage 22 The frame 12 and the element 16 will be moved to the engraving position c together, that is, below the laser marker (Usei ^ marker) 46. The main function of the laser marker device 46 is to identify the electronic component 16 after passing the test. Whether the product is marked as a good product, the steps, and the array of electronic components will be marked with the test results according to the test position transmitted by the test system. The laser beam 48 will be applied to the electronic component 16 by the laser beam 48 having a suitable intensity. Carving steps on the surface Among them, the laser beam 48 is generated from a shape that enhances the amplification of the light by the excitation radiation of the radiation energy. The laser beam 48 passes through the transparent independent carrier sheet 14 'without damage and burns the black of the electronic component The marking process is performed on the surface. The electronic components 丨 6 will be continuously adhered to the carrier 4 at all times. After the laser marking step at position C, the vacuum table 22 will be moved back to position B. Then, the image recognition vision system 42 is used to determine and indicate the position of each electronic component that has been marked with a defect.

Page 15 200421510 V. Description of the invention (12) — In the next process, the single frame 12 will be moved so that the non-defective electronic components 16 can be unloaded into a magazine. Electronic components 6 can also be removed by a pick-and-place device (not shown in the figure) or other unloading equipment, and can be stored in a carrier box or a storage bin. ’

The electronic component 16 can also include a "simple logic element, a simple memory element, a simple hybrid: a signal element or a memory element with a path for the input and output signals. This system and method can be further included in ^ The functions of various components are tested in time. This type of test processing equipment 10 can also: a cutting machine 20 to facilitate the cutting of an array of electronic components 16 on a single frame 12. The present invention can further include a loader (0n-1 〇ader) to load the electronic component 16 or manually load the electronic component 16 on the XYZ-Theta platform. Obviously, many corrections and differences are implemented in accordance with the above. Therefore, it is necessary to understand it in addition to the above in other embodiments in detail. It is not intended to limit the description of the examples included in the scope of the following patent applications under the spirit disclosed by the present invention, and the present invention may be beyond the description of the scope of the appended claims, The present invention may also broaden the scope of the above-mentioned patent application for only the preferred embodiments of the present invention; all other equivalent changes or modifications that have not been completed shall be applied.

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[Brief description of the drawing] L a) The arrangement diagram of the electronic components on the first to the first one, and display: = Don't:-the frame and the cutting knife of the carrier plate; Shown is a comparative test position i according to the present invention, including—a tester ’s tester and a schematic diagram of other component parts of a device, a tester, and a cross-sectional view of a test contactor and a platform. ; Eight dagger vacuum chucks and XYZ-Theta 1 0 test processing device 1 2 single frame, the third picture shows a table of electronic components that are fixed on the carrier plate at the engraved position of this device according to the present invention The fourth figure shows the individual beams according to the test, conversion, and engraving position. [Representative symbols of the main parts] In the preferred embodiment of the invention, there is a laser beam diagram with an electronic component and an attached surface for engraving ; In the preferred embodiment of Yuming, there is a measurement plan. 14 Carrier sheet 1 6 Electronic components, die-level packaging 18 die-level ball-shaped array 封 sealed 20 independent cutters 21/22 vacuum table 2 4 test contactor 2 6 tester test head 2 8 Contact pin 200421510 Schematic description 40 Reversing mechanism 42 Image recognition vision system 4 6 Laser marking equipment 48 Laser beam 4 9 Surface engraving mark 50 XYZ- Theta Platform 5 2 X-Shaft base 5 4 y-Shaft base 56 theta- Base 6 0 Contact plate 6 2 Combination pins 6 4 Contact pins with the same function at both ends 6 6 Drive interface panel 6 8 Drive interface panel reinforcement 7 0 Test head combination pin 72 Test head fixing device

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Claims (1)

200421510 VI. Scope of patent application1. A method for manufacturing a large array of electronic component arrays includes: The method of 'the manufacturing of an electronic component array provides a fixing device for fixing a non-independent independent electronic component array; cutting the non-independent independent components in sequence; Φ ^ ^. ^, The element array to separate the non-independent, the electronic element array to form a plurality of independent electronic components, in 1, the non-independent electronic component array has not been removed and fixed in a fixed device. ; And test each of the independent electronic components to distinguish defective electrical components. 2 · The method for manufacturing an array of electronic components as described in item 1 of the scope of the patent application, which further includes the step of marking the surface of each of the standing electronic components after the test and is still fixed on the fixing device. . 3. The method of manufacturing an electronic component array as described in item 2 of the scope of patent application, wherein the steps of cutting, testing and marking are completed on two or more process platforms. 4. The method for manufacturing an electronic component array as described in item 3 of the scope of patent application, including the step of moving the independent electronic component between the test and mark positions. δ · The method of manufacturing an electronic component array described in item 4 of the scope of the patent application, and item 4 described in item 4, and the arrangement of the electronic components before the test, and the positioning of the unique component array before the test is performed. The step of manufacturing an electronic component array for the position of the individual electronic components. 6 · The methods listed in item 2 and item 4 of the scope of patent application, wherein 200421510 The surface step uses a laser device that generates a laser beam. 7. The method for manufacturing an array of electronic components as described in item 6 of the scope of patent application ^, wherein the above-mentioned fixing device includes a transparent film of a laser carrier sheet with a sticky surface, wherein each of the independent electrons The component is fixed on the adhesive surface of the transparent film of the laser carrier sheet, and the laser device is used to mark each adhesive surface attached to the laser carrier sheet ^ the independent / stand-alone electronic component for marking step. / 8 · —A device for manufacturing an array of non-stand-alone electronic components, the device for manufacturing an array of non-stand-alone electronic components includes: A fixing device for fixing a plurality of electronic components; a dividing device for separating an array of the plurality of electronic components; a testing device for testing each of the plurality of electronic component defects, wherein when the plurality of electronic components are fixed at When the fixture is not removed, one of the plurality of electronic components is divided into a spot and a current test step. 9. The equipment for manufacturing an array of non-independent electronic components as described in item 8 of the scope of patent application, further comprising a engraving device to mark each of the plurality of electric + yuan ', wherein the plurality of electronic components are fixed At the fixed installation. ^ 10. The device for manufacturing an array of non-stand-alone electronic components as described in item 8 or 9 of the scope of patent application, wherein the division, test and marking are performed on two or more workstations. 11 · Manufacturing of non-independent electronic components as described in item 丨 0 of the scope of patent application 200421510 6. Scope of patent application The device of the array further includes a device capable of moving the plurality of electronic components at least between the testing and marking positions. 1 2 · The device for manufacturing an array of non-independent electronic components as described in item 丨 丨 of the patent application scope, wherein the above-mentioned moving device moves the plurality of electronic components on a linear and rotary axis, such as a χγZ-Theta platform. 1 3 · _ The device for manufacturing an array of non-independent electronic το pieces as described in claims 8 to 12 of the scope of patent application, wherein the above-mentioned fixing device includes a thin film with adhesiveness on one side, and the film is pulled Extended on a support frame, wherein the plurality of electronic components are fixed on the adhesive side of the film 〇1 4 · The device for manufacturing an array of non-independent electronic components as described in item No. 丨 3 of the patent application scope, which includes a vacuum table having a position for holding the support frame and the film, wherein, during the division, testing and marking During this, the plurality of electronic components are fixed on the film. 1 5 · The device for manufacturing an array of 70 independent electronic devices as described in item 8 to item 14 of the scope of patent application, which includes a positioning device to adjust the arrangement of the plurality of electronic components and / or indicate a defect Of its components. 1 6 · Manufacture of non-independent electronic components as described in item 5 of the scope of patent application 1 dry prostitutes, in which the positioning device is an image recognition vision system. 17. The equipment for manufacturing an array of non-independent electronic components as described in items 9 to 12 of the scope of the patent application, wherein the above-mentioned engraving device is a device that generates a laser beam to heat and mark the surface of the electronic component. Laser device. 1 8 · The manufacturing of non-independent electronic components as described in item 17 of the scope of patent application Page 21 200421510 Page 22