KR960700864A - 폴리싱 장치 및 방법(Apparatus and method for polishing) - Google Patents

폴리싱 장치 및 방법(Apparatus and method for polishing) Download PDF

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Publication number
KR960700864A
KR960700864A KR1019950703296A KR19950703296A KR960700864A KR 960700864 A KR960700864 A KR 960700864A KR 1019950703296 A KR1019950703296 A KR 1019950703296A KR 19950703296 A KR19950703296 A KR 19950703296A KR 960700864 A KR960700864 A KR 960700864A
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KR
South Korea
Prior art keywords
workpiece
flat surface
semiconductor wafer
polishing pad
linear
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KR1019950703296A
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English (en)
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KR100286849B1 (ko
Inventor
윌리암 젠센 엘머
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윌리암 디. 버딩거
로델 인코포레이티드
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Publication of KR960700864A publication Critical patent/KR960700864A/ko
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Publication of KR100286849B1 publication Critical patent/KR100286849B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

본 발명은 내부의 폴리싱 패드(1)가 선형으로 되어 있는, 즉 폴리싱 패드가 폭에 비해 길다란 부분을 갖고 그 길이부분을 따라 균일한 횡단면을 갖는 반도체 웨이퍼(4)의 폴리싱 장치에 관한 것이다. 또한, 반도체 홀더(2)는 폴리싱 패드(1)의 긴 길이부분에 평행하게 직선으로 이동한다.

Description

폴리싱 장치 및 방법(Apparatus and method for polishing)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 캐리어내에 유지될 웨이퍼의 한 면을 폴리싱하고 선형 폴리싱 횡단하게 되어 있는 단일 캐리어를 갖는 폴리싱 장치를 도시하는 도면이며,
제2도는 캐리어내에 유지될 웨이퍼의 양면을 폴리싱하고 웨이퍼 캐리어의 양면 상에 위치되는 선형 폴리싱 패드를 횡단하게 되어 있는 단일 캐리어를 갖는 폴리싱 장치를 도시하는 도면이며,
제3도는 상부 폴리싱 패드와 분동이 제위치에 없는 제2도에 도시한 장치의 평면이다.

Claims (22)

  1. 균일한 횡단면과 상당히 긴 길이부분을 각각 갖는 하나 이상의 선형 폴리싱 패드와, 선형 폴리싱 패드에 의해 폴리실될 하나 이상의 공작물을 유지하고 선형 폴리싱 패드의 긴 길이부분에 평행하게 직선으로 이동하는 캐리어를 포함하는 것을 특징으로 하는 평탄면 폴리싱 장치.
  2. 제1항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  3. 제1항에 있어서, 캐리어는 캐리어의 이동 직선에 수직한 축선 주위에서 회전하는 것을 특징으로 하는 평탄면 폴리싱 장치.
  4. 제3항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  5. 제1항에 있어서 일정 압력으로 선형 폴리싱 패드에 대항하게 공작물을 유지하는 수단을 더 포함하는 것을 특징으로 하는 평탄면 폴리싱 장치.
  6. 제5항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  7. 제5항에 있어서, 선형 폴리싱 패드에 대항하게 공작물을 유지하는 압력은 조절 가능한 것을 특징으로 하는 평탄면 폴리싱 장치.
  8. 제7항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  9. 제1항에 있어서, 선형 폴리싱 패드의 횡단면을 직사각형인 것을 특징으로 하는 평탄면 폴리싱 장치.
  10. 제9항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  11. 제1항에 있어서, 공작물과 접촉하는 선형 폴리싱 패드의 표면은 곡선인 것을 특징으로 하는 평탄면 폴리싱 장치.
  12. 제11항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  13. 제11항에 있어서, 선형 폴리싱 패드는 새로운 패드면을 공작물에 연속적으로 노출시키도록 곡률 반경의 중심 주위로 이동되는 것을 특징으로 하는 평탄면 폴리싱 장치.
  14. 제13항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  15. 제1항에 있어서, 폴리싱 복합물이 선형 폴리싱 패드에 가해지는 것을 특징으로 하는 평탄면 폴리싱 장치.
  16. 제15항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  17. 제15항에 있어서, 폴리싱 복합물 슬러리인 것을 특징으로 하는 평탄면 폴리싱 장치.
  18. 제17항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 평탄면 폴리싱 장치.
  19. 선형 폴리싱 패드의 긴 길이부분을 공작물의 평탄표면에 평행하게 유지하면서 공작물의 평탄면을 선형폴리싱 패드 위로 통과시키는 단계를 포함하는 것을 특징으로 하는 공작물 평탄면의 폴리싱 방법.
  20. 제19항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 공작물 평탄면의 폴리싱 방법.
  21. 선형 폴리싱 패드의 긴 길이부분을 공작물의 평탄 표면에 평행하게 유지하면서 공작물의 평탄면을 선형 폴리싱 패드 위로 통과시킴으로써 폴리싱되는 것을 특징으로 하는 공작물.
  22. 제21항에 있어서, 공작물은 반도체 웨이퍼인 것을 특징으로 하는 공작물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950703296A 1993-02-09 1994-02-08 폴리싱 장치 및 방법 KR100286849B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US015,609 1993-02-09
US08/015,609 US5487697A (en) 1993-02-09 1993-02-09 Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
PCT/US1994/001574 WO1994017957A1 (en) 1993-02-09 1994-02-08 Apparatus and method for polishing
US15609 1996-04-18

Publications (2)

Publication Number Publication Date
KR960700864A true KR960700864A (ko) 1996-02-24
KR100286849B1 KR100286849B1 (ko) 2001-04-16

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KR1019950703296A KR100286849B1 (ko) 1993-02-09 1994-02-08 폴리싱 장치 및 방법

Country Status (5)

Country Link
US (1) US5487697A (ko)
EP (1) EP0683709A4 (ko)
JP (1) JP3120116B2 (ko)
KR (1) KR100286849B1 (ko)
WO (1) WO1994017957A1 (ko)

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Also Published As

Publication number Publication date
WO1994017957A1 (en) 1994-08-18
KR100286849B1 (ko) 2001-04-16
JPH09502931A (ja) 1997-03-25
EP0683709A1 (en) 1995-11-29
JP3120116B2 (ja) 2000-12-25
US5487697A (en) 1996-01-30
EP0683709A4 (en) 1996-01-17

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