AU2003248673A1 - Advanced chemical mechanical polishing system with smart endpoint detection - Google Patents

Advanced chemical mechanical polishing system with smart endpoint detection

Info

Publication number
AU2003248673A1
AU2003248673A1 AU2003248673A AU2003248673A AU2003248673A1 AU 2003248673 A1 AU2003248673 A1 AU 2003248673A1 AU 2003248673 A AU2003248673 A AU 2003248673A AU 2003248673 A AU2003248673 A AU 2003248673A AU 2003248673 A1 AU2003248673 A1 AU 2003248673A1
Authority
AU
Australia
Prior art keywords
mechanical polishing
chemical mechanical
polishing system
endpoint detection
advanced chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003248673A
Inventor
Bulent M. Basol
Mukesh Desai
Bernard M. Frey
Bret E. Mcgrath
Homayoun Talieh
Tuan Truong
Efrain Velazquez
Yuchun Wang
Douglas Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/052,475 external-priority patent/US6908374B2/en
Priority claimed from US10/105,016 external-priority patent/US6926589B2/en
Priority claimed from US10/197,090 external-priority patent/US6722946B2/en
Priority claimed from US10/321,150 external-priority patent/US6942546B2/en
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2003248673A1 publication Critical patent/AU2003248673A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
AU2003248673A 2002-01-17 2003-01-17 Advanced chemical mechanical polishing system with smart endpoint detection Abandoned AU2003248673A1 (en)

Applications Claiming Priority (21)

Application Number Priority Date Filing Date Title
US10/052,475 US6908374B2 (en) 1998-12-01 2002-01-17 Chemical mechanical polishing endpoint detection
US10/052,475 2002-01-17
US36501602P 2002-03-12 2002-03-12
US60/365,016 2002-03-12
US10/105,016 2002-03-22
US10/105,016 US6926589B2 (en) 2002-03-22 2002-03-22 Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
US10/197090 2002-07-15
US10/197,090 US6722946B2 (en) 2002-01-17 2002-07-15 Advanced chemical mechanical polishing system with smart endpoint detection
US39711002P 2002-07-19 2002-07-19
US60/397,110 2002-07-19
US41457902P 2002-09-27 2002-09-27
US60/414,579 2002-09-27
US41754402P 2002-10-10 2002-10-10
US60/417,544 2002-10-10
US10/321,150 US6942546B2 (en) 2002-01-17 2002-12-17 Endpoint detection for non-transparent polishing member
US10/321,150 2002-12-17
US43610802P 2002-12-23 2002-12-23
US60/436,108 2002-12-23
US43670602P 2002-12-27 2002-12-27
US60/436,706 2002-12-27
PCT/US2003/001704 WO2003074228A1 (en) 2002-01-17 2003-01-17 Advanced chemical mechanical polishing system with smart endpoint detection

Publications (1)

Publication Number Publication Date
AU2003248673A1 true AU2003248673A1 (en) 2003-09-16

Family

ID=27792429

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003248673A Abandoned AU2003248673A1 (en) 2002-01-17 2003-01-17 Advanced chemical mechanical polishing system with smart endpoint detection

Country Status (5)

Country Link
EP (1) EP1472047A1 (en)
JP (1) JP2005525244A (en)
KR (1) KR20040081136A (en)
AU (1) AU2003248673A1 (en)
WO (1) WO2003074228A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010506407A (en) * 2006-10-03 2010-02-25 ケーエルエー−テンカー コーポレイション Pressure and / or shear force detection system
DE102007035266B4 (en) * 2007-07-27 2010-03-25 Siltronic Ag A method of polishing a substrate of silicon or an alloy of silicon and germanium
JP2010021391A (en) * 2008-07-11 2010-01-28 Sumco Corp Polishing method of silicon wafer
DE102008053610B4 (en) 2008-10-29 2011-03-31 Siltronic Ag Method for polishing both sides of a semiconductor wafer
DE102009030295B4 (en) 2009-06-24 2014-05-08 Siltronic Ag Method for producing a semiconductor wafer
DE102009051007B4 (en) 2009-10-28 2011-12-22 Siltronic Ag Method for polishing a semiconductor wafer
KR102059524B1 (en) * 2013-02-19 2019-12-27 삼성전자주식회사 Chemical mechanical polishing machine and polishing head assembly
JP6145334B2 (en) 2013-06-28 2017-06-07 株式会社荏原製作所 Substrate processing equipment
JP6430177B2 (en) * 2014-08-26 2018-11-28 株式会社荏原製作所 Buff processing module and processing device
CN108527095A (en) * 2018-03-02 2018-09-14 江苏锐升新材料有限公司 A kind of floor machining high-precision contact calibrating machine
KR102070152B1 (en) * 2018-03-23 2020-01-28 주식회사 비앤비테크놀러지 Valve module controlling positive pressure and negative pressure and wafer carrier apparatus for cmp process of semiconductor wafer or glass using the same
CN115401532A (en) * 2022-09-28 2022-11-29 苏州昊来顺精密制造有限公司 Aviation thin-wall part polishing process

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4142107A (en) * 1977-06-30 1979-02-27 International Business Machines Corporation Resist development control system
JPH07241764A (en) * 1994-03-04 1995-09-19 Fujitsu Ltd Polishing device and polishing method
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
US6228280B1 (en) * 1998-05-06 2001-05-08 International Business Machines Corporation Endpoint detection by chemical reaction and reagent
US6071818A (en) * 1998-06-30 2000-06-06 Lsi Logic Corporation Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material
US6117779A (en) * 1998-12-15 2000-09-12 Lsi Logic Corporation Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint
US6241585B1 (en) * 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing

Also Published As

Publication number Publication date
KR20040081136A (en) 2004-09-20
EP1472047A1 (en) 2004-11-03
JP2005525244A (en) 2005-08-25
WO2003074228A1 (en) 2003-09-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase