DE69818642D1 - Anorganische elemente enthaltende, fotoempfindliche harzzusammensetzung und verfahren zur herstellung eines anorganischen musters - Google Patents
Anorganische elemente enthaltende, fotoempfindliche harzzusammensetzung und verfahren zur herstellung eines anorganischen mustersInfo
- Publication number
- DE69818642D1 DE69818642D1 DE69818642T DE69818642T DE69818642D1 DE 69818642 D1 DE69818642 D1 DE 69818642D1 DE 69818642 T DE69818642 T DE 69818642T DE 69818642 T DE69818642 T DE 69818642T DE 69818642 D1 DE69818642 D1 DE 69818642D1
- Authority
- DE
- Germany
- Prior art keywords
- photo
- producing
- resin composition
- composition containing
- sensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP00125298A JP4050370B2 (ja) | 1998-01-07 | 1998-01-07 | 無機質含有感光性樹脂組成物および無機パターン形成方法 |
PCT/JP1998/005984 WO1999035536A1 (fr) | 1998-01-07 | 1998-12-28 | Composition de resines photosensibles contenant des elements inorganiques et procede de formation d'un motif inorganique |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69818642D1 true DE69818642D1 (de) | 2003-11-06 |
Family
ID=11496273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69818642T Expired - Lifetime DE69818642D1 (de) | 1998-01-07 | 1998-12-28 | Anorganische elemente enthaltende, fotoempfindliche harzzusammensetzung und verfahren zur herstellung eines anorganischen musters |
Country Status (7)
Country | Link |
---|---|
US (1) | US6183935B1 (de) |
EP (1) | EP0965885B1 (de) |
JP (1) | JP4050370B2 (de) |
KR (1) | KR20000075988A (de) |
DE (1) | DE69818642D1 (de) |
TW (1) | TW557415B (de) |
WO (1) | WO1999035536A1 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4507350B2 (ja) * | 1999-05-07 | 2010-07-21 | 東レ株式会社 | 感光性ペーストおよびディスプレイ |
US6436605B1 (en) * | 1999-07-12 | 2002-08-20 | International Business Machines Corporation | Plasma resistant composition and use thereof |
EP1096313A1 (de) * | 1999-11-01 | 2001-05-02 | Kansai Research Institute, Inc. | Aktive Teilchen, photoempfindliche Harzzusammensetzung, und Verfahren zur Herstellung von Mustern |
JP2001194775A (ja) * | 1999-11-01 | 2001-07-19 | Kansai Research Institute | 活性粒子、感光性樹脂組成物及びパターン形成方法 |
JP2001194780A (ja) * | 2000-01-11 | 2001-07-19 | Nippon Sheet Glass Co Ltd | パターン膜被覆物品の製造方法および感光性組成物 |
US7265161B2 (en) | 2002-10-02 | 2007-09-04 | 3M Innovative Properties Company | Multi-photon reactive compositions with inorganic particles and method for fabricating structures |
JP4531238B2 (ja) * | 2000-10-18 | 2010-08-25 | パナソニック株式会社 | 感光性ペーストの製造方法ならびにそれから得られるプラズマディスプレイ用部材およびプラズマディスプレイ |
DE60142844D1 (de) * | 2000-10-31 | 2010-09-30 | Intel Corp | Positive lichtempfindliche harzzusammensetzung, prozess zu ihrer herstellung und halbleiterbauelemente |
US6534235B1 (en) | 2000-10-31 | 2003-03-18 | Kansai Research Institute, Inc. | Photosensitive resin composition and process for forming pattern |
KR100400238B1 (ko) * | 2000-11-02 | 2003-10-01 | 주식회사 루밴틱스 | 유브이 경화형 백라이트용 잉크 및 그 제조방법 |
JP4295937B2 (ja) * | 2000-12-05 | 2009-07-15 | 株式会社Kri | 活性成分及びそれを用いた感光性樹脂組成物 |
KR100784602B1 (ko) | 2000-12-05 | 2007-12-11 | 가부시끼가이샤 케이알아이 | 활성 성분 및 그것을 이용한 감광성 수지 조성물 |
US20030073042A1 (en) * | 2001-10-17 | 2003-04-17 | Cernigliaro George J. | Process and materials for formation of patterned films of functional materials |
US7033725B2 (en) * | 2001-11-30 | 2006-04-25 | Fuji Photo Film Co., Ltd. | Infrared-sensitive photosensitive composition |
US7232650B2 (en) * | 2002-10-02 | 2007-06-19 | 3M Innovative Properties Company | Planar inorganic device |
US20040131970A1 (en) * | 2003-01-07 | 2004-07-08 | Meagley Robert P. | Photodefinable polymers for semiconductor applications |
JP4501402B2 (ja) * | 2003-10-20 | 2010-07-14 | 三菱化学株式会社 | 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法 |
WO2006093057A1 (ja) * | 2005-03-01 | 2006-09-08 | Jsr Corporation | レジスト下層膜用組成物およびその製造方法 |
US7247419B2 (en) * | 2005-04-11 | 2007-07-24 | Az Electronic Materials Usa Corp. | Nanocomposite photosensitive composition and use thereof |
US7524606B2 (en) * | 2005-04-11 | 2009-04-28 | Az Electronic Materials Usa Corp. | Nanocomposite photoresist composition for imaging thick films |
WO2006126480A1 (ja) | 2005-05-23 | 2006-11-30 | Hitachi Chemical Company, Ltd. | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
NZ564175A (en) * | 2005-06-21 | 2010-03-26 | Akzo Nobel Nv | Process for modifying inorganic oxygen-containing particulate material, product obtained therefrom, and use thereof |
US8399558B2 (en) * | 2006-06-20 | 2013-03-19 | Nof Corporation | Inorganic-organic hybrid composition and use thereof |
CN101583674A (zh) * | 2006-09-15 | 2009-11-18 | 荷兰联合利华有限公司 | 包含单分散粒子的染色和/或印刷配制剂 |
KR100911889B1 (ko) * | 2007-07-16 | 2009-08-11 | 한국전기연구원 | 유무기 하이브리드 감광성 수지 조성물 및 이의 경화체를이용한 액정표시소자 |
JP5099382B2 (ja) * | 2007-11-29 | 2012-12-19 | 日産化学工業株式会社 | 3次元パターン形成材料 |
JP5425005B2 (ja) * | 2009-08-19 | 2014-02-26 | 日本電波工業株式会社 | 圧電部品及びその製造方法 |
JP5555323B2 (ja) * | 2010-08-13 | 2014-07-23 | 旭化成イーマテリアルズ株式会社 | 感光性シリコーン樹脂組成物 |
US20130105440A1 (en) * | 2011-11-01 | 2013-05-02 | Az Electronic Materials Usa Corp. | Nanocomposite negative photosensitive composition and use thereof |
WO2014041940A1 (ja) | 2012-09-14 | 2014-03-20 | 富士フイルム株式会社 | 硬化性組成物および画像形成方法 |
CN102929101B (zh) * | 2012-10-12 | 2016-12-21 | 昆山维信诺显示技术有限公司 | 一种导电光刻胶及使用该导电光刻胶的oled电极及制造方法 |
US10353293B2 (en) * | 2013-10-03 | 2019-07-16 | Hitachi Chemical Company, Ltd. | Photosensitive conductive film, conductive pattern formation method using same, and conductive pattern substrate |
US20220163889A1 (en) * | 2020-11-20 | 2022-05-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metallic photoresist patterning and defect improvement |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5311952A (en) | 1976-07-19 | 1978-02-02 | Kansai Paint Co Ltd | Manufacture of organic-inorganic composites |
JPS61223020A (ja) * | 1985-03-29 | 1986-10-03 | Toshiba Corp | 光硬化性エポキシ樹脂系組成物 |
JPS61261365A (ja) * | 1985-05-14 | 1986-11-19 | Nippon Oil Co Ltd | 光硬化性被覆組成物 |
GB8514895D0 (en) * | 1985-06-12 | 1985-07-17 | Batty P | Electric kettles |
EP0259812A3 (de) * | 1986-09-10 | 1990-01-31 | E.I. Du Pont De Nemours And Company | Anorganische Füllstoffe enthaltende photopolymerisierbare Zusammensetzungen |
DE3804765A1 (de) | 1988-02-16 | 1989-08-24 | Basf Ag | Lichtempfindliche, negativ arbeitende aufzeichnungsschicht |
US5032490A (en) | 1989-08-21 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Photosensitive aqueous developable copper conductor composition |
JP2719616B2 (ja) * | 1989-11-30 | 1998-02-25 | 日本電信電話株式会社 | 光硬化型精密接着剤 |
JPH05202146A (ja) * | 1991-12-27 | 1993-08-10 | I C I Japan Kk | 光硬化性樹脂組成物 |
JP2953200B2 (ja) | 1992-06-30 | 1999-09-27 | 日本板硝子株式会社 | 光記録用組成物、光記録用膜及び光記録方法 |
JP2948744B2 (ja) | 1995-03-28 | 1999-09-13 | 株式会社関西新技術研究所 | 感光性有機・無機複合体組成物、その製造方法および該組成物からなるフォトレジスト |
JP3830109B2 (ja) | 1996-02-20 | 2006-10-04 | 東京応化工業株式会社 | 絶縁蛍光体パターン形成用感光性ペースト組成物及び絶縁蛍光体パターンの形成方法 |
-
1998
- 1998-01-07 JP JP00125298A patent/JP4050370B2/ja not_active Expired - Fee Related
- 1998-12-28 DE DE69818642T patent/DE69818642D1/de not_active Expired - Lifetime
- 1998-12-28 WO PCT/JP1998/005984 patent/WO1999035536A1/ja not_active Application Discontinuation
- 1998-12-28 EP EP98961625A patent/EP0965885B1/de not_active Expired - Lifetime
- 1998-12-28 US US09/380,641 patent/US6183935B1/en not_active Expired - Fee Related
- 1998-12-28 KR KR1019997008074A patent/KR20000075988A/ko not_active Application Discontinuation
- 1998-12-30 TW TW087121851A patent/TW557415B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW557415B (en) | 2003-10-11 |
JP4050370B2 (ja) | 2008-02-20 |
KR20000075988A (ko) | 2000-12-26 |
US6183935B1 (en) | 2001-02-06 |
EP0965885A1 (de) | 1999-12-22 |
EP0965885A4 (de) | 2001-04-11 |
JPH11194491A (ja) | 1999-07-21 |
WO1999035536A1 (fr) | 1999-07-15 |
EP0965885B1 (de) | 2003-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: KRI, INC., KYOTO, JP |
|
8332 | No legal effect for de |