DE69937222D1 - Piezoelektrisches Mehrschichtelement - Google Patents

Piezoelektrisches Mehrschichtelement

Info

Publication number
DE69937222D1
DE69937222D1 DE69937222T DE69937222T DE69937222D1 DE 69937222 D1 DE69937222 D1 DE 69937222D1 DE 69937222 T DE69937222 T DE 69937222T DE 69937222 T DE69937222 T DE 69937222T DE 69937222 D1 DE69937222 D1 DE 69937222D1
Authority
DE
Germany
Prior art keywords
multilayer element
piezoelectric multilayer
piezoelectric
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937222T
Other languages
English (en)
Other versions
DE69937222T2 (de
Inventor
Mitsuru Sube
Yoshiaki Kohno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34200498A external-priority patent/JP2000174581A/ja
Priority claimed from JP34200598A external-priority patent/JP3334651B2/ja
Priority claimed from JP34200398A external-priority patent/JP3319413B2/ja
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE69937222D1 publication Critical patent/DE69937222D1/de
Publication of DE69937222T2 publication Critical patent/DE69937222T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/178—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
DE69937222T 1998-12-01 1999-12-01 Piezoelektrisches Mehrschichtelement Expired - Lifetime DE69937222T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP34200398 1998-12-01
JP34200498A JP2000174581A (ja) 1998-12-01 1998-12-01 積層型圧電共振子及びその製造方法
JP34200498 1998-12-01
JP34200598A JP3334651B2 (ja) 1998-12-01 1998-12-01 圧電トランス及びその製造方法
JP34200598 1998-12-01
JP34200398A JP3319413B2 (ja) 1998-12-01 1998-12-01 圧電アクチュエータ、圧電アクチュエータの製造方法及びインクジェットヘッド

Publications (2)

Publication Number Publication Date
DE69937222D1 true DE69937222D1 (de) 2007-11-15
DE69937222T2 DE69937222T2 (de) 2008-07-03

Family

ID=27341030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937222T Expired - Lifetime DE69937222T2 (de) 1998-12-01 1999-12-01 Piezoelektrisches Mehrschichtelement

Country Status (5)

Country Link
US (3) US6437488B1 (de)
EP (1) EP1006596B1 (de)
CN (1) CN1167143C (de)
DE (1) DE69937222T2 (de)
TW (1) TW432731B (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10121270A1 (de) * 2001-04-30 2003-02-06 Epcos Ag Passivierungsmaterial für ein elektrisches Bauteil sowie piezoelektrisches Bauteil in Vielschichtbauweise
JP3794292B2 (ja) * 2001-07-03 2006-07-05 株式会社村田製作所 圧電型電気音響変換器およびその製造方法
WO2004030113A1 (en) * 2002-09-27 2004-04-08 Innochips Technology Piezoelectric vibrator and fabricating method thereof
JP4635439B2 (ja) * 2003-02-12 2011-02-23 株式会社デンソー 積層型圧電体素子及びその製造方法
CN100470867C (zh) * 2003-09-04 2009-03-18 日本电气株式会社 压电陶瓷换能器及便携式设备
JP4419960B2 (ja) * 2003-10-31 2010-02-24 株式会社村田製作所 積層型抵抗素子
WO2005086247A1 (ja) * 2004-03-09 2005-09-15 Kyocera Corporation 積層型圧電素子とその製造方法
JP2005294761A (ja) * 2004-04-05 2005-10-20 Tdk Corp 積層型圧電素子
JP4803039B2 (ja) * 2005-01-06 2011-10-26 株式会社村田製作所 圧電アクチュエータの製造方法及び圧電アクチュエータ
KR100722370B1 (ko) * 2005-02-22 2007-05-29 주식회사 휴먼스캔 적층형 초음파 탐촉자 및 이의 제조방법
US7443020B2 (en) * 2005-02-28 2008-10-28 Texas Instruments Incorporated Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit
EP1898476B1 (de) * 2005-06-15 2014-11-19 Kyocera Corporation Mehrschichtiges piezoelektrisches element und auswurfvorrichtung damit
JP4885869B2 (ja) * 2005-09-29 2012-02-29 京セラ株式会社 積層型圧電素子およびこれを用いた噴射装置
JP2007312164A (ja) * 2006-05-19 2007-11-29 Hitachi Ltd 圧電薄膜共振器並びにそれを用いた高周波フィルタ及び高周波モジュール
JP4933554B2 (ja) * 2006-09-28 2012-05-16 京セラ株式会社 積層型圧電素子、これを用いた噴射装置及び燃料噴射システム、並びに積層型圧電素子の製造方法
DE102007003281A1 (de) * 2007-01-23 2008-07-24 Epcos Ag Piezoelektrischer Transformator und Transformatoranordnung
DE102007003280A1 (de) * 2007-01-23 2008-07-24 Epcos Ag Piezoelektrisches Bauelement
JP2008227076A (ja) * 2007-03-12 2008-09-25 Nec Electronics Corp 半導体装置
WO2008130011A1 (ja) * 2007-04-19 2008-10-30 Ngk Spark Plug Co., Ltd. 圧電磁器組成物及び圧電素子
DE102008029185A1 (de) 2008-06-19 2009-12-24 Epcos Ag Piezoelektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Kontaktes
WO2010004534A1 (en) * 2008-07-11 2010-01-14 Nxp B.V. Bulk acoustic wave resonator using acoustic reflector layers as inductive or capacitive circuit element
KR101326308B1 (ko) * 2011-02-11 2013-11-11 삼성전자주식회사 초음파 프로브
DE102012101606A1 (de) * 2011-10-28 2013-05-02 Epcos Ag ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED
US20130134838A1 (en) * 2011-11-28 2013-05-30 Qualcomm Mems Technologies, Inc. Piezoelectric mems transformer
FR2996080B1 (fr) * 2012-09-27 2016-01-15 Thales Sa Dispositif acoustique comprenant un cristal phononique reglable
WO2015060132A1 (ja) * 2013-10-22 2015-04-30 株式会社村田製作所 積層セラミック構造体及びその製造方法並びに圧電アクチュエータ
NL2012419B1 (en) * 2014-03-13 2016-01-06 Novioscan B V High voltage MEMS, and a portable ultrasound device comprising such a MEMS.
EP3035519B1 (de) * 2014-12-19 2018-02-21 Attocube Systems AG Elektromechanischer Aktuator
TWI624969B (zh) * 2015-10-09 2018-05-21 Ngk Spark Plug Co Ltd Piezoelectric element, piezoelectric actuator and piezoelectric transformer
JP6790366B2 (ja) * 2016-01-29 2020-11-25 ブラザー工業株式会社 液体吐出装置、及び、液体吐出装置の製造方法
EP3469630B1 (de) * 2016-06-14 2020-01-22 Koninklijke Philips N.V. Aktuatorvorrichtung mit elektroaktivem polymer und ansteuerungsverfahren
JP2020123664A (ja) * 2019-01-30 2020-08-13 Tdk株式会社 積層型圧電素子

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1164600A (en) * 1967-10-31 1969-09-17 Matsushita Electric Ind Co Ltd Piezo-Electric Transformer
JPS5885614A (ja) * 1981-11-18 1983-05-23 Nec Corp モノリシツクセラミツクフイルタ
US4564782A (en) * 1983-09-02 1986-01-14 Murata Manufacturing Co., Ltd. Ceramic filter using multiple thin piezoelectric layers
JPS6066882A (ja) * 1983-09-22 1985-04-17 Murata Mfg Co Ltd 圧電変位素子およびその分極方法
JPS6086880A (ja) * 1983-10-19 1985-05-16 Nec Corp 電歪効果素子
DE3930000A1 (de) * 1988-09-08 1990-03-15 Murata Manufacturing Co Varistor in schichtbauweise
US5045744A (en) * 1988-12-23 1991-09-03 Murata Mfg. Co. Energy-trapping-by-frequency-lowering-type piezoelectric-resonance device
IT1232029B (it) * 1989-03-06 1992-01-23 Juki Kk Metodo per la connessione di un tubo ad ugello di un ugello a getto di inchiostro con un elemento piezoelettrico
CA2013903A1 (en) * 1989-04-07 1990-10-07 Mitsui Chemicals, Inc. Laminated ceramic device and method of manufacturing the same
JPH0671103B2 (ja) 1989-04-07 1994-09-07 三井石油化学工業株式会社 積層型セラミック素子の製造方法
JP2504223B2 (ja) * 1989-10-11 1996-06-05 株式会社村田製作所 積層コンデンサの製造方法
DE68926166T2 (de) * 1989-11-14 1996-12-12 Battelle Memorial Institute Verfahren zur Herstellung einer piezoelektrischen Stapelantriebsvorrichtung
JP2965602B2 (ja) 1990-02-26 1999-10-18 日立金属株式会社 積層型変位素子
US5028831A (en) 1990-04-04 1991-07-02 Motorola, Inc. SAW reflectionless quarter-wavelength transducers
JPH04214686A (ja) * 1990-10-05 1992-08-05 Nec Corp 電歪効果素子
JP2987944B2 (ja) 1991-01-09 1999-12-06 セイコーエプソン株式会社 インクジェット式印字ヘッド
JP3185226B2 (ja) 1991-01-30 2001-07-09 株式会社村田製作所 圧電バイモルフ素子の駆動方法及び圧電バイモルフ素子
JPH0547591A (ja) 1991-08-09 1993-02-26 Murata Mfg Co Ltd 積層セラミツク電子部品の製造方法
JPH0567819A (ja) * 1991-09-10 1993-03-19 Nec Corp 圧電セラミツクトランス
JP3147964B2 (ja) 1992-01-21 2001-03-19 セイコーエプソン株式会社 積層形圧電変位素子ユニット及びインクジェット記録ヘッド
JP3363937B2 (ja) 1992-03-26 2003-01-08 日本碍子株式会社 弾性表面波フィルタ装置
CA2113787A1 (en) * 1993-01-29 1994-07-30 Nobuyuki Hamanaka Carbocyclic sulfonamides
US5610565A (en) * 1994-02-02 1997-03-11 Murata Manufacturing Co., Ltd. Composite LC device with a ground electrode not formed on the inductor parts
US5914556A (en) * 1994-09-09 1999-06-22 Murata Manufacturing Co., Ltd. Piezoelectric element and method of manufacturing the same
JPH08306984A (ja) 1995-05-11 1996-11-22 Tokin Corp 圧電トランス
JP3271517B2 (ja) * 1996-04-05 2002-04-02 株式会社村田製作所 圧電共振子およびそれを用いた電子部品
JP3266031B2 (ja) 1996-04-18 2002-03-18 株式会社村田製作所 圧電共振子およびそれを用いた電子部品
JP3608874B2 (ja) 1996-06-06 2005-01-12 株式会社日立メディコ 超音波探触子
JPH1084244A (ja) 1996-07-18 1998-03-31 Murata Mfg Co Ltd 圧電共振子およびそれを用いた電子部品
JPH10126203A (ja) 1996-08-27 1998-05-15 Murata Mfg Co Ltd 圧電共振子およびそれを用いた電子部品
JP2907153B2 (ja) 1996-10-17 1999-06-21 日本電気株式会社 圧電トランスおよびその製造方法
JPH10241993A (ja) 1997-02-27 1998-09-11 Tokin Corp 積層セラミック電子部品
DE69916344T2 (de) 1998-01-23 2005-05-12 Océ-Technologies B.V. Pizoelektrischer Betätiger für Tintenstrahldruckkopf
US6121718A (en) * 1998-03-31 2000-09-19 Acuson Corporation Multilayer transducer assembly and the method for the manufacture thereof
JP2000183683A (ja) * 1998-12-17 2000-06-30 Murata Mfg Co Ltd 厚み縦圧電共振子及び圧電共振部品
JP2001102646A (ja) 1999-09-28 2001-04-13 Tokin Ceramics Corp 積層型圧電セラミックス

Also Published As

Publication number Publication date
US7003858B2 (en) 2006-02-28
CN1167143C (zh) 2004-09-15
US6437488B1 (en) 2002-08-20
US20020135277A1 (en) 2002-09-26
DE69937222T2 (de) 2008-07-03
EP1006596A2 (de) 2000-06-07
CN1256522A (zh) 2000-06-14
EP1006596B1 (de) 2007-10-03
EP1006596A3 (de) 2004-09-22
US6735839B2 (en) 2004-05-18
TW432731B (en) 2001-05-01
US20040095042A1 (en) 2004-05-20

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