DE69810686D1 - Verfahren zum Abrichten eines Polierkissens. - Google Patents

Verfahren zum Abrichten eines Polierkissens.

Info

Publication number
DE69810686D1
DE69810686D1 DE69810686T DE69810686T DE69810686D1 DE 69810686 D1 DE69810686 D1 DE 69810686D1 DE 69810686 T DE69810686 T DE 69810686T DE 69810686 T DE69810686 T DE 69810686T DE 69810686 D1 DE69810686 D1 DE 69810686D1
Authority
DE
Germany
Prior art keywords
dressing
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69810686T
Other languages
English (en)
Other versions
DE69810686T2 (de
Inventor
Naoto Miyashita
Yoshihiro Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69810686D1 publication Critical patent/DE69810686D1/de
Application granted granted Critical
Publication of DE69810686T2 publication Critical patent/DE69810686T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE69810686T 1997-04-10 1998-04-09 Verfahren zum Abrichten eines Polierkissens. Expired - Lifetime DE69810686T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10680497A JP3676030B2 (ja) 1997-04-10 1997-04-10 研磨パッドのドレッシング方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69810686D1 true DE69810686D1 (de) 2003-02-20
DE69810686T2 DE69810686T2 (de) 2003-09-18

Family

ID=14443056

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69810686T Expired - Lifetime DE69810686T2 (de) 1997-04-10 1998-04-09 Verfahren zum Abrichten eines Polierkissens.

Country Status (5)

Country Link
US (2) US6241581B1 (de)
EP (1) EP0870577B1 (de)
JP (1) JP3676030B2 (de)
KR (1) KR100264756B1 (de)
DE (1) DE69810686T2 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3001054B1 (ja) * 1998-06-29 2000-01-17 日本電気株式会社 研磨装置及び研磨パッドの表面調整方法
WO2000024548A1 (fr) 1998-10-28 2000-05-04 Hitachi, Ltd. Dispositif de polissage et procede de fabrication de semi-conducteurs au moyen dudit dispositif
US20030199238A1 (en) 2000-01-18 2003-10-23 Shigeo Moriyama Polishing apparatus and method for producing semiconductors using the apparatus
US6372648B1 (en) * 1998-11-16 2002-04-16 Texas Instruments Incorporated Integrated circuit planarization method
JP4604727B2 (ja) * 1998-12-25 2011-01-05 日立化成工業株式会社 Ｃｍｐ研磨剤用添加液
JP4501694B2 (ja) * 1998-12-25 2010-07-14 日立化成工業株式会社 Ｃｍｐ研磨剤用添加液
EP1566421B1 (de) * 1998-12-25 2014-12-10 Hitachi Chemical Company, Ltd. CMP Poliermittel, flüssiger Zusatz für CMP Poliermittel und Verfahren zum Polieren eines Substrates
KR20010004982A (ko) * 1999-06-30 2001-01-15 김영환 반도체 소자의 산화막 연마용 슬러리 제조 방법
WO2001003886A1 (en) * 1999-07-09 2001-01-18 Speedfam-Ipec Corporation Method and apparatus for eliminating wear and grooving of workpiece carrier retaining element
JP3760064B2 (ja) * 1999-08-09 2006-03-29 株式会社日立製作所 半導体装置の製造方法及び半導体装置の平坦化加工装置
JP2001077060A (ja) * 1999-09-08 2001-03-23 Toshiba Corp 半導体装置の製造方法
JP2001274122A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置
US6752697B1 (en) * 2000-08-23 2004-06-22 Advanced Micro Devices, Inc. Apparatus and method for chemical mechanical polishing of a substrate
JP2002170792A (ja) * 2000-11-29 2002-06-14 Mitsubishi Electric Corp 研磨液供給装置及び研磨液供給方法、研磨装置及び研磨方法、並びに、半導体装置の製造方法
DE10162597C1 (de) * 2001-12-19 2003-03-20 Wacker Siltronic Halbleitermat Verfahren zur Herstellung beidseitig polierter Halbleiterscheiben
DE10241300A1 (de) * 2002-09-04 2004-03-18 Merck Patent Gmbh Ätzpasten für Siliziumoberflächen und -schichten
CN1720119A (zh) * 2003-01-15 2006-01-11 三菱麻铁里亚尔株式会社 软质材料加工用切削工具
US20040192178A1 (en) * 2003-03-28 2004-09-30 Barak Yardeni Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
JP2005217037A (ja) * 2004-01-28 2005-08-11 Asahi Sunac Corp 半導体ウェーハ用研磨パッドのコンディショニング方法
JP2005262406A (ja) * 2004-03-19 2005-09-29 Toshiba Corp 研磨装置および半導体装置の製造方法
US7070484B2 (en) * 2004-05-21 2006-07-04 Mosel Vitelic, Inc. Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry
KR100678303B1 (ko) * 2004-05-25 2007-02-02 동부일렉트로닉스 주식회사 화학 기계적 연마(ｃｍｐ) 패드 드레서 및 화학 기계적연마(ｃｍｐ) 장치
US20060211237A1 (en) * 2005-03-21 2006-09-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for planarizing gap-filling material
JP5444596B2 (ja) * 2007-08-31 2014-03-19 富士通セミコンダクター株式会社 半導体装置の製造方法
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
JP2011071303A (ja) * 2009-09-25 2011-04-07 Toshiba Corp 半導体装置の製造方法
CN102140030B (zh) * 2010-02-02 2013-01-23 中国科学院理化技术研究所 无需烧结制备高气孔率纳米晶碳化硅泡沫陶瓷的方法
KR101211138B1 (ko) * 2011-03-07 2012-12-11 이화다이아몬드공업 주식회사 연약패드용 컨디셔너 및 그 제조방법
JP5733623B2 (ja) * 2011-06-10 2015-06-10 国立大学法人九州大学 半導体装置の製造方法
JP2015500151A (ja) * 2011-12-16 2015-01-05 エルジー シルトロン インコーポレイテッド ウェハーの研磨装置及びウェハーの研磨方法
US20160236322A1 (en) * 2013-10-04 2016-08-18 Fujimi Incorporated Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56152562A (en) * 1980-04-24 1981-11-26 Fujitsu Ltd Grinder
EP0322721B1 (de) * 1987-12-29 1993-10-06 E.I. Du Pont De Nemours And Company Feine Polierzusammensetzung für Plaketten
JPH07237120A (ja) * 1994-02-22 1995-09-12 Nec Corp ウェーハ研磨装置
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
JP3278532B2 (ja) * 1994-07-08 2002-04-30 株式会社東芝 半導体装置の製造方法
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
JP3778594B2 (ja) * 1995-07-18 2006-05-24 株式会社荏原製作所 ドレッシング方法
JP3111892B2 (ja) * 1996-03-19 2000-11-27 ヤマハ株式会社 研磨装置
US5890951A (en) * 1996-04-15 1999-04-06 Lsi Logic Corporation Utility wafer for chemical-mechanical planarization
JP3507628B2 (ja) * 1996-08-06 2004-03-15 昭和電工株式会社 化学的機械研磨用研磨組成物
JP3679882B2 (ja) * 1997-02-07 2005-08-03 株式会社荏原製作所 研磨用クロスのドレッサー及びその製造方法
JPH10329007A (ja) * 1997-05-28 1998-12-15 Sony Corp 化学的機械研磨装置
JPH11188626A (ja) * 1997-12-26 1999-07-13 Narumi China Corp セラミックスドレス基板
US5941762A (en) * 1998-01-07 1999-08-24 Ravkin; Michael A. Method and apparatus for improved conditioning of polishing pads
US6123607A (en) * 1998-01-07 2000-09-26 Ravkin; Michael A. Method and apparatus for improved conditioning of polishing pads

Also Published As

Publication number Publication date
JP3676030B2 (ja) 2005-07-27
US6716087B2 (en) 2004-04-06
KR19980081281A (ko) 1998-11-25
KR100264756B1 (ko) 2000-09-01
EP0870577B1 (de) 2003-01-15
US6241581B1 (en) 2001-06-05
DE69810686T2 (de) 2003-09-18
EP0870577A3 (de) 1998-11-18
EP0870577A2 (de) 1998-10-14
JPH10286756A (ja) 1998-10-27
US20010029156A1 (en) 2001-10-11

Similar Documents

Publication Publication Date Title
DE69810686T2 (de) Verfahren zum Abrichten eines Polierkissens.
DE60133306D1 (de) Verfahren zum Abrichten eines Poliertuches
DE69908624D1 (de) Verfahren zum Abrasionspolieren
DE59814043D1 (de) Verfahren zum anisotropen ätzen von silizium
DE69827147D1 (de) Verfahren zum herstellen von einem polierkissen
DE4480510T1 (de) Vorrichtung zum Konditionieren von Polierkissen
DE69625962D1 (de) Verfahren und Vorrichtung zum Abrichten von Polierkissen
DE69813327D1 (de) Vorrichtung zum Filtern in Geschirrspülwaschmaschinen
DE60003835D1 (de) Verfahren zum schleifen von kurbelzapfen
DE69821149D1 (de) Vorrichtung zum Polieren
DE69718520T2 (de) Verfahren zum Schleifen von Verbundwerkstücken
DE69715321D1 (de) Verfahren und Vorrichtung zum Abrichten eines Poliertuches
DE59814371D1 (de) Verfahren zum Planarisieren
DE69403698D1 (de) Verfahren zum Polieren/Planieren von Diamanten
DE69508293D1 (de) Verfahren zum Polieren von Metallbändern
DE69504549D1 (de) Gerät zum Polieren von Wafers
DE69607123D1 (de) Gerät zum Polieren von Wafers
DE69522893D1 (de) Vorrichtung zum Entfernen von Nagellack
DE69930349D1 (de) Verfahren zum Mahlen von Silizium
DE69820328T2 (de) Schleifgerät zum Schleifen von Brillengläsern
DE69203441D1 (de) Verfahren zum wälzschleifen von kronrädern.
DE69722454D1 (de) Verfahren zum feinen von silicium
DE69805356T2 (de) Vorrichtung zum Polieren von Endflächen
DE69507135T2 (de) Verfahren zum geschmeidigmachen von textilien
DE69914113D1 (de) Verfahren zum Polieren von Werkstücken

Legal Events

Date Code Title Description
8364 No opposition during term of opposition