DE69934049D1 - Keramisches Mehrschichtheizelement - Google Patents

Keramisches Mehrschichtheizelement

Info

Publication number
DE69934049D1
DE69934049D1 DE69934049T DE69934049T DE69934049D1 DE 69934049 D1 DE69934049 D1 DE 69934049D1 DE 69934049 T DE69934049 T DE 69934049T DE 69934049 T DE69934049 T DE 69934049T DE 69934049 D1 DE69934049 D1 DE 69934049D1
Authority
DE
Germany
Prior art keywords
heating element
ceramic multilayer
multilayer heating
ceramic
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69934049T
Other languages
English (en)
Other versions
DE69934049T2 (de
Inventor
Shoji Kano
Ryouji Iwai
Kenji Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE69934049D1 publication Critical patent/DE69934049D1/de
Publication of DE69934049T2 publication Critical patent/DE69934049T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
DE69934049T 1998-06-11 1999-06-08 Keramisches Mehrschichtheizelement Expired - Lifetime DE69934049T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10179712A JPH11354260A (ja) 1998-06-11 1998-06-11 複層セラミックスヒータ
JP17971298 1998-06-11

Publications (2)

Publication Number Publication Date
DE69934049D1 true DE69934049D1 (de) 2007-01-04
DE69934049T2 DE69934049T2 (de) 2007-03-15

Family

ID=16070563

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934049T Expired - Lifetime DE69934049T2 (de) 1998-06-11 1999-06-08 Keramisches Mehrschichtheizelement

Country Status (4)

Country Link
US (1) US6242719B1 (de)
EP (1) EP0964433B1 (de)
JP (1) JPH11354260A (de)
DE (1) DE69934049T2 (de)

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US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6410172B1 (en) * 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
JP2001203257A (ja) * 2000-01-20 2001-07-27 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体
US6471913B1 (en) 2000-02-09 2002-10-29 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature
US6780374B2 (en) 2000-12-08 2004-08-24 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
EP1254477A2 (de) * 2000-02-09 2002-11-06 Semitool, Inc. Verfahren und vorrichtung zur verarbeitung eines mikroelektronischen werkstücks bei hohen temperaturen
JP4521083B2 (ja) * 2000-02-15 2010-08-11 株式会社ブリヂストン ヒータ用電極及び半導体製造装置
JP4637316B2 (ja) * 2000-02-24 2011-02-23 京セラ株式会社 筒状体を有するセラミックヒーター及びこれを用いた加熱装置
EP1280380A1 (de) * 2000-04-10 2003-01-29 Ibiden Co., Ltd. Keramische platte
JP4398064B2 (ja) * 2000-05-12 2010-01-13 日本発條株式会社 加熱装置
JP4697909B2 (ja) * 2000-05-25 2011-06-08 コバレントマテリアル株式会社 カーボンワイヤー発熱体封入ヒータ
JP2002289603A (ja) * 2001-03-28 2002-10-04 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP3963788B2 (ja) * 2002-06-20 2007-08-22 信越化学工業株式会社 静電吸着機能を有する加熱装置
US7106167B2 (en) * 2002-06-28 2006-09-12 Heetronix Stable high temperature sensor system with tungsten on AlN
KR100490537B1 (ko) * 2002-07-23 2005-05-17 삼성에스디아이 주식회사 가열용기와 이를 이용한 증착장치
KR100889758B1 (ko) * 2002-09-03 2009-03-20 삼성모바일디스플레이주식회사 유기박막 형성장치의 가열용기
JP4119211B2 (ja) * 2002-09-13 2008-07-16 日本碍子株式会社 加熱装置
US20040074898A1 (en) * 2002-10-21 2004-04-22 Mariner John T. Encapsulated graphite heater and process
US7608419B2 (en) * 2003-11-13 2009-10-27 California Institute Of Technology Method and apparatus for detecting and quantifying bacterial spores on a surface
US7372001B2 (en) * 2002-12-17 2008-05-13 Nhk Spring Co., Ltd. Ceramics heater
US20050022743A1 (en) * 2003-07-31 2005-02-03 Semiconductor Energy Laboratory Co., Ltd. Evaporation container and vapor deposition apparatus
JP3918806B2 (ja) * 2003-11-20 2007-05-23 住友電気工業株式会社 被加熱物載置用ヒータ部材及び加熱処理装置
SE0303619L (sv) * 2003-12-31 2005-06-07 Abb Ab Metod och anordning för val av och dimensionering av åtgärder vid instabilitet i ett elkraftsystem
US20060165994A1 (en) 2004-07-07 2006-07-27 General Electric Company Protective coating on a substrate and method of making thereof
JP4365766B2 (ja) * 2004-10-26 2009-11-18 京セラ株式会社 ウェハ支持部材とそれを用いた半導体製造装置
JP4435742B2 (ja) 2005-08-09 2010-03-24 信越化学工業株式会社 加熱素子
US20090139979A1 (en) * 2005-08-19 2009-06-04 Tokyo Electron Limited Placing table structure, method for manufacturing placing table structure and heat treatment apparatus
US9892941B2 (en) * 2005-12-01 2018-02-13 Applied Materials, Inc. Multi-zone resistive heater
KR101299495B1 (ko) * 2005-12-08 2013-08-29 신에쓰 가가꾸 고교 가부시끼가이샤 세라믹스 히터, 히터 급전 부품 및 세라믹스 히터의제조방법
US20070181065A1 (en) * 2006-02-09 2007-08-09 General Electric Company Etch resistant heater and assembly thereof
US20070221132A1 (en) * 2006-03-24 2007-09-27 General Electric Company Composition, coating, coated article, and method
DE102006016695A1 (de) * 2006-04-08 2007-10-11 Leister Process Technologies Elektrisches Heizelement
KR101329630B1 (ko) 2006-04-13 2013-11-14 신에쓰 가가꾸 고교 가부시끼가이샤 가열소자
JP4654153B2 (ja) 2006-04-13 2011-03-16 信越化学工業株式会社 加熱素子
US8168050B2 (en) * 2006-07-05 2012-05-01 Momentive Performance Materials Inc. Electrode pattern for resistance heating element and wafer processing apparatus
US20080009417A1 (en) * 2006-07-05 2008-01-10 General Electric Company Coating composition, article, and associated method
US20080006204A1 (en) * 2006-07-06 2008-01-10 General Electric Company Corrosion resistant wafer processing apparatus and method for making thereof
US20080142755A1 (en) * 2006-12-13 2008-06-19 General Electric Company Heater apparatus and associated method
US20080141938A1 (en) * 2006-12-13 2008-06-19 General Electric Company Processing apparatus, coated article and method
US7741584B2 (en) * 2007-01-21 2010-06-22 Momentive Performance Materials Inc. Encapsulated graphite heater and process
FR2912508B1 (fr) * 2007-02-12 2009-07-03 Commissariat Energie Atomique Sonde d'excitation thermique par contact, procede de fabrication et procede d'etalonnage de cette sonde.
US8809800B2 (en) * 2008-08-04 2014-08-19 Varian Semicoductor Equipment Associates, Inc. Ion source and a method for in-situ cleaning thereof
KR101120599B1 (ko) * 2008-08-20 2012-03-09 주식회사 코미코 세라믹 히터, 이의 제조 방법 및 이를 포함하는 박막 증착 장치
JP5603601B2 (ja) * 2010-01-15 2014-10-08 株式会社ブリヂストン ヒータユニット
JP2013004247A (ja) * 2011-06-15 2013-01-07 Shin Etsu Chem Co Ltd セラミックスヒーター
JP5915026B2 (ja) * 2011-08-26 2016-05-11 住友大阪セメント株式会社 温度測定用板状体及びそれを備えた温度測定装置
US10276410B2 (en) 2011-11-25 2019-04-30 Nhk Spring Co., Ltd. Substrate support device
US9153463B2 (en) * 2011-11-25 2015-10-06 Nhk Spring Co., Ltd. Substrate support device
US9719629B2 (en) * 2014-04-08 2017-08-01 Plansee Se Supporting system for a heating element and heating system
WO2016081513A1 (en) * 2014-11-17 2016-05-26 The Regents Of The University Of Colorado, A Body Corporate Catalyst, structures, reactors, and methods of forming same
KR101678099B1 (ko) * 2015-05-06 2016-11-22 (주)티티에스 히터
JP6927851B2 (ja) * 2017-10-30 2021-09-01 モメンティブ・クオーツ・ジャパン合同会社 ヒータおよびその製造方法
US10851458B2 (en) * 2018-03-27 2020-12-01 Lam Research Corporation Connector for substrate support with embedded temperature sensors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598024A (en) * 1984-09-28 1986-07-01 The United States Of America As Represented By The United States Department Of Energy Dispersion toughened ceramic composites and method for making same
JPH041675Y2 (de) * 1985-08-06 1992-01-21
US4943543A (en) * 1987-04-30 1990-07-24 Sandvik Aktiebolag Sintered ceramic materials
DE69130205T2 (de) * 1990-12-25 1999-03-25 Ngk Insulators Ltd Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben
US5350720A (en) * 1991-03-18 1994-09-27 Shin-Etsu Chemical Co., Ltd. Triple-layered ceramic heater
JP2804393B2 (ja) * 1991-07-31 1998-09-24 京セラ株式会社 セラミックヒータ
JP2642858B2 (ja) * 1993-12-20 1997-08-20 日本碍子株式会社 セラミックスヒーター及び加熱装置
TW444922U (en) * 1994-09-29 2001-07-01 Tokyo Electron Ltd Heating device and the processing device using the same

Also Published As

Publication number Publication date
EP0964433B1 (de) 2006-11-22
JPH11354260A (ja) 1999-12-24
EP0964433A3 (de) 2005-01-19
EP0964433A2 (de) 1999-12-15
DE69934049T2 (de) 2007-03-15
US6242719B1 (en) 2001-06-05

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Legal Events

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