DK0706855T3 - Maskine til polering af wafere - Google Patents

Maskine til polering af wafere

Info

Publication number
DK0706855T3
DK0706855T3 DK95307174T DK95307174T DK0706855T3 DK 0706855 T3 DK0706855 T3 DK 0706855T3 DK 95307174 T DK95307174 T DK 95307174T DK 95307174 T DK95307174 T DK 95307174T DK 0706855 T3 DK0706855 T3 DK 0706855T3
Authority
DK
Denmark
Prior art keywords
fluid
support
wafer
polishing pad
wafer holder
Prior art date
Application number
DK95307174T
Other languages
English (en)
Inventor
David Edwin Weldon
Boguslaw A Nagorski
Homayoun Talieh
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of DK0706855T3 publication Critical patent/DK0706855T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DK95307174T 1994-10-11 1995-10-11 Maskine til polering af wafere DK0706855T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/321,085 US5593344A (en) 1994-10-11 1994-10-11 Wafer polishing machine with fluid bearings and drive systems

Publications (1)

Publication Number Publication Date
DK0706855T3 true DK0706855T3 (da) 2000-11-06

Family

ID=23249121

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95307174T DK0706855T3 (da) 1994-10-11 1995-10-11 Maskine til polering af wafere

Country Status (7)

Country Link
US (2) US5593344A (da)
EP (1) EP0706855B1 (da)
JP (1) JP3672362B2 (da)
AT (1) ATE194536T1 (da)
DE (1) DE69517906T2 (da)
DK (1) DK0706855T3 (da)
ES (1) ES2149929T3 (da)

Families Citing this family (147)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961372A (en) * 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
JP2830907B2 (ja) * 1995-12-06 1998-12-02 日本電気株式会社 半導体基板研磨装置
US5800248A (en) * 1996-04-26 1998-09-01 Ontrak Systems Inc. Control of chemical-mechanical polishing rate across a substrate surface
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
JPH1034514A (ja) * 1996-07-24 1998-02-10 Sanshin:Kk 表面研磨加工方法及びその装置
US5722877A (en) * 1996-10-11 1998-03-03 Lam Research Corporation Technique for improving within-wafer non-uniformity of material removal for performing CMP
US6328642B1 (en) 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6059643A (en) * 1997-02-21 2000-05-09 Aplex, Inc. Apparatus and method for polishing a flat surface using a belted polishing pad
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US5975986A (en) * 1997-08-08 1999-11-02 Speedfam-Ipec Corporation Index table and drive mechanism for a chemical mechanical planarization machine
US6080040A (en) * 1997-11-05 2000-06-27 Aplex Group Wafer carrier head with inflatable bladder and attack angle control for polishing
US5934974A (en) * 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
US6062959A (en) * 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6068539A (en) 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
US6292708B1 (en) * 1998-06-11 2001-09-18 Speedfam-Ipec Corporation Distributed control system for a semiconductor wafer processing machine
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
US6126527A (en) * 1998-07-10 2000-10-03 Aplex Inc. Seal for polishing belt center support having a single movable sealed cavity
US6273100B1 (en) 1998-08-27 2001-08-14 Micron Technology, Inc. Surface cleaning apparatus and method
US6439967B2 (en) * 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
JP2000127033A (ja) * 1998-10-27 2000-05-09 Speedfam-Ipec Co Ltd 研磨装置
US6602380B1 (en) 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6325706B1 (en) * 1998-10-29 2001-12-04 Lam Research Corporation Use of zeta potential during chemical mechanical polishing for end point detection
US6186865B1 (en) 1998-10-29 2001-02-13 Lam Research Corporation Apparatus and method for performing end point detection on a linear planarization tool
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6875085B2 (en) 1998-11-06 2005-04-05 Mosel Vitelic, Inc. Polishing system including a hydrostatic fluid bearing support
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US7204917B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US7204924B2 (en) * 1998-12-01 2007-04-17 Novellus Systems, Inc. Method and apparatus to deposit layers with uniform properties
US6902659B2 (en) * 1998-12-01 2005-06-07 Asm Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6103628A (en) 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6464571B2 (en) 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US7427337B2 (en) * 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6409904B1 (en) 1998-12-01 2002-06-25 Nutool, Inc. Method and apparatus for depositing and controlling the texture of a thin film
US6468139B1 (en) * 1998-12-01 2002-10-22 Nutool, Inc. Polishing apparatus and method with a refreshing polishing belt and loadable housing
US7578923B2 (en) * 1998-12-01 2009-08-25 Novellus Systems, Inc. Electropolishing system and process
US7425250B2 (en) * 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6589105B2 (en) 1998-12-01 2003-07-08 Nutool, Inc. Pad tensioning method and system in a bi-directional linear polisher
US6475070B1 (en) * 1999-02-04 2002-11-05 Applied Materials, Inc. Chemical mechanical polishing with a moving polishing sheet
US6244935B1 (en) 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6179709B1 (en) 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6241583B1 (en) 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6290585B1 (en) * 1999-02-26 2001-09-18 Fujikoshi Kikai Kogyo Kabushiki Kaisha Polishing machine
US6224461B1 (en) 1999-03-29 2001-05-01 Lam Research Corporation Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
US6296557B1 (en) * 1999-04-02 2001-10-02 Micron Technology, Inc. Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
EP1052063A1 (en) * 1999-05-03 2000-11-15 Applied Materials, Inc. System for chemical mechanical planarization
US6241585B1 (en) 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing
US6213855B1 (en) 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
US6328632B1 (en) * 1999-08-31 2001-12-11 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
US6406363B1 (en) 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
US7824244B2 (en) * 2007-05-30 2010-11-02 Corning Incorporated Methods and apparatus for polishing a semiconductor wafer
US6379216B1 (en) * 1999-10-22 2002-04-30 Advanced Micro Devices, Inc. Rotary chemical-mechanical polishing apparatus employing multiple fluid-bearing platens for semiconductor fabrication
US6626744B1 (en) 1999-12-17 2003-09-30 Applied Materials, Inc. Planarization system with multiple polishing pads
US6431959B1 (en) * 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6630059B1 (en) 2000-01-14 2003-10-07 Nutool, Inc. Workpeice proximity plating apparatus
US20060131177A1 (en) * 2000-02-23 2006-06-22 Jeffrey Bogart Means to eliminate bubble entrapment during electrochemical processing of workpiece surface
US20090020437A1 (en) * 2000-02-23 2009-01-22 Basol Bulent M Method and system for controlled material removal by electrochemical polishing
US7141146B2 (en) * 2000-02-23 2006-11-28 Asm Nutool, Inc. Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US6582579B1 (en) 2000-03-24 2003-06-24 Nutool, Inc. Methods for repairing defects on a semiconductor substrate
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6616801B1 (en) 2000-03-31 2003-09-09 Lam Research Corporation Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
US6428394B1 (en) 2000-03-31 2002-08-06 Lam Research Corporation Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed
US6402591B1 (en) 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6261959B1 (en) 2000-03-31 2001-07-17 Lam Research Corporation Method and apparatus for chemically-mechanically polishing semiconductor wafers
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
AU2001247428A1 (en) * 2000-04-19 2001-11-07 Nutool, Inc. Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate and layer structure made thereby
US20060118425A1 (en) * 2000-04-19 2006-06-08 Basol Bulent M Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6358118B1 (en) 2000-06-30 2002-03-19 Lam Research Corporation Field controlled polishing apparatus and method
US6500056B1 (en) 2000-06-30 2002-12-31 Lam Research Corporation Linear reciprocating disposable belt polishing method and apparatus
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6495464B1 (en) 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6520841B2 (en) 2000-07-10 2003-02-18 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet
US6419559B1 (en) 2000-07-10 2002-07-16 Applied Materials, Inc. Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
US7754061B2 (en) * 2000-08-10 2010-07-13 Novellus Systems, Inc. Method for controlling conductor deposition on predetermined portions of a wafer
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
US7077733B1 (en) * 2000-08-31 2006-07-18 Micron Technology, Inc. Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support
US6482072B1 (en) * 2000-10-26 2002-11-19 Applied Materials, Inc. Method and apparatus for providing and controlling delivery of a web of polishing material
US6722950B1 (en) 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US6773337B1 (en) 2000-11-07 2004-08-10 Planar Labs Corporation Method and apparatus to recondition an ion exchange polish pad
US6905526B1 (en) 2000-11-07 2005-06-14 Planar Labs Corporation Fabrication of an ion exchange polish pad
US6592439B1 (en) 2000-11-10 2003-07-15 Applied Materials, Inc. Platen for retaining polishing material
US20040170753A1 (en) * 2000-12-18 2004-09-02 Basol Bulent M. Electrochemical mechanical processing using low temperature process environment
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US7172497B2 (en) * 2001-01-05 2007-02-06 Asm Nutool, Inc. Fabrication of semiconductor interconnect structures
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6561870B2 (en) * 2001-03-30 2003-05-13 Lam Research Corporation Adjustable force applying air platen and spindle system, and methods for using the same
US6729945B2 (en) * 2001-03-30 2004-05-04 Lam Research Corporation Apparatus for controlling leading edge and trailing edge polishing
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
US6712679B2 (en) 2001-08-08 2004-03-30 Lam Research Corporation Platen assembly having a topographically altered platen surface
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US6645052B2 (en) * 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US6716093B2 (en) * 2001-12-07 2004-04-06 Lam Research Corporation Low friction gimbaled substrate holder for CMP apparatus
US6767428B1 (en) * 2001-12-20 2004-07-27 Lam Research Corporation Method and apparatus for chemical mechanical planarization
US6761626B2 (en) * 2001-12-20 2004-07-13 Lam Research Corporation Air platen for leading edge and trailing edge control
US6808442B1 (en) * 2001-12-20 2004-10-26 Lam Research Corporation Apparatus for removal/remaining thickness profile manipulation
US6939212B1 (en) 2001-12-21 2005-09-06 Lam Research Corporation Porous material air bearing platen for chemical mechanical planarization
AU2003248673A1 (en) * 2002-01-17 2003-09-16 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US6942546B2 (en) 2002-01-17 2005-09-13 Asm Nutool, Inc. Endpoint detection for non-transparent polishing member
US6857947B2 (en) 2002-01-17 2005-02-22 Asm Nutool, Inc Advanced chemical mechanical polishing system with smart endpoint detection
US6926589B2 (en) * 2002-03-22 2005-08-09 Asm Nutool, Inc. Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
WO2003079428A1 (en) * 2002-03-13 2003-09-25 Nutool, Inc. Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
US6790128B1 (en) 2002-03-29 2004-09-14 Lam Research Corporation Fluid conserving platen for optimizing edge polishing
US6939203B2 (en) * 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
US6726545B2 (en) * 2002-04-26 2004-04-27 Chartered Semiconductor Manufacturing Ltd. Linear polishing for improving substrate uniformity
US6769970B1 (en) 2002-06-28 2004-08-03 Lam Research Corporation Fluid venting platen for optimizing wafer polishing
US20050040049A1 (en) * 2002-09-20 2005-02-24 Rimma Volodarsky Anode assembly for plating and planarizing a conductive layer
US20070131563A1 (en) * 2003-04-14 2007-06-14 Asm Nutool, Inc. Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US20050118932A1 (en) * 2003-07-03 2005-06-02 Homayoun Talieh Adjustable gap chemical mechanical polishing method and apparatus
US7025660B2 (en) * 2003-08-15 2006-04-11 Lam Research Corporation Assembly and method for generating a hydrodynamic air bearing
US7648622B2 (en) * 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
US7153182B1 (en) 2004-09-30 2006-12-26 Lam Research Corporation System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing
EP3043377A1 (en) * 2004-11-01 2016-07-13 Ebara Corporation Polishing apparatus
KR100685744B1 (ko) * 2006-02-06 2007-02-22 삼성전자주식회사 플래튼 어셈블리, 웨이퍼 연마 장치 및 웨이퍼 연마 방법
EP1839695A1 (en) * 2006-03-31 2007-10-03 Debiotech S.A. Medical liquid injection device
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
US20090065365A1 (en) * 2007-09-11 2009-03-12 Asm Nutool, Inc. Method and apparatus for copper electroplating
US20110032587A1 (en) * 2009-03-20 2011-02-10 Absolute Imaging LLC System and Method for Autostereoscopic Imaging
US9457447B2 (en) 2011-03-28 2016-10-04 Ebara Corporation Polishing apparatus and polishing method
US20130217228A1 (en) 2012-02-21 2013-08-22 Masako Kodera Method for fabricating semiconductor device
US9358658B2 (en) 2013-03-15 2016-06-07 Applied Materials, Inc. Polishing system with front side pressure control
WO2017139236A1 (en) * 2016-02-08 2017-08-17 Applied Materials, Inc Systems, apparatus, and methods for chemical polishing
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
CN112157430B (zh) * 2020-08-24 2021-10-15 徐州洪硕矿山机械配件有限公司 铸铁热补焊装置

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US619399A (en) * 1899-02-14 Glass grinding and polishing machine
FR793997A (fr) * 1934-07-11 1936-02-05 Sperry Gyroscope Co Inc Perfectionnements aux paliers des instruments gyroscopiques et d'autres instruments sensibles
US3447306A (en) * 1966-09-16 1969-06-03 Barnes Drill Co Abrading machine
DE1907060A1 (de) * 1969-02-12 1970-09-03 Metabowerke Kg Bandschleifmaschine
US3753269A (en) * 1971-05-21 1973-08-21 R Budman Abrasive cloth cleaner
US3906678A (en) * 1972-09-14 1975-09-23 Buehler Ltd Automatic specimen polishing machine and method
SE419193B (sv) * 1979-04-25 1981-07-20 Bertil Jonasson Anordning vid en bladslipmaskin som omfattar minst ett slipaggregat vid vilket er anordnade slipdjupet paverkande anslagsorgan och minst ett tryckbord for anpressning av arbetstycket mot slipaggregatet och ...
US4347689A (en) * 1980-10-20 1982-09-07 Verbatim Corporation Method for burnishing
DE3411120A1 (de) * 1983-03-26 1984-11-08 TOTO Ltd., Kitakyushyu, Fukuoka Laeppvorrichtung
JPS59232768A (ja) * 1983-06-16 1984-12-27 Kanebo Ltd 平面研磨装置
US4593495A (en) * 1983-11-25 1986-06-10 Toshiba Machine Co., Ltd. Polishing machine
DE3479936D1 (en) * 1983-12-12 1989-11-02 Unisys Corp Air bearing for moving webs
DE3401462A1 (de) * 1984-01-17 1985-08-01 Johannsen, Hans-Peter, Dipl.-Ing., 3559 Battenberg Vorrichtung zum abstuetzen des umlaufenden schleifbandes einer breitbandschleifmaschine gegen ein werkstueck
CA1260717A (en) * 1984-08-29 1989-09-26 Clarence I. Steinback Abrasive surfacing machine
US4642943A (en) * 1985-11-21 1987-02-17 Taylor Jr Joseph R Belt abrading apparatus and method
JPS62162466A (ja) * 1986-01-09 1987-07-18 Rohm Co Ltd ウエハ用ラツピング装置
JPS63200965A (ja) * 1987-02-12 1988-08-19 Fujitsu Ltd ウエ−ハ研磨装置
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
JPS63251166A (ja) * 1987-04-07 1988-10-18 Hitachi Ltd ウエハチヤツク
JPS63267155A (ja) * 1987-04-24 1988-11-04 Babcock Hitachi Kk 研磨装置
DE3802561A1 (de) * 1988-01-28 1989-08-10 Josef Kusser Vorrichtung zur lagerung einer schwimmenden kugel
US4934102A (en) * 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
US4941293A (en) * 1989-02-07 1990-07-17 Ekhoff Donald L Flexible rocking mount with forward pivot for polishing pad
JPH0811356B2 (ja) * 1989-04-06 1996-02-07 ロデール・ニッタ株式会社 ポリッシング方法およびポリッシング装置
JP2525892B2 (ja) * 1989-04-06 1996-08-21 ロデール・ニッタ 株式会社 ポリッシング方法およびポリッシング装置
JPH049209A (ja) * 1990-04-25 1992-01-14 Toshiba Corp 超電導発電機用ダンパの製造方法
EP0486696B1 (en) * 1990-06-09 1995-11-22 Bando Kiko Co. Ltd. Surface grinder for glass plate
JP2516480B2 (ja) * 1990-12-28 1996-07-24 アミテック株式会社 ワイドベルトサンダ―機の踏圧装置
RU2007784C1 (ru) * 1991-04-16 1994-02-15 Рогов Владимир Викторович Способ полирования полупроводниковых пластин
FR2677291B1 (fr) * 1991-06-06 1995-12-15 Commissariat Energie Atomique Machine de polissage a controle de pression.
DE69206685T2 (de) * 1991-06-06 1996-07-04 Commissariat Energie Atomique Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf
FR2677276B1 (fr) * 1991-06-06 1995-12-01 Commissariat Energie Atomique Machine de polissage a table porte-echantillon perfectionnee.
JP3334139B2 (ja) * 1991-07-01 2002-10-15 ソニー株式会社 研磨装置
US5230184A (en) * 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5287663A (en) * 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5274964A (en) * 1992-08-19 1994-01-04 Abrasive Cleaning Systems, Inc. Dry abrasive belt cleaner
US5232875A (en) * 1992-10-15 1993-08-03 Micron Technology, Inc. Method and apparatus for improving planarity of chemical-mechanical planarization operations
US5487697A (en) * 1993-02-09 1996-01-30 Rodel, Inc. Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5399125A (en) * 1993-06-11 1995-03-21 Dozier; Robert L. Belt grinder
JPH07111256A (ja) * 1993-10-13 1995-04-25 Toshiba Corp 半導体製造装置
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor

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DE69517906D1 (de) 2000-08-17
JPH08195365A (ja) 1996-07-30
US5558568A (en) 1996-09-24
ES2149929T3 (es) 2000-11-16
JP3672362B2 (ja) 2005-07-20
EP0706855A2 (en) 1996-04-17
EP0706855A3 (en) 1996-07-31
EP0706855B1 (en) 2000-07-12
ATE194536T1 (de) 2000-07-15
DE69517906T2 (de) 2000-12-07
US5593344A (en) 1997-01-14

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